JPS6490253A - Epoxy resin composition and its production - Google Patents

Epoxy resin composition and its production

Info

Publication number
JPS6490253A
JPS6490253A JP24643187A JP24643187A JPS6490253A JP S6490253 A JPS6490253 A JP S6490253A JP 24643187 A JP24643187 A JP 24643187A JP 24643187 A JP24643187 A JP 24643187A JP S6490253 A JPS6490253 A JP S6490253A
Authority
JP
Japan
Prior art keywords
component
epoxy resin
coated
water
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24643187A
Other languages
Japanese (ja)
Other versions
JPH0725992B2 (en
Inventor
Toshio Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62246431A priority Critical patent/JPH0725992B2/en
Publication of JPS6490253A publication Critical patent/JPS6490253A/en
Publication of JPH0725992B2 publication Critical patent/JPH0725992B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain the title composition for sealing electronic components, excellent in water resistance, adhesiveness, flow properties, etc., by mixing an epoxy resin with a curing agent, an inorganic filler coated with a specified water-repellent surface treatment and coated with a coupling agent. CONSTITUTION:The surface of an inorganic filler (a) (e.g., fused silica) particles are coated with 0.1-2.0wt.%, based on component (a), water-repellent surface treatment of the formula (wherein R1-5 are each H, a 1-6C alkyl phenyl, l>=0, 1<=m<=3, 0<=n<=z, and m+n=2), e.g., dimethylpolysiloxysilazane, and then coated with 0.1-2.0wt.%, based on component (A), coupling agent (e.g., gamma- glycidoxypropyl-trimethoxysilane) to obtain component (C) comprising compo nents (a), (b) and (c). An epoxy resin (A) (e.g., solid cresol novolac epoxy resin) is mixed with a curing agent (B) (e.g., phenol novolac resin) and component C containing component (a) in an amount of 30-90wt.% based on the obtained composition.
JP62246431A 1987-09-30 1987-09-30 Epoxy resin composition and method for producing the same Expired - Lifetime JPH0725992B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62246431A JPH0725992B2 (en) 1987-09-30 1987-09-30 Epoxy resin composition and method for producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62246431A JPH0725992B2 (en) 1987-09-30 1987-09-30 Epoxy resin composition and method for producing the same

Publications (2)

Publication Number Publication Date
JPS6490253A true JPS6490253A (en) 1989-04-06
JPH0725992B2 JPH0725992B2 (en) 1995-03-22

Family

ID=17148379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62246431A Expired - Lifetime JPH0725992B2 (en) 1987-09-30 1987-09-30 Epoxy resin composition and method for producing the same

Country Status (1)

Country Link
JP (1) JPH0725992B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005171208A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Filler and resin composition
JP2005171199A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Slightly basic alumina powdery material, method for producing the same and resin composition
JP2010211968A (en) * 2009-03-06 2010-09-24 Somar Corp Insulation paint for electronic component and electronic component using this

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834824A (en) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd Epoxy resin composition and its production
JPS59227926A (en) * 1983-06-09 1984-12-21 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor sealing
JPS61219A (en) * 1984-06-13 1986-01-06 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS61264044A (en) * 1985-05-17 1986-11-21 Hitachi Chem Co Ltd Epoxy resin composition
JPS6356518A (en) * 1986-08-27 1988-03-11 Rishiyou Kogyo Kk Epoxy resin composition
JPS63156816A (en) * 1986-12-22 1988-06-29 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor
JPS63299149A (en) * 1987-05-28 1988-12-06 Nitto Electric Ind Co Ltd Semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834824A (en) * 1981-08-26 1983-03-01 Sumitomo Bakelite Co Ltd Epoxy resin composition and its production
JPS59227926A (en) * 1983-06-09 1984-12-21 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor sealing
JPS61219A (en) * 1984-06-13 1986-01-06 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS61264044A (en) * 1985-05-17 1986-11-21 Hitachi Chem Co Ltd Epoxy resin composition
JPS6356518A (en) * 1986-08-27 1988-03-11 Rishiyou Kogyo Kk Epoxy resin composition
JPS63156816A (en) * 1986-12-22 1988-06-29 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor
JPS63299149A (en) * 1987-05-28 1988-12-06 Nitto Electric Ind Co Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005171208A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Filler and resin composition
JP2005171199A (en) * 2003-12-15 2005-06-30 Toyota Motor Corp Slightly basic alumina powdery material, method for producing the same and resin composition
JP2010211968A (en) * 2009-03-06 2010-09-24 Somar Corp Insulation paint for electronic component and electronic component using this

Also Published As

Publication number Publication date
JPH0725992B2 (en) 1995-03-22

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