JPS57212225A - Epoxy resin composition for encapsulation of semiconductor - Google Patents

Epoxy resin composition for encapsulation of semiconductor

Info

Publication number
JPS57212225A
JPS57212225A JP9784081A JP9784081A JPS57212225A JP S57212225 A JPS57212225 A JP S57212225A JP 9784081 A JP9784081 A JP 9784081A JP 9784081 A JP9784081 A JP 9784081A JP S57212225 A JPS57212225 A JP S57212225A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
novolak
diameter
silica powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9784081A
Other languages
Japanese (ja)
Other versions
JPS627211B2 (en
Inventor
Kazuo Iko
Takahiro Yoshioka
Kazuyuki Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP9784081A priority Critical patent/JPS57212225A/en
Publication of JPS57212225A publication Critical patent/JPS57212225A/en
Publication of JPS627211B2 publication Critical patent/JPS627211B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide a resin composition for the encapsulation of semiconductors, having low linear expansion coefficient, excellent thermal conductivity, and improved spiral flow length and flashing characteristics, by compounding a specific epoxy resin, a novolak resin and silica powder having specific particle size distribution.
CONSTITUTION: The objective composition is prepared by compounding (A) a novolak-type epoxy resin having an epoxy equivalent of ≤250 and a softening point of 60W120°C (e.g. o-cresol novolak epoxy resin) with (B) a novolak resin having a softening point of 60W130°C wherein the ratio of the epoxy group to the hydroxyl group in the component (A) is preferably 0.7:1W1:0.7, and (C) crystalline silica powder and/or fused silica powder wherein the amount of powder having particle diameter of ≥149μ is ≤0.5wt%, diameter of ≤44μ is ≥60% and diameter of ≤5μ is 20W55%, and the median diameter is 4W30μ. The amount of the component (C) is 60W80% of the whole composition.
COPYRIGHT: (C)1982,JPO&Japio
JP9784081A 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor Granted JPS57212225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9784081A JPS57212225A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9784081A JPS57212225A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Publications (2)

Publication Number Publication Date
JPS57212225A true JPS57212225A (en) 1982-12-27
JPS627211B2 JPS627211B2 (en) 1987-02-16

Family

ID=14202908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9784081A Granted JPS57212225A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Country Status (1)

Country Link
JP (1) JPS57212225A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608014U (en) * 1983-06-29 1985-01-21 カルソニックカンセイ株式会社 Mold for radiator with integrated seat plate
JPS6164145A (en) * 1984-09-05 1986-04-02 Mitsubishi Electric Corp Resin sealed semiconductor device
JPS61143466A (en) * 1984-12-18 1986-07-01 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS63108021A (en) * 1986-10-24 1988-05-12 Hitachi Ltd Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith
JPS63128020A (en) * 1986-11-18 1988-05-31 Hitachi Ltd Epoxy resin composition and resin-sealed type semiconductor device
JPS63160255A (en) * 1986-12-23 1988-07-04 Nitto Electric Ind Co Ltd Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH01206655A (en) * 1988-02-15 1989-08-18 Nitto Denko Corp Semiconductor device
JPH01206656A (en) * 1988-02-15 1989-08-18 Nitto Denko Corp Semiconductor device
US5202753A (en) * 1990-11-26 1993-04-13 Nippondenso Co., Ltd. Resin-sealed semiconductor device
US5349240A (en) * 1991-10-30 1994-09-20 Nippondenso Co., Ltd. Semiconductor device package having a sealing silicone gel with spherical fillers
JPH0770282A (en) * 1994-05-09 1995-03-14 Hitachi Ltd Epoxy resin composition used for semiconductor sealing
JPH08104730A (en) * 1995-06-20 1996-04-23 Nitto Denko Corp Resin composition for semiconductor sealing
US5719225A (en) * 1994-06-13 1998-02-17 Sumitomo Chemical Company, Ltd. Filler-containing resin composition suitable for injection molding and transfer molding
WO1998051743A1 (en) * 1997-05-14 1998-11-19 Mitsubishi Rayon Co., Ltd. (meth)acrylic resin composition for thermoset injection molding, process for the preparation of the composition, and process for the production of moldings of (meth)acrylic resins
US6844633B2 (en) 2001-08-02 2005-01-18 Nec Electronics Corporation Sealing resin, resin-sealed semiconductor and system-in-package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH052095Y2 (en) * 1987-03-04 1993-01-20

