JPS5454168A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5454168A
JPS5454168A JP12011277A JP12011277A JPS5454168A JP S5454168 A JPS5454168 A JP S5454168A JP 12011277 A JP12011277 A JP 12011277A JP 12011277 A JP12011277 A JP 12011277A JP S5454168 A JPS5454168 A JP S5454168A
Authority
JP
Japan
Prior art keywords
parts
epoxy resin
dispersing agent
resin composition
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12011277A
Other languages
Japanese (ja)
Inventor
Yasuo Hiyoshi
Ryoichi Sudo
Tokio Isogai
Tetsuo Tajima
Kazunari Takemoto
Ataru Yokono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12011277A priority Critical patent/JPS5454168A/en
Publication of JPS5454168A publication Critical patent/JPS5454168A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: A curable epoxy resin, a curable silicone resin and a dispersing agent are mixed to produce said epoxy resin composition with high anticracking property in with the physical properties do not reduce even after curing and the fluidity of the resin composition does not lower.
CONSTITUTION: Said composition comprised 100 parts by wt of a curable epoxy resin, 1W60 parts of a curable silicone rubber and 0.1W20 parts of a dispersing agent. The epoxy resin used consists of an epoxide having 1 or more epoxy groups per molecule on the average and a curing accelerator or, when necessary, the acelerator is removed. The dispersing agent is a silicone-alkyleneoxide copolymer consisting of polyoxyethylene polymer parts, polyoxypropylene polymer parts or polyoxyethylene- propylene copolymer parts and polydimethylsiloxane parts
COPYRIGHT: (C)1979,JPO&Japio
JP12011277A 1977-10-07 1977-10-07 Epoxy resin composition Pending JPS5454168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12011277A JPS5454168A (en) 1977-10-07 1977-10-07 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12011277A JPS5454168A (en) 1977-10-07 1977-10-07 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5454168A true JPS5454168A (en) 1979-04-28

Family

ID=14778227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12011277A Pending JPS5454168A (en) 1977-10-07 1977-10-07 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5454168A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558055A (en) * 1978-10-24 1980-04-30 Suisanchiyou Chiyoukan Treating of euphausiacea
JPS5834824A (en) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd Epoxy resin composition and its production
JPS5876455A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material for sealing and molded electronic parts using the same
JPS5996122A (en) * 1982-11-22 1984-06-02 Toray Silicone Co Ltd Thermosetting epoxy resin composition
JPS61101520A (en) * 1984-10-23 1986-05-20 Toshiba Chem Corp Sealing resin composition
US4624998A (en) * 1985-12-30 1986-11-25 Dow Corning Corporation Silicone-modified epoxy resins having improved impact resistance
JPS62270617A (en) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc Resin composition for semiconductor sealing
JPH01108254A (en) * 1987-10-19 1989-04-25 Shin Etsu Chem Co Ltd Curable epoxy resin composition
JPH03167250A (en) * 1989-11-27 1991-07-19 Matsushita Electric Works Ltd Epoxy resin composition
US5043211A (en) * 1987-03-31 1991-08-27 Kabushiki Kaisha Toshiba Epoxy resin composition and a resin-sealed semiconductor device
US5068267A (en) * 1988-09-13 1991-11-26 Kabushiki Kaisha Toshiba Semiconductor device encapsulant consisting of epoxy resin composition
US5258426A (en) * 1989-02-23 1993-11-02 Kabushiki Kaisha Toshiba Semiconductor device encapsulant
EP0818511A2 (en) * 1996-07-08 1998-01-14 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113773B2 (en) * 1978-10-24 1986-04-15 Suisancho Chokan
JPS5558055A (en) * 1978-10-24 1980-04-30 Suisanchiyou Chiyoukan Treating of euphausiacea
JPS5834824A (en) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd Epoxy resin composition and its production
JPH0138131B2 (en) * 1981-08-26 1989-08-11 Sumitomo Bakelite Co
JPS5876455A (en) * 1981-11-02 1983-05-09 Matsushita Electric Works Ltd Thermosetting resin molding material for sealing and molded electronic parts using the same
JPS6312489B2 (en) * 1982-11-22 1988-03-19 Toray Silicone Co
JPS5996122A (en) * 1982-11-22 1984-06-02 Toray Silicone Co Ltd Thermosetting epoxy resin composition
JPS61101520A (en) * 1984-10-23 1986-05-20 Toshiba Chem Corp Sealing resin composition
JPS6261215B2 (en) * 1984-10-23 1987-12-21 Toshiba Chem Prod
JPS62158716A (en) * 1985-12-30 1987-07-14 ダウ　コ−ニング　コ−ポレ−シヨン Silicone modifier dispersion and modifying method
US4624998A (en) * 1985-12-30 1986-11-25 Dow Corning Corporation Silicone-modified epoxy resins having improved impact resistance
JPH0512365B2 (en) * 1985-12-30 1993-02-17 Dow Corning
JPS62270617A (en) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc Resin composition for semiconductor sealing
JPH0531883B2 (en) * 1986-05-20 1993-05-13 Mitsui Toatsu Chemicals
US5043211A (en) * 1987-03-31 1991-08-27 Kabushiki Kaisha Toshiba Epoxy resin composition and a resin-sealed semiconductor device
JPH01108254A (en) * 1987-10-19 1989-04-25 Shin Etsu Chem Co Ltd Curable epoxy resin composition
US5068267A (en) * 1988-09-13 1991-11-26 Kabushiki Kaisha Toshiba Semiconductor device encapsulant consisting of epoxy resin composition
US5258426A (en) * 1989-02-23 1993-11-02 Kabushiki Kaisha Toshiba Semiconductor device encapsulant
JPH03167250A (en) * 1989-11-27 1991-07-19 Matsushita Electric Works Ltd Epoxy resin composition
EP0818511A2 (en) * 1996-07-08 1998-01-14 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part
EP0818511A3 (en) * 1996-07-08 1998-04-22 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part
US5872194A (en) * 1996-07-08 1999-02-16 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part

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