MY111987A - Heat resistant resin composition, heat resistant film adhesive and process for producing the same - Google Patents
Heat resistant resin composition, heat resistant film adhesive and process for producing the sameInfo
- Publication number
- MY111987A MY111987A MYPI95000472A MYPI19950472A MY111987A MY 111987 A MY111987 A MY 111987A MY PI95000472 A MYPI95000472 A MY PI95000472A MY PI19950472 A MYPI19950472 A MY PI19950472A MY 111987 A MY111987 A MY 111987A
- Authority
- MY
- Malaysia
- Prior art keywords
- heat resistant
- resin composition
- film adhesive
- producing
- resistant film
- Prior art date
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
A HEAT RESISTANT RESIN COMPOSITION COMPRISING, AS THE MAIN COMPONENTS,(A) 100 PARTS BY WEIGHT OF AN ORGANIC SOLVENT-SOLUBLE POLYIMIDE RESIN HAVING A GLASS TRANSITION TEMPERA-TURE .OF 350?C OR LESS,(B) 5 TO 100 PARTS BY WEIGHT OF AN EPOXY COMPOUND HAVING AT LEAST TWO EPOXY GROUPS IN ONE MOLECULE,AND(C) 0.1 TO 20 PARTS BY WEIGHT OF A COMPOUND HAVING AN ACTIVE HYDROGEN GROUP WHICH CAN REACT WITH THEEPOXY COMPOUND (B),A HEAT RESISTANT FILM ADHESIVE COMPRISING, AS THE MAIN COMPONENTS, THE ABOVE COMPONENTS (A), (B) AND (C), AND A PROCESS FOR PRODUCING A HEAT RESISTANT FILM ADHESIVE BY CASTING A SOLUTION OF THE ABOVE HEAT RESISTANT RESIN COMPOSITION ON ONE SIDE OR BOTH SIDES OF A SUPPORT.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6036887A JP3014578B2 (en) | 1994-03-08 | 1994-03-08 | Resin composition with improved properties at high temperatures |
Publications (1)
Publication Number | Publication Date |
---|---|
MY111987A true MY111987A (en) | 2001-03-31 |
Family
ID=12482296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI95000472A MY111987A (en) | 1994-03-08 | 1995-02-24 | Heat resistant resin composition, heat resistant film adhesive and process for producing the same |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3014578B2 (en) |
MY (1) | MY111987A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100333452B1 (en) | 1994-12-26 | 2002-04-18 | 이사오 우치가사키 | Film-like organic die-bonding material and semiconductor device using the same |
US6717242B2 (en) | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
AU4471797A (en) | 1996-10-08 | 1998-05-05 | Hitachi Chemical Company, Ltd. | Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film |
JP4008249B2 (en) * | 2001-01-31 | 2007-11-14 | 住友ベークライト株式会社 | Insulating resin composition, insulating resin sheet and printed wiring board |
KR100621939B1 (en) * | 2002-05-30 | 2006-09-14 | 미쓰이 가가쿠 가부시키가이샤 | Adhesive resin and film adhesives made by using the same |
JP4695512B2 (en) | 2003-06-05 | 2011-06-08 | 株式会社カネカ | Phosphazene compound, photosensitive resin composition and use thereof |
JPWO2008015759A1 (en) | 2006-08-04 | 2009-12-17 | 日立化成工業株式会社 | Film adhesive, adhesive sheet, and semiconductor device using the same |
SG11201805612PA (en) * | 2016-02-08 | 2018-07-30 | Toray Industries | Resin Composition, Resin Layer, Permanent Adhesive, Adhesive For Temporary Bonding, Laminated Film, Processed Wafer, And Method For Manufacturing Electronic Component Or Semiconductor Device |
-
1994
- 1994-03-08 JP JP6036887A patent/JP3014578B2/en not_active Expired - Fee Related
-
1995
- 1995-02-24 MY MYPI95000472A patent/MY111987A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPH07242820A (en) | 1995-09-19 |
JP3014578B2 (en) | 2000-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR9406678A (en) | Process to produce a matrix compound | |
HK64096A (en) | Epoxy resin compositions | |
DE59705258D1 (en) | Liquid silicone rubber with reduced compression set | |
AU564441B2 (en) | Epoxy resin composition | |
MY110415A (en) | Polyarylene sulfide resin compositions | |
GB2148900B (en) | Curable compositions | |
TW354793B (en) | Polycarbonate resin with high flowability and process for producing the same | |
MY111987A (en) | Heat resistant resin composition, heat resistant film adhesive and process for producing the same | |
FI906436A0 (en) | ORGANISKA, SVAVEL INNEHAOLLANDE POLYFLUORFOERENINGAR. | |
FR2434118B1 (en) | ||
EP0206544A3 (en) | Instantaneously curable composition | |
BR8406282A (en) | PROCESS FOR THE PREPARATION OF ITEMS HAVING HIGH RESISTANCE TO TRACTION AND A HIGH MODULE, ITEMS SO OBTAINED AND POLYACRYLONITRILLA FILAMENTS | |
JPS6469677A (en) | Curing catalyst for cationic electrodeposition paint | |
KR910000328A (en) | Structural composite of fluoropolymer reinforced with continuous filament fibers | |
JPS641756A (en) | Epoxy resin composition for glass-epoxy laminate | |
DE59501989D1 (en) | CONDENSATION AND ADDITION POLYMERS WITH N, N'-BRIDGED TO TETRAMETHYL PIPERIDINYLOXY GROUPS | |
JPS56125429A (en) | Curable resin composition | |
NO874413L (en) | POLYMERS AND PROCEDURES FOR THEIR PREPARATION. | |
JPS6431828A (en) | Aromatic polyketone copolymer | |
TW200505957A (en) | Curable resin composition | |
JPS52117388A (en) | Method of bonding treatment | |
JPS5794720A (en) | Liquid crystal display element | |
JPS56159218A (en) | Epoxy resin composition | |
EP0491045A4 (en) | Novel phenol/aralkyl resin, production thereof, and epoxy resin composition containing the same | |
ES1000118U (en) | Exchange block units for cooling towers (Machine-translation by Google Translate, not legally binding) |