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
US3975757A (en) * 1974-05-31 1976-08-17 National Semiconductor Corporation Molded electrical device
US4042550A (en) * 1975-11-28 1977-08-16 Allied Chemical Corporation Encapsulant compositions based on anhydride-hardened epoxy resins
JPS537756A (en) * 1976-07-10 1978-01-24 Fujitsu Ltd Low-pressure molding material of diallyl phthalate
JPS5414143A (en) * 1977-07-05 1979-02-02 Michio Morimoto Automatic frequency control circuit
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS55165916A (en) * 1979-06-11 1980-12-24 Shikoku Chem Corp Epoxy resin composition
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5693749A (en) * 1979-12-27 1981-07-29 Hitachi Chem Co Ltd Epoxy resin composition

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
US3975757A (en) * 1974-05-31 1976-08-17 National Semiconductor Corporation Molded electrical device
US4042550A (en) * 1975-11-28 1977-08-16 Allied Chemical Corporation Encapsulant compositions based on anhydride-hardened epoxy resins
JPS537756A (en) * 1976-07-10 1978-01-24 Fujitsu Ltd Low-pressure molding material of diallyl phthalate
JPS5414143A (en) * 1977-07-05 1979-02-02 Michio Morimoto Automatic frequency control circuit
JPS54141569A (en) * 1978-04-26 1979-11-02 Toshiba Corp Semiconductor device
JPS554952A (en) * 1978-06-28 1980-01-14 Toshiba Corp Semiconductor device
JPS5529532A (en) * 1978-08-23 1980-03-01 Toshiba Corp Epoxy resin composition
JPS55165916A (en) * 1979-06-11 1980-12-24 Shikoku Chem Corp Epoxy resin composition
JPS55165655A (en) * 1979-06-12 1980-12-24 Toshiba Corp Semiconductor device sealed up with resin
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5659837A (en) * 1979-09-28 1981-05-23 Hitachi Chem Co Ltd Epoxy resin composition
JPS5693749A (en) * 1979-12-27 1981-07-29 Hitachi Chem Co Ltd Epoxy resin composition

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608014U (en) * 1983-06-29 1985-01-21 カルソニックカンセイ株式会社 Mold for radiator with integrated seat plate
JPS6164145A (en) * 1984-09-05 1986-04-02 Mitsubishi Electric Corp Resin sealed semiconductor device
JPS61143466A (en) * 1984-12-18 1986-07-01 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPH0242383B2 (en) * 1984-12-18 1990-09-21
JPS63108021A (en) * 1986-10-24 1988-05-12 Hitachi Ltd Epoxy resin composition for semiconductor sealing and semiconductor device sealed therewith
JPH0680863A (en) * 1986-11-18 1994-03-22 Hitachi Ltd Epoxy resin composition
JPS63128020A (en) * 1986-11-18 1988-05-31 Hitachi Ltd Epoxy resin composition and resin-sealed type semiconductor device
JPH0554865B2 (en) * 1986-11-18 1993-08-13 Hitachi Ltd
JPS63160255A (en) * 1986-12-23 1988-07-04 Nitto Electric Ind Co Ltd Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH01206655A (en) * 1988-02-15 1989-08-18 Nitto Denko Corp Semiconductor device
JPH01206656A (en) * 1988-02-15 1989-08-18 Nitto Denko Corp Semiconductor device
US5202753A (en) * 1990-11-26 1993-04-13 Nippondenso Co., Ltd. Resin-sealed semiconductor device
US5349240A (en) * 1991-10-30 1994-09-20 Nippondenso Co., Ltd. Semiconductor device package having a sealing silicone gel with spherical fillers
JPH0770282A (en) * 1994-05-09 1995-03-14 Hitachi Ltd Epoxy resin composition used for semiconductor sealing
US5719225A (en) * 1994-06-13 1998-02-17 Sumitomo Chemical Company, Ltd. Filler-containing resin composition suitable for injection molding and transfer molding
US5780145A (en) * 1994-06-13 1998-07-14 Sumitomo Chemical Company, Limited Filler-containing resin composition suitable for injection molding and transfer molding
JPH08104730A (en) * 1995-06-20 1996-04-23 Nitto Denko Corp Resin composition for semiconductor sealing
WO1998051743A1 (en) * 1997-05-14 1998-11-19 Mitsubishi Rayon Co., Ltd. (meth)acrylic resin composition for thermoset injection molding, process for the preparation of the composition, and process for the production of moldings of (meth)acrylic resins
US6844633B2 (en) 2001-08-02 2005-01-18 Nec Electronics Corporation Sealing resin, resin-sealed semiconductor and system-in-package

Also Published As

Publication number Publication date
JPS627211B2 (en) 1987-02-16

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