JPS554952A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS554952A
JPS554952A JP7745978A JP7745978A JPS554952A JP S554952 A JPS554952 A JP S554952A JP 7745978 A JP7745978 A JP 7745978A JP 7745978 A JP7745978 A JP 7745978A JP S554952 A JPS554952 A JP S554952A
Authority
JP
Japan
Prior art keywords
weight
semiconductor device
hardener
accelerator
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7745978A
Other languages
Japanese (ja)
Other versions
JPS567299B2 (en
Inventor
Akira Yoshizumi
Hirotoshi Iketani
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7745978A priority Critical patent/JPS554952A/en
Priority to US06/030,768 priority patent/US4248920A/en
Priority to DE2916954A priority patent/DE2916954C2/en
Publication of JPS554952A publication Critical patent/JPS554952A/en
Publication of JPS567299B2 publication Critical patent/JPS567299B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve the moisture resisting and heat radiating properties of a semiconductor device and reduce the corrosion of its aluminium electrode by moulding with a material of epoxy resin to which a particular amount of crystalline silica powder of a particular grain size and a particular amount of a particular hardener and a particular accelerator are added.
CONSTITUTION: Semiconductor elements are covered and moulded with an eplxy resin composite including 68W80 weight % of crystalline silica powder of average particle size 4W8μ having a particle size distribution of 0.5 weight % maximum of over 149μ and 60W95 weight % of under 48μ (But under 19μ size particles must be included at least 55%.) as filling material, 10W25 weight % of epoxy resin of epoxy equivalent 250 maximum and a softening point 120°C highest, 5W25 weight % of phenol novolak resin or organic acid anhydride as a hardener, 0.1W1.0 weight % of an accelerator and 0.05W1.50 weight % of low melting point paraffin family. By so doing, a semiconductor device of good moisture resisting property, little corrosion of aluminium electrode, good heat radiating property and high reliability can be obtained.
COPYRIGHT: (C)1980,JPO&Japio
JP7745978A 1978-04-26 1978-06-28 Semiconductor device Granted JPS554952A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP7745978A JPS554952A (en) 1978-06-28 1978-06-28 Semiconductor device
US06/030,768 US4248920A (en) 1978-04-26 1979-04-17 Resin-sealed semiconductor device
DE2916954A DE2916954C2 (en) 1978-04-26 1979-04-26 Synthetic resin compound for tightly encasing a semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7745978A JPS554952A (en) 1978-06-28 1978-06-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS554952A true JPS554952A (en) 1980-01-14
JPS567299B2 JPS567299B2 (en) 1981-02-17

Family

ID=13634586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7745978A Granted JPS554952A (en) 1978-04-26 1978-06-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS554952A (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS58112352A (en) * 1981-12-26 1983-07-04 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor memory element sealing
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its preparation
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The Silica with high purity and its preparation
JPS61243853A (en) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS61283615A (en) * 1985-06-11 1986-12-13 Sumitomo Bakelite Co Ltd Epoxy resin molding material for sealing semiconductor
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6281446A (en) * 1985-10-04 1987-04-14 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS63159422A (en) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd Insulating resin paste for semiconductor
JPS63159428A (en) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd Insulating resin paste
JPH0726120A (en) * 1993-09-22 1995-01-27 Nitto Denko Corp Semiconductor-sealed device
JPH08239556A (en) * 1996-02-15 1996-09-17 Nitto Denko Corp Device for sealing semiconductor
JPH08239557A (en) * 1996-02-15 1996-09-17 Nitto Denko Corp Device for sealing semiconductor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
JPS5313500A (en) * 1976-07-22 1978-02-07 Kubota Ltd Automatic drink vending machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3849187A (en) * 1970-03-08 1974-11-19 Dexter Corp Encapsulant compositions for semiconductors
JPS5313500A (en) * 1976-07-22 1978-02-07 Kubota Ltd Automatic drink vending machine

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195151A (en) * 1981-05-27 1982-11-30 Denki Kagaku Kogyo Kk Low-radioactive resin composition
JPS57212225A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS627211B2 (en) * 1981-06-24 1987-02-16 Nitto Electric Ind Co
JPS582322A (en) * 1981-06-30 1983-01-07 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6217604B2 (en) * 1981-06-30 1987-04-18 Nitto Electric Ind Co
JPS58112352A (en) * 1981-12-26 1983-07-04 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor memory element sealing
JPH0121091B2 (en) * 1984-02-27 1989-04-19 Nippon Chemical Ind
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPH05339B2 (en) * 1984-03-12 1993-01-05 Nippon Chemical Ind
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPH0127003B2 (en) * 1984-07-31 1989-05-26 Nippon Chemical Ind
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The Silica with high purity and its preparation
JPH0124729B2 (en) * 1984-08-17 1989-05-12 Nippon Chemical Ind
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its preparation
JPH0121092B2 (en) * 1984-08-17 1989-04-19 Nippon Chemical Ind
JPS6337127B2 (en) * 1985-04-19 1988-07-22 Shinetsu Chem Ind Co
JPS61243853A (en) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS61283615A (en) * 1985-06-11 1986-12-13 Sumitomo Bakelite Co Ltd Epoxy resin molding material for sealing semiconductor
JPS6325012B2 (en) * 1985-09-10 1988-05-24 Shinetsu Chem Ind Co
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6281446A (en) * 1985-10-04 1987-04-14 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS63159428A (en) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd Insulating resin paste
JPS63159422A (en) * 1986-12-23 1988-07-02 Sumitomo Bakelite Co Ltd Insulating resin paste for semiconductor
JPH0726120A (en) * 1993-09-22 1995-01-27 Nitto Denko Corp Semiconductor-sealed device
JPH08239556A (en) * 1996-02-15 1996-09-17 Nitto Denko Corp Device for sealing semiconductor
JPH08239557A (en) * 1996-02-15 1996-09-17 Nitto Denko Corp Device for sealing semiconductor

Also Published As

Publication number Publication date
JPS567299B2 (en) 1981-02-17

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