JPS5834824A - Epoxy resin composition and its production - Google Patents

Epoxy resin composition and its production

Info

Publication number
JPS5834824A
JPS5834824A JP13270481A JP13270481A JPS5834824A JP S5834824 A JPS5834824 A JP S5834824A JP 13270481 A JP13270481 A JP 13270481A JP 13270481 A JP13270481 A JP 13270481A JP S5834824 A JPS5834824 A JP S5834824A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
filler
silane
useful
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13270481A
Other languages
Japanese (ja)
Other versions
JPH0138131B2 (en
Inventor
Giyouji Hirata
Yukihisa Ikeda
Mitsuo Kakehi
Shigeru Koshibe
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP56132704A priority Critical patent/JPH0138131B2/ja
Publication of JPS5834824A publication Critical patent/JPS5834824A/en
Publication of JPH0138131B2 publication Critical patent/JPH0138131B2/ja
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To obtain an epoxy resin composition for semiconductor sealing having excellent moisture resistance and a low a stress, by adding strongly water-repellent flexible silane compound containing a silane coupling agent having a silanol functionality ≤2 to a resin material and reacting the mixture under an alkaline condition or in contact with superheated steam.
CONSTITUTION: A silane coupling agent, silane functionality ≤2, and 0.5W3% silicone oil are premixed with part or the whole of at least one material containing a filler in contact with superheated steam or under an alkaline condition of pH>8. Then the mixture is mixed with the remaining portion of the material. The epoxy resin thus produced is mixed with a curing agent, a cure accelerator, a filler, a mold release, a surface-treating agent, etc., to obtain the title epoxy resin composition. This composition is excellent in moisture resistance, useful as a semiconductor-sealing resin having a low stress and particularly useful in the mass production of parts of electrical devices and instruments.
COPYRIGHT: (C)1983,JPO&Japio
JP56132704A 1981-08-26 1981-08-26 Expired JPH0138131B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56132704A JPH0138131B2 (en) 1981-08-26 1981-08-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56132704A JPH0138131B2 (en) 1981-08-26 1981-08-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP20525387A Division JPH0411573B2 (en) 1987-08-20 1987-08-20

Publications (2)

Publication Number Publication Date
JPS5834824A true JPS5834824A (en) 1983-03-01
JPH0138131B2 JPH0138131B2 (en) 1989-08-11

Family

ID=15087602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56132704A Expired JPH0138131B2 (en) 1981-08-26 1981-08-26

Country Status (1)

Country Link
JP (1) JPH0138131B2 (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063951A (en) * 1983-09-16 1985-04-12 Hitachi Ltd Semiconductor device and manufacture thereof
JPS6112051A (en) * 1984-06-27 1986-01-20 Toshiba Corp Epoxy resin forming material for sealing semiconductor
JPS61127723A (en) * 1984-11-27 1986-06-16 Sumitomo Bakelite Co Ltd Molded article of luminescent or receiving element
JPS61183314A (en) * 1985-02-12 1986-08-16 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS61190550A (en) * 1985-02-19 1986-08-25 Sumitomo Bakelite Co Ltd Epoxy resin molding compound for semiconductor sealing
JPS61268720A (en) * 1984-12-26 1986-11-28 Kanegafuchi Chem Ind Co Ltd Curable resin composition
JPS6356518A (en) * 1986-08-27 1988-03-11 Rishiyou Kogyo Kk Epoxy resin composition
JPS63241061A (en) * 1986-11-13 1988-10-06 Sunstar Giken Kk Epoxy resin composition
JPS6490253A (en) * 1987-09-30 1989-04-06 Matsushita Electric Ind Co Ltd Epoxy resin composition and its production
JPH01185316A (en) * 1988-01-18 1989-07-24 Matsushita Electric Works Ltd Epoxy resin molding material
JPH02173155A (en) * 1988-12-27 1990-07-04 Toray Ind Inc Epoxy-containing composition
JPH02189357A (en) * 1989-01-19 1990-07-25 Matsushita Electric Works Ltd Epoxy resin molding material for semiconductor sealing
JPH0341146A (en) * 1989-12-15 1991-02-21 Hitachi Ltd Resin composition
US5043211A (en) * 1987-03-31 1991-08-27 Kabushiki Kaisha Toshiba Epoxy resin composition and a resin-sealed semiconductor device
JPH03245558A (en) * 1990-09-17 1991-11-01 Hitachi Ltd Semiconductor device
US5068267A (en) * 1988-09-13 1991-11-26 Kabushiki Kaisha Toshiba Semiconductor device encapsulant consisting of epoxy resin composition
US5258426A (en) * 1989-02-23 1993-11-02 Kabushiki Kaisha Toshiba Semiconductor device encapsulant
JPH09167815A (en) * 1996-11-18 1997-06-24 Hitachi Ltd Semiconductor device
JP2010211968A (en) * 2009-03-06 2010-09-24 Somar Corp Insulation paint for electronic component and electronic component using this

