MY111987A - Heat resistant resin composition, heat resistant film adhesive and process for producing the same - Google Patents

Heat resistant resin composition, heat resistant film adhesive and process for producing the same

Info

Publication number
MY111987A
MY111987A MYPI95000472A MYPI19950472A MY111987A MY 111987 A MY111987 A MY 111987A MY PI95000472 A MYPI95000472 A MY PI95000472A MY PI19950472 A MYPI19950472 A MY PI19950472A MY 111987 A MY111987 A MY 111987A
Authority
MY
Malaysia
Prior art keywords
heat resistant
resin composition
film adhesive
producing
resistant film
Prior art date
Application number
MYPI95000472A
Inventor
Yoshida Tatsuhiro
Takahama Keizo
Okamyo Syusaku
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=12482296&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY111987(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of MY111987A publication Critical patent/MY111987A/en

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

A HEAT RESISTANT RESIN COMPOSITION COMPRISING, AS THE MAIN COMPONENTS,(A) 100 PARTS BY WEIGHT OF AN ORGANIC SOLVENT-SOLUBLE POLYIMIDE RESIN HAVING A GLASS TRANSITION TEMPERA-TURE .OF 350?C OR LESS,(B) 5 TO 100 PARTS BY WEIGHT OF AN EPOXY COMPOUND HAVING AT LEAST TWO EPOXY GROUPS IN ONE MOLECULE,AND(C) 0.1 TO 20 PARTS BY WEIGHT OF A COMPOUND HAVING AN ACTIVE HYDROGEN GROUP WHICH CAN REACT WITH THEEPOXY COMPOUND (B),A HEAT RESISTANT FILM ADHESIVE COMPRISING, AS THE MAIN COMPONENTS, THE ABOVE COMPONENTS (A), (B) AND (C), AND A PROCESS FOR PRODUCING A HEAT RESISTANT FILM ADHESIVE BY CASTING A SOLUTION OF THE ABOVE HEAT RESISTANT RESIN COMPOSITION ON ONE SIDE OR BOTH SIDES OF A SUPPORT.
MYPI95000472A 1994-03-08 1995-02-24 Heat resistant resin composition, heat resistant film adhesive and process for producing the same MY111987A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6036887A JP3014578B2 (en) 1994-03-08 1994-03-08 Resin composition with improved properties at high temperatures

Publications (1)

Publication Number Publication Date
MY111987A true MY111987A (en) 2001-03-31

Family

ID=12482296

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI95000472A MY111987A (en) 1994-03-08 1995-02-24 Heat resistant resin composition, heat resistant film adhesive and process for producing the same

Country Status (2)

Country Link
JP (1) JP3014578B2 (en)
MY (1) MY111987A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100333452B1 (en) 1994-12-26 2002-04-18 이사오 우치가사키 Film-like organic die-bonding material and semiconductor device using the same
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
AU4471797A (en) 1996-10-08 1998-05-05 Hitachi Chemical Company, Ltd. Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
JP4008249B2 (en) * 2001-01-31 2007-11-14 住友ベークライト株式会社 Insulating resin composition, insulating resin sheet and printed wiring board
KR100621939B1 (en) * 2002-05-30 2006-09-14 미쓰이 가가쿠 가부시키가이샤 Adhesive resin and film adhesives made by using the same
JP4695512B2 (en) 2003-06-05 2011-06-08 株式会社カネカ Phosphazene compound, photosensitive resin composition and use thereof
JPWO2008015759A1 (en) 2006-08-04 2009-12-17 日立化成工業株式会社 Film adhesive, adhesive sheet, and semiconductor device using the same
SG11201805612PA (en) * 2016-02-08 2018-07-30 Toray Industries Resin Composition, Resin Layer, Permanent Adhesive, Adhesive For Temporary Bonding, Laminated Film, Processed Wafer, And Method For Manufacturing Electronic Component Or Semiconductor Device

Also Published As

Publication number Publication date
JPH07242820A (en) 1995-09-19
JP3014578B2 (en) 2000-02-28

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