JPS554952A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS554952A JPS554952A JP7745978A JP7745978A JPS554952A JP S554952 A JPS554952 A JP S554952A JP 7745978 A JP7745978 A JP 7745978A JP 7745978 A JP7745978 A JP 7745978A JP S554952 A JPS554952 A JP S554952A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- semiconductor device
- hardener
- accelerator
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To improve the moisture resisting and heat radiating properties of a semiconductor device and reduce the corrosion of its aluminium electrode by moulding with a material of epoxy resin to which a particular amount of crystalline silica powder of a particular grain size and a particular amount of a particular hardener and a particular accelerator are added.
CONSTITUTION: Semiconductor elements are covered and moulded with an eplxy resin composite including 68W80 weight % of crystalline silica powder of average particle size 4W8μ having a particle size distribution of 0.5 weight % maximum of over 149μ and 60W95 weight % of under 48μ (But under 19μ size particles must be included at least 55%.) as filling material, 10W25 weight % of epoxy resin of epoxy equivalent 250 maximum and a softening point 120°C highest, 5W25 weight % of phenol novolak resin or organic acid anhydride as a hardener, 0.1W1.0 weight % of an accelerator and 0.05W1.50 weight % of low melting point paraffin family. By so doing, a semiconductor device of good moisture resisting property, little corrosion of aluminium electrode, good heat radiating property and high reliability can be obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7745978A JPS554952A (en) | 1978-06-28 | 1978-06-28 | Semiconductor device |
US06/030,768 US4248920A (en) | 1978-04-26 | 1979-04-17 | Resin-sealed semiconductor device |
DE2916954A DE2916954C2 (en) | 1978-04-26 | 1979-04-26 | Synthetic resin compound for tightly encasing a semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7745978A JPS554952A (en) | 1978-06-28 | 1978-06-28 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS554952A true JPS554952A (en) | 1980-01-14 |
JPS567299B2 JPS567299B2 (en) | 1981-02-17 |
Family
ID=13634586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7745978A Granted JPS554952A (en) | 1978-04-26 | 1978-06-28 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS554952A (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57195151A (en) * | 1981-05-27 | 1982-11-30 | Denki Kagaku Kogyo Kk | Low-radioactive resin composition |
JPS57212225A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
JPS582322A (en) * | 1981-06-30 | 1983-01-07 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
JPS58112352A (en) * | 1981-12-26 | 1983-07-04 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor memory element sealing |
JPS60180911A (en) * | 1984-02-27 | 1985-09-14 | Nippon Chem Ind Co Ltd:The | High-purity silica and its manufacture |
JPS60191016A (en) * | 1984-03-12 | 1985-09-28 | Nippon Chem Ind Co Ltd:The | High-purity silica and its manufacture |
JPS6140811A (en) * | 1984-07-31 | 1986-02-27 | Nippon Chem Ind Co Ltd:The | Hydrated silica for melting and manufacture of melted silica by using it |
JPS6148422A (en) * | 1984-08-17 | 1986-03-10 | Nippon Chem Ind Co Ltd:The | High purity silica and its preparation |
JPS6148421A (en) * | 1984-08-17 | 1986-03-10 | Nippon Chem Ind Co Ltd:The | Silica with high purity and its preparation |
JPS61243853A (en) * | 1985-04-19 | 1986-10-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS61283615A (en) * | 1985-06-11 | 1986-12-13 | Sumitomo Bakelite Co Ltd | Epoxy resin molding material for sealing semiconductor |
JPS6259626A (en) * | 1985-09-10 | 1987-03-16 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS6281446A (en) * | 1985-10-04 | 1987-04-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
