JPS5723625A - Epoxy resin composition and resin-sealed semiconductor device - Google Patents

Epoxy resin composition and resin-sealed semiconductor device

Info

Publication number
JPS5723625A
JPS5723625A JP9691380A JP9691380A JPS5723625A JP S5723625 A JPS5723625 A JP S5723625A JP 9691380 A JP9691380 A JP 9691380A JP 9691380 A JP9691380 A JP 9691380A JP S5723625 A JPS5723625 A JP S5723625A
Authority
JP
Japan
Prior art keywords
resin
pref
epoxy
group
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9691380A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9691380A priority Critical patent/JPS5723625A/en
Publication of JPS5723625A publication Critical patent/JPS5723625A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prepare the titled composition having excellent moisture resistance and processability such as marking characteristics, and suitable for the sealing of semiconductor devices, by adding a silanol-group containing silicone compound together with a specific curing agent, a specific cure accelerator, and an inorganic filler, to the base resin.
CONSTITUTION: A resin component obtained by compounding (A) an epoxy resin (esp. an epoxy-novolak resin having an epoxy equivalent of 170W300) with (B) a phenolic resin curing agent or an acid anhydride curing agent (pref. phenolic novolak resin) wherein the ratio of the pholic OH group to the epoxy group of the component (A) is pref. 0.8W1.2 is mixed with (C) pref. 0.1W5wt% of a cure accelerator selected from imidazoles and tert-amines, (D) 0.05W5wt% of a silanol- group-containing silicone compound, and (E) pref. 150W400pts.wt., based on 100pts.wt. of the resin component, of an inorganic filler (perf. quartz glass powder, etc.).
COPYRIGHT: (C)1982,JPO&Japio
JP9691380A 1980-07-17 1980-07-17 Epoxy resin composition and resin-sealed semiconductor device Pending JPS5723625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9691380A JPS5723625A (en) 1980-07-17 1980-07-17 Epoxy resin composition and resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9691380A JPS5723625A (en) 1980-07-17 1980-07-17 Epoxy resin composition and resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5723625A true JPS5723625A (en) 1982-02-06

Family

ID=14177594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9691380A Pending JPS5723625A (en) 1980-07-17 1980-07-17 Epoxy resin composition and resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5723625A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172541A (en) * 1983-03-23 1984-09-29 Sumitomo Bakelite Co Ltd Mold-releasable resin composition
JPS61166823A (en) * 1985-01-19 1986-07-28 Toshiba Chem Corp Resin composition for sealing
JPH01242616A (en) * 1988-03-23 1989-09-27 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor
JPH01287131A (en) * 1988-03-23 1989-11-17 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing and curing accelerator
JPH0820628A (en) * 1994-07-07 1996-01-23 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing
EP1184419A3 (en) * 2000-08-24 2003-04-02 Nitto Denko Corporation Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device
JP2013194198A (en) * 2012-03-22 2013-09-30 Hitachi Chemical Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device using the same
JP2016138287A (en) * 2016-04-22 2016-08-04 日立化成株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172541A (en) * 1983-03-23 1984-09-29 Sumitomo Bakelite Co Ltd Mold-releasable resin composition
JPS6236050B2 (en) * 1983-03-23 1987-08-05 Sumitomo Bakelite Co
JPS61166823A (en) * 1985-01-19 1986-07-28 Toshiba Chem Corp Resin composition for sealing
JPH01242616A (en) * 1988-03-23 1989-09-27 Sumitomo Bakelite Co Ltd Epoxy resin composition for sealing semiconductor
JPH01287131A (en) * 1988-03-23 1989-11-17 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing and curing accelerator
JPH0820628A (en) * 1994-07-07 1996-01-23 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing
EP1184419A3 (en) * 2000-08-24 2003-04-02 Nitto Denko Corporation Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device
SG128412A1 (en) * 2000-08-24 2007-01-30 Nitto Denko Corp Resin composition for sealing semiconductor, semiconductor device using the same semiconductor waferand mounted structure of semiconductor device
JP2013194198A (en) * 2012-03-22 2013-09-30 Hitachi Chemical Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device using the same
JP2016138287A (en) * 2016-04-22 2016-08-04 日立化成株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

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