JPS52135673A - Resin composition for semiconductor sealing - Google Patents

Resin composition for semiconductor sealing

Info

Publication number
JPS52135673A
JPS52135673A JP5226176A JP5226176A JPS52135673A JP S52135673 A JPS52135673 A JP S52135673A JP 5226176 A JP5226176 A JP 5226176A JP 5226176 A JP5226176 A JP 5226176A JP S52135673 A JPS52135673 A JP S52135673A
Authority
JP
Japan
Prior art keywords
resin composition
semiconductor sealing
semiconductor
epoxy resin
silane coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5226176A
Other languages
Japanese (ja)
Inventor
Yoichi Matsuda
Masanori Segawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5226176A priority Critical patent/JPS52135673A/en
Publication of JPS52135673A publication Critical patent/JPS52135673A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve moisture resistance and electric characteristics by the semiconductor-sealing composition composed of effective quantities of epoxy resin, curing agent, curing accelerator and inorganic filler as well as silane coupling agent and aryl tin.
COPYRIGHT: (C)1977,JPO&Japio
JP5226176A 1976-05-10 1976-05-10 Resin composition for semiconductor sealing Pending JPS52135673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5226176A JPS52135673A (en) 1976-05-10 1976-05-10 Resin composition for semiconductor sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5226176A JPS52135673A (en) 1976-05-10 1976-05-10 Resin composition for semiconductor sealing

Publications (1)

Publication Number Publication Date
JPS52135673A true JPS52135673A (en) 1977-11-12

Family

ID=12909813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5226176A Pending JPS52135673A (en) 1976-05-10 1976-05-10 Resin composition for semiconductor sealing

Country Status (1)

Country Link
JP (1) JPS52135673A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3117960A1 (en) * 1980-05-10 1982-03-25 Matsushita Electric Works Ltd., Kadoma, Osaka EPOXY RESIN COMPOSITION
JPS60190418A (en) * 1984-03-12 1985-09-27 Mitsubishi Electric Corp Liquid epoxy resin composition for sealing semiconductors
JPH03211A (en) * 1989-05-26 1991-01-07 Matsushita Electric Works Ltd Manufacture of epoxy resin forming material
WO1995035336A1 (en) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Thermosetting composition and method of forming topcoating film
WO1999032566A1 (en) * 1997-12-23 1999-07-01 Ppg Industries Ohio, Inc. Color-plus-clear composite coating composition containing tin catalysts

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3117960A1 (en) * 1980-05-10 1982-03-25 Matsushita Electric Works Ltd., Kadoma, Osaka EPOXY RESIN COMPOSITION
JPS60190418A (en) * 1984-03-12 1985-09-27 Mitsubishi Electric Corp Liquid epoxy resin composition for sealing semiconductors
JPH03211A (en) * 1989-05-26 1991-01-07 Matsushita Electric Works Ltd Manufacture of epoxy resin forming material
WO1995035336A1 (en) * 1994-06-17 1995-12-28 Kansai Paint Company, Limited Thermosetting composition and method of forming topcoating film
US5821314A (en) * 1994-06-17 1998-10-13 Kansai Paint Company, Limited Thermosetting compositions and methods of forming a finish coat
WO1999032566A1 (en) * 1997-12-23 1999-07-01 Ppg Industries Ohio, Inc. Color-plus-clear composite coating composition containing tin catalysts

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