JPS56159218A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS56159218A
JPS56159218A JP6210180A JP6210180A JPS56159218A JP S56159218 A JPS56159218 A JP S56159218A JP 6210180 A JP6210180 A JP 6210180A JP 6210180 A JP6210180 A JP 6210180A JP S56159218 A JPS56159218 A JP S56159218A
Authority
JP
Japan
Prior art keywords
component
formula
epoxy resin
becomes
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6210180A
Other languages
Japanese (ja)
Other versions
JPS5729488B2 (en
Inventor
Masaaki Otsu
Masahiro Matsumura
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP6210180A priority Critical patent/JPS56159218A/en
Priority to DE19813117960 priority patent/DE3117960A1/en
Priority to US06/261,908 priority patent/US4399257A/en
Publication of JPS56159218A publication Critical patent/JPS56159218A/en
Publication of JPS5729488B2 publication Critical patent/JPS5729488B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: The titled composition that is made by using a polyvinyl phenol or its halogenated product as a curing agent and an organic tin salt with a specific structure as a curing aid, thus having prolonged gelling time and giving cured product with high thermal resistance.
CONSTITUTION: To (A) an epoxy resin of 100W4,000 epoxy equivalent, are added (B) a poly-p-vinylphenol, preferably with a weight-average molecular weight of 3,000W8,000, and/or its halogenated product, so that the molar ratio of the epoxy groups in the component (A) to the active hydrogens in the component (B) becomes 0.5W2, and further (C) a tin salt of organic acid with at least one of linkage of the tin atom directly to an organic group, shown by formula I (R is monovalent organic group; R' is residue of organic acid; n is 1W3), formula II or formula III, so that the amount of the component (C) becomes 0.05W5pts./100pts. of the component (A).
USE: Prepleg for printing circuit base.
COPYRIGHT: (C)1981,JPO&Japio
JP6210180A 1980-05-10 1980-05-10 Epoxy resin composition Granted JPS56159218A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6210180A JPS56159218A (en) 1980-05-10 1980-05-10 Epoxy resin composition
DE19813117960 DE3117960A1 (en) 1980-05-10 1981-05-07 EPOXY RESIN COMPOSITION
US06/261,908 US4399257A (en) 1980-05-10 1981-05-08 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6210180A JPS56159218A (en) 1980-05-10 1980-05-10 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS56159218A true JPS56159218A (en) 1981-12-08
JPS5729488B2 JPS5729488B2 (en) 1982-06-23

Family

ID=13190313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6210180A Granted JPS56159218A (en) 1980-05-10 1980-05-10 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS56159218A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57174280U (en) * 1981-04-30 1982-11-02

Also Published As

Publication number Publication date
JPS5729488B2 (en) 1982-06-23

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