JPS52135673A - Resin composition for semiconductor sealing - Google Patents
Resin composition for semiconductor sealingInfo
- Publication number
- JPS52135673A JPS52135673A JP5226176A JP5226176A JPS52135673A JP S52135673 A JPS52135673 A JP S52135673A JP 5226176 A JP5226176 A JP 5226176A JP 5226176 A JP5226176 A JP 5226176A JP S52135673 A JPS52135673 A JP S52135673A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- semiconductor sealing
- semiconductor
- epoxy resin
- silane coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To improve moisture resistance and electric characteristics by the semiconductor-sealing composition composed of effective quantities of epoxy resin, curing agent, curing accelerator and inorganic filler as well as silane coupling agent and aryl tin.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5226176A JPS52135673A (en) | 1976-05-10 | 1976-05-10 | Resin composition for semiconductor sealing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5226176A JPS52135673A (en) | 1976-05-10 | 1976-05-10 | Resin composition for semiconductor sealing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52135673A true JPS52135673A (en) | 1977-11-12 |
Family
ID=12909813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5226176A Pending JPS52135673A (en) | 1976-05-10 | 1976-05-10 | Resin composition for semiconductor sealing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52135673A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3117960A1 (en) * | 1980-05-10 | 1982-03-25 | Matsushita Electric Works Ltd., Kadoma, Osaka | EPOXY RESIN COMPOSITION |
JPS60190418A (en) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | Liquid epoxy resin composition for sealing semiconductors |
JPH03211A (en) * | 1989-05-26 | 1991-01-07 | Matsushita Electric Works Ltd | Manufacture of epoxy resin forming material |
WO1995035336A1 (en) * | 1994-06-17 | 1995-12-28 | Kansai Paint Company, Limited | Thermosetting composition and method of forming topcoating film |
WO1999032566A1 (en) * | 1997-12-23 | 1999-07-01 | Ppg Industries Ohio, Inc. | Color-plus-clear composite coating composition containing tin catalysts |
-
1976
- 1976-05-10 JP JP5226176A patent/JPS52135673A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3117960A1 (en) * | 1980-05-10 | 1982-03-25 | Matsushita Electric Works Ltd., Kadoma, Osaka | EPOXY RESIN COMPOSITION |
JPS60190418A (en) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | Liquid epoxy resin composition for sealing semiconductors |
JPH03211A (en) * | 1989-05-26 | 1991-01-07 | Matsushita Electric Works Ltd | Manufacture of epoxy resin forming material |
WO1995035336A1 (en) * | 1994-06-17 | 1995-12-28 | Kansai Paint Company, Limited | Thermosetting composition and method of forming topcoating film |
US5821314A (en) * | 1994-06-17 | 1998-10-13 | Kansai Paint Company, Limited | Thermosetting compositions and methods of forming a finish coat |
WO1999032566A1 (en) * | 1997-12-23 | 1999-07-01 | Ppg Industries Ohio, Inc. | Color-plus-clear composite coating composition containing tin catalysts |
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