JPS5679170A - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number
JPS5679170A
JPS5679170A JP15300279A JP15300279A JPS5679170A JP S5679170 A JPS5679170 A JP S5679170A JP 15300279 A JP15300279 A JP 15300279A JP 15300279 A JP15300279 A JP 15300279A JP S5679170 A JPS5679170 A JP S5679170A
Authority
JP
Japan
Prior art keywords
phenolic resin
adhesive
type phenolic
1w20pts
100pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15300279A
Other languages
Japanese (ja)
Other versions
JPS6241548B2 (en
Inventor
Tetsuo Hayashi
Kunio Kageyama
Shigeo Omote
Yoshiaki Someya
Original Assignee
Yokohama Rubber Co Ltd:The
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd:The filed Critical Yokohama Rubber Co Ltd:The
Priority to JP15300279A priority Critical patent/JPS6241548B2/ja
Publication of JPS5679170A publication Critical patent/JPS5679170A/en
Publication of JPS6241548B2 publication Critical patent/JPS6241548B2/ja
Expired legal-status Critical Current

Links

Abstract

PURPOSE: An adhesive composition having improved heat resistance, water resistance, and storage stability, obtained by blending an epoxy resin with a resol type phenolic resin, novolak type phenolic resin, and amine compound in a specific ratio.
CONSTITUTION: The desired adhesive comprising (A) 100pts.wt. epoxy resin (e.g., bisphenol type, glycidyl ether type, etc.), (B) 3W50pts.wt. resol type phenolic resin (preferably 2,6-dimethylolphenol), (C) 1W20pts.wt. novolak type phenolic resin (e.g., dihydroxydiphenylmethane derivative), (D) 1W20pts.wt. amine compound (preferably hexamethylenetetramine) based on 100pts.wt. total amount of the ingredients B and C. Preferably dicyandiamide, etc. are used as a curing agent, and an imidazole derivative, etc. are used as an accelerator.
USE: Useful as an adhesive for building construction, e.g., car, railway, and building, by making a tape adhesive with a substrate.
COPYRIGHT: (C)1981,JPO&Japio
JP15300279A 1979-11-28 1979-11-28 Expired JPS6241548B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15300279A JPS6241548B2 (en) 1979-11-28 1979-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15300279A JPS6241548B2 (en) 1979-11-28 1979-11-28

Publications (2)

Publication Number Publication Date
JPS5679170A true JPS5679170A (en) 1981-06-29
JPS6241548B2 JPS6241548B2 (en) 1987-09-03

Family

ID=15552792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15300279A Expired JPS6241548B2 (en) 1979-11-28 1979-11-28

Country Status (1)

Country Link
JP (1) JPS6241548B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827716A (en) * 1981-08-11 1983-02-18 Asahi Chem Ind Co Ltd Curing agent composition for aqueous dispersion of epoxy resin
JPS62141082A (en) * 1985-12-13 1987-06-24 Nok Corp Vulcanizing adhesive composition and bonding by using it
WO1991005005A1 (en) * 1989-09-29 1991-04-18 Uniroyal Chemical Company, Inc. Tire compounds
JP2005536590A (en) * 2002-08-19 2005-12-02 スリーエム イノベイティブ プロパティズ カンパニー Epoxy compositions having improved shelf life and articles containing them
JP2007302843A (en) * 2006-05-15 2007-11-22 Hitachi Chem Co Ltd Method for producing curing agent, and thermosetting resin composition using the same
JP2008222851A (en) * 2007-03-13 2008-09-25 Sumitomo Bakelite Co Ltd Phenol resin composition for friction material, production method thereof and friction material
US7462651B2 (en) 2005-04-04 2008-12-09 National Starch And Chemical Investment Holding Corporation Radiation-curable desiccant-filled adhesive/sealant
US7687119B2 (en) 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
JP2011105945A (en) * 2011-01-04 2011-06-02 Hitachi Chem Co Ltd Method for producing curing agent, and thermosetting resin composition using the same

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827716A (en) * 1981-08-11 1983-02-18 Asahi Chem Ind Co Ltd Curing agent composition for aqueous dispersion of epoxy resin
JPH0368053B2 (en) * 1981-08-11 1991-10-25 Asahi Chemical Ind
JPS62141082A (en) * 1985-12-13 1987-06-24 Nok Corp Vulcanizing adhesive composition and bonding by using it
JPH0586987B2 (en) * 1985-12-13 1993-12-15 Nok Corp
WO1991005005A1 (en) * 1989-09-29 1991-04-18 Uniroyal Chemical Company, Inc. Tire compounds
JP2005536590A (en) * 2002-08-19 2005-12-02 スリーエム イノベイティブ プロパティズ カンパニー Epoxy compositions having improved shelf life and articles containing them
US7462651B2 (en) 2005-04-04 2008-12-09 National Starch And Chemical Investment Holding Corporation Radiation-curable desiccant-filled adhesive/sealant
US7687119B2 (en) 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
JP2007302843A (en) * 2006-05-15 2007-11-22 Hitachi Chem Co Ltd Method for producing curing agent, and thermosetting resin composition using the same
JP4735410B2 (en) * 2006-05-15 2011-07-27 日立化成工業株式会社 Method for producing curing agent, and thermosetting resin composition using the same
JP2008222851A (en) * 2007-03-13 2008-09-25 Sumitomo Bakelite Co Ltd Phenol resin composition for friction material, production method thereof and friction material
JP2011105945A (en) * 2011-01-04 2011-06-02 Hitachi Chem Co Ltd Method for producing curing agent, and thermosetting resin composition using the same

Also Published As

Publication number Publication date
JPS6241548B2 (en) 1987-09-03

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