JPS54141569A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54141569A
JPS54141569A JP4877678A JP4877678A JPS54141569A JP S54141569 A JPS54141569 A JP S54141569A JP 4877678 A JP4877678 A JP 4877678A JP 4877678 A JP4877678 A JP 4877678A JP S54141569 A JPS54141569 A JP S54141569A
Authority
JP
Japan
Prior art keywords
under
epoxy resin
softening point
corrosion resistant
base composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4877678A
Other languages
Japanese (ja)
Other versions
JPS57656B2 (en
Inventor
Moriyasu Wada
Akira Yoshizumi
Hirotoshi Iketani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4877678A priority Critical patent/JPS54141569A/en
Priority to US06/030,768 priority patent/US4248920A/en
Priority to DE2916954A priority patent/DE2916954C2/en
Publication of JPS54141569A publication Critical patent/JPS54141569A/en
Publication of JPS57656B2 publication Critical patent/JPS57656B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent remaining of ionic impurities in mold layer and improve the reliability of the semiconductor device by using the specific corrosion resistant epoxy resin base composition in transistors and ICs or the like of resin sealed type.
CONSTITUTION: The following was used as the corrosion resistant epoxy resin base composition suited for sealing of semiconductor elements. (a) Amorphous quartz powder of grain sizes under 44μ 70 to 90% (but includes at least 20% of below 8μ), 44μ up to and under 74μ 5 to 25%, 74μ up to and under 149μ 2 to 16% and 149μ or over 3% or under is used. (b) Epoxy resin of epoxy equivalent 250 or under and softening point 120°C or under 10 to 25wt%, (c) phenol novolak resin or organic acid anhydride 5 to 20wt% as hardener, (d) accelerator 0.1 to 1.0wt%, (e) paraffins 0.05 to 1.05wt% of liquid form or low softening point are used as the molding materials of mold.
COPYRIGHT: (C)1979,JPO&Japio
JP4877678A 1978-04-26 1978-04-26 Semiconductor device Granted JPS54141569A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4877678A JPS54141569A (en) 1978-04-26 1978-04-26 Semiconductor device
US06/030,768 US4248920A (en) 1978-04-26 1979-04-17 Resin-sealed semiconductor device
DE2916954A DE2916954C2 (en) 1978-04-26 1979-04-26 Synthetic resin compound for tightly encasing a semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4877678A JPS54141569A (en) 1978-04-26 1978-04-26 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS54141569A true JPS54141569A (en) 1979-11-02
JPS57656B2 JPS57656B2 (en) 1982-01-07

Family

ID=12812657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4877678A Granted JPS54141569A (en) 1978-04-26 1978-04-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54141569A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58112352A (en) * 1981-12-26 1983-07-04 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor memory element sealing
JPS59221352A (en) * 1983-05-31 1984-12-12 Sumitomo Bakelite Co Ltd Epoxy resin composition having low radioactivity
JPS6018519A (en) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd Epoxy resin composition
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The Silica with high purity and its preparation
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its preparation
JPS61243853A (en) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPH02173057A (en) * 1988-12-27 1990-07-04 Sumitomo Bakelite Co Ltd Resin composition for semiconductor sealing
JPH03277621A (en) * 1990-03-28 1991-12-09 Nippon Steel Chem Co Ltd Epoxy resin composition
JP2010144072A (en) * 2008-12-19 2010-07-01 Toko Inc Resin composition, electronic component using the composition, and method for producing the component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672953B2 (en) * 2016-03-29 2020-03-25 味の素株式会社 Resin sheet

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840378A (en) * 1971-09-25 1973-06-13
JPS4860874A (en) * 1971-11-30 1973-08-25

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840378A (en) * 1971-09-25 1973-06-13
JPS4860874A (en) * 1971-11-30 1973-08-25

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
JPS634701B2 (en) * 1980-12-10 1988-01-30 Hitachi Seisakusho Kk
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS627211B2 (en) * 1981-06-24 1987-02-16 Nitto Electric Ind Co
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6217604B2 (en) * 1981-06-30 1987-04-18 Nitto Electric Ind Co
JPS58112352A (en) * 1981-12-26 1983-07-04 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor memory element sealing
JPS59221352A (en) * 1983-05-31 1984-12-12 Sumitomo Bakelite Co Ltd Epoxy resin composition having low radioactivity
JPS6018519A (en) * 1983-07-09 1985-01-30 Matsushita Electric Works Ltd Epoxy resin composition
JPS6244013B2 (en) * 1983-07-09 1987-09-17 Matsushita Electric Works Ltd
JPH0121091B2 (en) * 1984-02-27 1989-04-19 Nippon Chemical Ind
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPH05339B2 (en) * 1984-03-12 1993-01-05 Nippon Chemical Ind
JPH0127003B2 (en) * 1984-07-31 1989-05-26 Nippon Chemical Ind
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPH0121092B2 (en) * 1984-08-17 1989-04-19 Nippon Chemical Ind
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The Silica with high purity and its preparation
JPH0124729B2 (en) * 1984-08-17 1989-05-12 Nippon Chemical Ind
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its preparation
JPS6337127B2 (en) * 1985-04-19 1988-07-22 Shinetsu Chem Ind Co
JPS61243853A (en) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6325012B2 (en) * 1985-09-10 1988-05-24 Shinetsu Chem Ind Co
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPH02173057A (en) * 1988-12-27 1990-07-04 Sumitomo Bakelite Co Ltd Resin composition for semiconductor sealing
JPH03277621A (en) * 1990-03-28 1991-12-09 Nippon Steel Chem Co Ltd Epoxy resin composition
JP2010144072A (en) * 2008-12-19 2010-07-01 Toko Inc Resin composition, electronic component using the composition, and method for producing the component

Also Published As

Publication number Publication date
JPS57656B2 (en) 1982-01-07

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