JPS57212224A - Epoxy resin composition for encapsulation of semiconductor - Google Patents

Epoxy resin composition for encapsulation of semiconductor

Info

Publication number
JPS57212224A
JPS57212224A JP9783981A JP9783981A JPS57212224A JP S57212224 A JPS57212224 A JP S57212224A JP 9783981 A JP9783981 A JP 9783981A JP 9783981 A JP9783981 A JP 9783981A JP S57212224 A JPS57212224 A JP S57212224A
Authority
JP
Japan
Prior art keywords
epoxy resin
component
composition
alkali metal
extracted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9783981A
Other languages
Japanese (ja)
Other versions
JPS627212B2 (en
Inventor
Kazuo Iko
Takahiro Yoshioka
Kazuyuki Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP9783981A priority Critical patent/JPS57212224A/en
Publication of JPS57212224A publication Critical patent/JPS57212224A/en
Publication of JPS627212B2 publication Critical patent/JPS627212B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To provide a composition for the encapsulation of semiconductors, having high moisture resistance, composed of a specific epoxy resin, a hardener, and a filler, and containing specified amounts of alkali metal ion and halogen ion in each component and in the cured composition.
CONSTITUTION: The objective composition is prepared by mixing (A) an epoxy resin composed mainly of a novolak-type epoxy resin and having a total chlorine content of ≤0.1wt%, with (B) a novolak resin as a hardener and (C) a fused silica powder and/or crystalline silica as a filler. The contents of alkali metal ion and hydrolyzable halogen ion detected at normal temperature and pressure in the components (A) and (B) are ≤10ppm each. The amount of the component (B) is 0.7W1.2 equivalent as the hydroxyl group equivalent based on the epoxy group in the component (A), and the amount of the component (C) is 60W80wt% of the whole composition. The compounding is controlled so as to give the alkali metal ion content of ≤10ppm and the halogen ion content of ≤100ppm when the cured mixture is extracted in a pressure-cooker, and giving an electrical conductivity of the extracted water of ≤100μV/cm when 1pt. of the 100 mesh- pass powder of the cured mixture is extracted with 10pts. of water.
COPYRIGHT: (C)1982,JPO&Japio
JP9783981A 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor Granted JPS57212224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9783981A JPS57212224A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9783981A JPS57212224A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Publications (2)

Publication Number Publication Date
JPS57212224A true JPS57212224A (en) 1982-12-27
JPS627212B2 JPS627212B2 (en) 1987-02-16

Family

ID=14202879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9783981A Granted JPS57212224A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Country Status (1)

Country Link
JP (1) JPS57212224A (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168244A (en) * 1982-03-30 1983-10-04 Toshiba Corp Extracting method for impurity in sliver paste for die bonding
JPS59159640A (en) * 1983-02-28 1984-09-10 Fujikura Ltd Self-adhesive insulated wire and enclosed compressor motor using the same
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPS617325A (en) * 1984-06-20 1986-01-14 Sumitomo Bakelite Co Ltd High-purity epoxy resin composition
JPS6117416A (en) * 1984-07-03 1986-01-25 Nippon Chem Ind Co Ltd:The High-purity silica and its preparation
JPS6139407A (en) * 1984-07-31 1986-02-25 株式会社フジクラ Self-adhesive insulated wire and sealed compressor motor using same
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The Silica with high purity and its preparation
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its preparation
JPS61221279A (en) * 1985-03-28 1986-10-01 Nippon Retsuku Kk One-pack type insulating adhesive for metal and flexible film
JPS61243853A (en) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS61247725A (en) * 1985-04-26 1986-11-05 Sumitomo Bakelite Co Ltd Epoxy resin molding material for sealing semiconductor
JPS627723A (en) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS62290720A (en) * 1986-06-11 1987-12-17 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component
JPS63269555A (en) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd Semiconductor device
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473749A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH0286148A (en) * 1988-09-21 1990-03-27 Nitto Denko Corp Semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5626926A (en) * 1979-08-10 1981-03-16 Toshiba Corp Epoxy resin molding material for sealing electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5626926A (en) * 1979-08-10 1981-03-16 Toshiba Corp Epoxy resin molding material for sealing electronic part

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168244A (en) * 1982-03-30 1983-10-04 Toshiba Corp Extracting method for impurity in sliver paste for die bonding
JPH0336247B2 (en) * 1983-02-28 1991-05-30 Fujikura Densen Kk
JPS59159640A (en) * 1983-02-28 1984-09-10 Fujikura Ltd Self-adhesive insulated wire and enclosed compressor motor using the same
JPS60180911A (en) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPH0121091B2 (en) * 1984-02-27 1989-04-19 Nippon Chemical Ind
JPS60191016A (en) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The High-purity silica and its manufacture
JPH05339B2 (en) * 1984-03-12 1993-01-05 Nippon Chemical Ind
JPS617325A (en) * 1984-06-20 1986-01-14 Sumitomo Bakelite Co Ltd High-purity epoxy resin composition
JPS6117416A (en) * 1984-07-03 1986-01-25 Nippon Chem Ind Co Ltd:The High-purity silica and its preparation
JPH0121093B2 (en) * 1984-07-03 1989-04-19 Nippon Chemical Ind
JPS6139407A (en) * 1984-07-31 1986-02-25 株式会社フジクラ Self-adhesive insulated wire and sealed compressor motor using same
JPS6140811A (en) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The Hydrated silica for melting and manufacture of melted silica by using it
JPH0326881B2 (en) * 1984-07-31 1991-04-12 Fujikura Densen Kk
JPH0127003B2 (en) * 1984-07-31 1989-05-26 Nippon Chemical Ind
JPH0121092B2 (en) * 1984-08-17 1989-04-19 Nippon Chemical Ind
JPH0124729B2 (en) * 1984-08-17 1989-05-12 Nippon Chemical Ind
JPS6148421A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The Silica with high purity and its preparation
JPS6148422A (en) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The High purity silica and its preparation
JPH0325468B2 (en) * 1985-03-28 1991-04-08 Nippon Retsuku Kk
JPS61221279A (en) * 1985-03-28 1986-10-01 Nippon Retsuku Kk One-pack type insulating adhesive for metal and flexible film
JPS6337127B2 (en) * 1985-04-19 1988-07-22 Shinetsu Chem Ind Co
JPS61243853A (en) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS61247725A (en) * 1985-04-26 1986-11-05 Sumitomo Bakelite Co Ltd Epoxy resin molding material for sealing semiconductor
JPS627723A (en) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS6325012B2 (en) * 1985-09-10 1988-05-24 Shinetsu Chem Ind Co
JPS62290720A (en) * 1986-06-11 1987-12-17 Hitachi Chem Co Ltd Epoxy resin molding material for sealing electronic component
JPS63269555A (en) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd Semiconductor device
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPS6473749A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH0286148A (en) * 1988-09-21 1990-03-27 Nitto Denko Corp Semiconductor device

Also Published As

Publication number Publication date
JPS627212B2 (en) 1987-02-16

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