JPS6473749A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6473749A
JPS6473749A JP23141987A JP23141987A JPS6473749A JP S6473749 A JPS6473749 A JP S6473749A JP 23141987 A JP23141987 A JP 23141987A JP 23141987 A JP23141987 A JP 23141987A JP S6473749 A JPS6473749 A JP S6473749A
Authority
JP
Japan
Prior art keywords
epoxy resin
substituting
hydroxide
group
organic group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23141987A
Other languages
Japanese (ja)
Other versions
JP2568581B2 (en
Inventor
Tsutomu Nishioka
Tatsushi Ito
Minoru Nakao
Fujio Kitamura
Kazuo Iko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP62231419A priority Critical patent/JP2568581B2/en
Publication of JPS6473749A publication Critical patent/JPS6473749A/en
Application granted granted Critical
Publication of JP2568581B2 publication Critical patent/JP2568581B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To enable a semiconductor to be kept high in reliability for a long period in an atomosphere of high temperature by a method wherein a semiconductor element is made to be sealed with an epoxy resin compound composed of specified components. CONSTITUTION:A semiconductor element is made to be sealed with an epoxy resin compound composed of A-D components as follows: A, B, C, and D represent respectively epoxy resin, phenolic resin, epoxy resin bromide, and at least one of components selected from Bi hydroxide, Bi oxide, Al hydroxide, and Al hydroxide which contains chlorine, bromine, and nitric acid ions less than 5ppm. It is desirable that at least either epoxy resin or phenolic resin reacted with organopolysiloxane which is represented by the equation I is employed. In the equation I, R represents a monovalent organic group, where at least two of Rs contained in a molecule are groups selected from an amino group substituting organic group, a vinyl substituting organic group, a mercapto substituting group, and a carboxyl substituting group, and m denotes an integer such as 0-500.
JP62231419A 1987-09-16 1987-09-16 Semiconductor device Expired - Lifetime JP2568581B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62231419A JP2568581B2 (en) 1987-09-16 1987-09-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62231419A JP2568581B2 (en) 1987-09-16 1987-09-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6473749A true JPS6473749A (en) 1989-03-20
JP2568581B2 JP2568581B2 (en) 1997-01-08

Family

ID=16923290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62231419A Expired - Lifetime JP2568581B2 (en) 1987-09-16 1987-09-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JP2568581B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234625A (en) * 1988-07-25 1990-02-05 Toshiba Chem Corp Sealing resin composition
JP2008208176A (en) * 2007-02-23 2008-09-11 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6079063A (en) * 1983-10-07 1985-05-04 Sumitomo Bakelite Co Ltd Epoxy resin composition and production thereof
JPS60202118A (en) * 1984-03-26 1985-10-12 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith
JPS60226147A (en) * 1984-04-25 1985-11-11 Hitachi Ltd Electronic part
JPS61138619A (en) * 1984-12-10 1986-06-26 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor
JPS61221223A (en) * 1985-03-27 1986-10-01 Toshiba Corp Epoxy resin composition for sealing semiconductor
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS62192444A (en) * 1986-02-18 1987-08-24 Matsushita Electric Works Ltd Epoxy resin molding material for use in sealing semiconductor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130953A (en) * 1980-03-17 1981-10-14 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor device
JPS57212224A (en) * 1981-06-24 1982-12-27 Nitto Electric Ind Co Ltd Epoxy resin composition for encapsulation of semiconductor
JPS6079063A (en) * 1983-10-07 1985-05-04 Sumitomo Bakelite Co Ltd Epoxy resin composition and production thereof
JPS60202118A (en) * 1984-03-26 1985-10-12 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith
JPS60226147A (en) * 1984-04-25 1985-11-11 Hitachi Ltd Electronic part
JPS61138619A (en) * 1984-12-10 1986-06-26 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor
JPS61221223A (en) * 1985-03-27 1986-10-01 Toshiba Corp Epoxy resin composition for sealing semiconductor
JPS6259626A (en) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS62192444A (en) * 1986-02-18 1987-08-24 Matsushita Electric Works Ltd Epoxy resin molding material for use in sealing semiconductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0234625A (en) * 1988-07-25 1990-02-05 Toshiba Chem Corp Sealing resin composition
JP2008208176A (en) * 2007-02-23 2008-09-11 Shin Etsu Chem Co Ltd Epoxy resin composition and semiconductor device

Also Published As

Publication number Publication date
JP2568581B2 (en) 1997-01-08

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