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431500A (en) * 1977-08-13 1979-03-08 Allied Chem Packing composition based on anhydride curable epoxy resin
JPS5454168A (en) * 1977-10-07 1979-04-28 Hitachi Chem Co Ltd Epoxy resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431500A (en) * 1977-08-13 1979-03-08 Allied Chem Packing composition based on anhydride curable epoxy resin
JPS5454168A (en) * 1977-10-07 1979-04-28 Hitachi Chem Co Ltd Epoxy resin composition

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063951A (en) * 1983-09-16 1985-04-12 Hitachi Ltd Semiconductor device and manufacture thereof
JPS6364055B2 (en) * 1983-09-16 1988-12-09
JPS6112051A (en) * 1984-06-27 1986-01-20 Toshiba Corp Epoxy resin forming material for sealing semiconductor
JPH0550542B2 (en) * 1984-06-27 1993-07-29 Tokyo Shibaura Electric Co
JPS61127723A (en) * 1984-11-27 1986-06-16 Sumitomo Bakelite Co Ltd Molded article of luminescent or receiving element
JPS61268720A (en) * 1984-12-26 1986-11-28 Kanegafuchi Chem Ind Co Ltd Curable resin composition
JPH0331726B2 (en) * 1984-12-26 1991-05-08 Kanegafuchi Chemical Ind
JPS61183314A (en) * 1985-02-12 1986-08-16 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPS61190550A (en) * 1985-02-19 1986-08-25 Sumitomo Bakelite Co Ltd Epoxy resin molding compound for semiconductor sealing
JPS6356518A (en) * 1986-08-27 1988-03-11 Rishiyou Kogyo Kk Epoxy resin composition
JPS63241061A (en) * 1986-11-13 1988-10-06 Sunstar Giken Kk Epoxy resin composition
US5043211A (en) * 1987-03-31 1991-08-27 Kabushiki Kaisha Toshiba Epoxy resin composition and a resin-sealed semiconductor device
JPS6490253A (en) * 1987-09-30 1989-04-06 Matsushita Electric Ind Co Ltd Epoxy resin composition and its production
JPH01185316A (en) * 1988-01-18 1989-07-24 Matsushita Electric Works Ltd Epoxy resin molding material
US5068267A (en) * 1988-09-13 1991-11-26 Kabushiki Kaisha Toshiba Semiconductor device encapsulant consisting of epoxy resin composition
JPH02173155A (en) * 1988-12-27 1990-07-04 Toray Ind Inc Epoxy-containing composition
JPH02189357A (en) * 1989-01-19 1990-07-25 Matsushita Electric Works Ltd Epoxy resin molding material for semiconductor sealing
US5258426A (en) * 1989-02-23 1993-11-02 Kabushiki Kaisha Toshiba Semiconductor device encapsulant
JPH0341146A (en) * 1989-12-15 1991-02-21 Hitachi Ltd Resin composition
JPH03245558A (en) * 1990-09-17 1991-11-01 Hitachi Ltd Semiconductor device
JPH0566024B2 (en) * 1990-09-17 1993-09-20 Hitachi Ltd
JPH09167815A (en) * 1996-11-18 1997-06-24 Hitachi Ltd Semiconductor device
JP2010211968A (en) * 2009-03-06 2010-09-24 Somar Corp Insulation paint for electronic component and electronic component using this

Also Published As

Publication number Publication date
JPH0138131B2 (en) 1989-08-11

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