JPS572329A - Epoxy resin type composition and semiconductor device of resin sealing type - Google Patents

Epoxy resin type composition and semiconductor device of resin sealing type

Info

Publication number
JPS572329A
JPS572329A JP7494380A JP7494380A JPS572329A JP S572329 A JPS572329 A JP S572329A JP 7494380 A JP7494380 A JP 7494380A JP 7494380 A JP7494380 A JP 7494380A JP S572329 A JPS572329 A JP S572329A
Authority
JP
Japan
Prior art keywords
epoxy resin
component
curing
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7494380A
Other languages
Japanese (ja)
Other versions
JPS5760779B2 (en
Inventor
Hirotoshi Iketani
Shiyuichi Suzuki
Naoyuki Kokuni
Kazutaka Matsumoto
Akiko Hatanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7494380A priority Critical patent/JPS572329A/en
Priority to DE8181104126T priority patent/DE3163054D1/en
Priority to EP19810104126 priority patent/EP0041662B1/en
Publication of JPS572329A publication Critical patent/JPS572329A/en
Publication of JPS5760779B2 publication Critical patent/JPS5760779B2/ja
Priority to US06/580,299 priority patent/US4572853A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:The titled composition useful for sealing a semiconductor device, having improved heat resistance, high-temperature electrical properties, and potentially curing characteristics, obtained by adding a specific curing agent and an organic phosphine compound as a curing promotor to an epoxy resin. CONSTITUTION:(A) An epoxy resin (most preferably novolak type epoxy resin having 170-300 epoxy equivalent) is blended with (B) a curing agent (most preferably novolak type phenolic resin) having two or more phenolic hydroxyl groups, and (C) an organic tertiary phosphine compound, e.g., triphenylphosphine, etc. as a curing promotor in such a way that preferably a ratio of phenolic hydroxyl group of the component B to epoxy group is 0.8-1.2 and the amount of the component C is 0.001-50wt% based on the component A. (D) An inorganic filler (most perferably quartz glass powder, crystalline silica powder) is added to the blend.
JP7494380A 1980-06-05 1980-06-05 Epoxy resin type composition and semiconductor device of resin sealing type Granted JPS572329A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP7494380A JPS572329A (en) 1980-06-05 1980-06-05 Epoxy resin type composition and semiconductor device of resin sealing type
DE8181104126T DE3163054D1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device
EP19810104126 EP0041662B1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device
US06/580,299 US4572853A (en) 1980-06-05 1984-02-21 Resin encapsulation type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7494380A JPS572329A (en) 1980-06-05 1980-06-05 Epoxy resin type composition and semiconductor device of resin sealing type

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58157606A Division JPS5956748A (en) 1983-08-29 1983-08-29 Manufacture of resin-sealed type semiconductor device

Publications (2)

Publication Number Publication Date
JPS572329A true JPS572329A (en) 1982-01-07
JPS5760779B2 JPS5760779B2 (en) 1982-12-21

Family

ID=13561918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7494380A Granted JPS572329A (en) 1980-06-05 1980-06-05 Epoxy resin type composition and semiconductor device of resin sealing type

Country Status (1)

Country Link
JP (1) JPS572329A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58194916A (en) * 1982-05-10 1983-11-14 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JPS59109563A (en) * 1982-12-15 1984-06-25 Hitachi Chem Co Ltd Impregnating varnish for use in production of epoxy resin prepreg
JPS59232116A (en) * 1983-06-15 1984-12-26 Matsushita Electronics Corp Resin-sealed semiconductor device
JPS6053524A (en) * 1983-09-01 1985-03-27 Asahi Chem Ind Co Ltd Flame-retardant epoxy resin composition
JPS61221223A (en) * 1985-03-27 1986-10-01 Toshiba Corp Epoxy resin composition for sealing semiconductor
JPS627723A (en) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473651A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPH0841176A (en) * 1995-06-26 1996-02-13 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith
JP2019114600A (en) * 2017-12-21 2019-07-11 東京応化工業株式会社 Surface treatment liquid, surface treatment method, and method for suppressing pattern collapse

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6217604B2 (en) * 1981-06-30 1987-04-18 Nitto Electric Ind Co
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58194916A (en) * 1982-05-10 1983-11-14 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS6244767B2 (en) * 1982-05-10 1987-09-22 Sumitomo Bakelite Co
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JPH0379370B2 (en) * 1982-10-12 1991-12-18 Tokyo Shibaura Electric Co
JPS59109563A (en) * 1982-12-15 1984-06-25 Hitachi Chem Co Ltd Impregnating varnish for use in production of epoxy resin prepreg
JPS59232116A (en) * 1983-06-15 1984-12-26 Matsushita Electronics Corp Resin-sealed semiconductor device
JPH0413372B2 (en) * 1983-06-15 1992-03-09 Matsushita Electronics Corp
JPS6053524A (en) * 1983-09-01 1985-03-27 Asahi Chem Ind Co Ltd Flame-retardant epoxy resin composition
JPS61221223A (en) * 1985-03-27 1986-10-01 Toshiba Corp Epoxy resin composition for sealing semiconductor
JPS6325608B2 (en) * 1985-03-27 1988-05-26 Tokyo Shibaura Electric Co
JPS627723A (en) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473651A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPH0841176A (en) * 1995-06-26 1996-02-13 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith
JP2019114600A (en) * 2017-12-21 2019-07-11 東京応化工業株式会社 Surface treatment liquid, surface treatment method, and method for suppressing pattern collapse

Also Published As

Publication number Publication date
JPS5760779B2 (en) 1982-12-21

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