JPS63159422A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Insulating resin paste for semiconductor |
JPS63159428A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Insulating resin paste |
JPH0726120A (en) * | 1993-09-22 | 1995-01-27 | Nitto Denko Corp | Semiconductor-sealed device |
JPH08239556A (en) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | Device for sealing semiconductor |
JPH08239557A (en) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | Device for sealing semiconductor |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3849187A (en) * | 1970-03-08 | 1974-11-19 | Dexter Corp | Encapsulant compositions for semiconductors |
JPS5313500A (en) * | 1976-07-22 | 1978-02-07 | Kubota Ltd | Automatic drink vending machine |
-
1978
- 1978-06-28 JP JP7745978A patent/JPS554952A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3849187A (en) * | 1970-03-08 | 1974-11-19 | Dexter Corp | Encapsulant compositions for semiconductors |
JPS5313500A (en) * | 1976-07-22 | 1978-02-07 | Kubota Ltd | Automatic drink vending machine |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57195151A (en) * | 1981-05-27 | 1982-11-30 | Denki Kagaku Kogyo Kk | Low-radioactive resin composition |
JPS57212225A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
JPS627211B2 (en) * | 1981-06-24 | 1987-02-16 | Nitto Electric Ind Co | |
JPS582322A (en) * | 1981-06-30 | 1983-01-07 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
JPS6217604B2 (en) * | 1981-06-30 | 1987-04-18 | Nitto Electric Ind Co | |
JPS58112352A (en) * | 1981-12-26 | 1983-07-04 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor memory element sealing |
JPH0121091B2 (en) * | 1984-02-27 | 1989-04-19 | Nippon Chemical Ind | |
JPS60180911A (en) * | 1984-02-27 | 1985-09-14 | Nippon Chem Ind Co Ltd:The | High-purity silica and its manufacture |
JPS60191016A (en) * | 1984-03-12 | 1985-09-28 | Nippon Chem Ind Co Ltd:The | High-purity silica and its manufacture |
JPH05339B2 (en) * | 1984-03-12 | 1993-01-05 | Nippon Chemical Ind | |
JPS6140811A (en) * | 1984-07-31 | 1986-02-27 | Nippon Chem Ind Co Ltd:The | Hydrated silica for melting and manufacture of melted silica by using it |
JPH0127003B2 (en) * | 1984-07-31 | 1989-05-26 | Nippon Chemical Ind | |
JPS6148421A (en) * | 1984-08-17 | 1986-03-10 | Nippon Chem Ind Co Ltd:The | Silica with high purity and its preparation |
JPH0124729B2 (en) * | 1984-08-17 | 1989-05-12 | Nippon Chemical Ind | |
JPS6148422A (en) * | 1984-08-17 | 1986-03-10 | Nippon Chem Ind Co Ltd:The | High purity silica and its preparation |
JPH0121092B2 (en) * | 1984-08-17 | 1989-04-19 | Nippon Chemical Ind | |
JPS6337127B2 (en) * | 1985-04-19 | 1988-07-22 | Shinetsu Chem Ind Co | |
JPS61243853A (en) * | 1985-04-19 | 1986-10-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS61283615A (en) * | 1985-06-11 | 1986-12-13 | Sumitomo Bakelite Co Ltd | Epoxy resin molding material for sealing semiconductor |
JPS6325012B2 (en) * | 1985-09-10 | 1988-05-24 | Shinetsu Chem Ind Co | |
JPS6259626A (en) * | 1985-09-10 | 1987-03-16 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS6281446A (en) * | 1985-10-04 | 1987-04-14 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
JPS63159428A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Insulating resin paste |
JPS63159422A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Insulating resin paste for semiconductor |
JPH0726120A (en) * | 1993-09-22 | 1995-01-27 | Nitto Denko Corp | Semiconductor-sealed device |
JPH08239556A (en) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | Device for sealing semiconductor |
JPH08239557A (en) * | 1996-02-15 | 1996-09-17 | Nitto Denko Corp | Device for sealing semiconductor |
Also Published As
Publication number | Publication date |
---|---|
JPS567299B2 (en) | 1981-02-17 |
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