JPS54110297A - Epoxy resin composition for encapsulating semiconductor device - Google Patents
Epoxy resin composition for encapsulating semiconductor deviceInfo
- Publication number
- JPS54110297A JPS54110297A JP1649978A JP1649978A JPS54110297A JP S54110297 A JPS54110297 A JP S54110297A JP 1649978 A JP1649978 A JP 1649978A JP 1649978 A JP1649978 A JP 1649978A JP S54110297 A JPS54110297 A JP S54110297A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing agent
- semiconductor device
- phenolic compound
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prepare a resin composition for encapsulating semiconductor device, having rapid curability and excellent storage stability and leakage current characteristics, and comprising an epoxy resin and a curing agent composition consisting of a specific phenolic compound and triethylammonium-tetraphenyl borate.
CONSTITUTION: A phenolic compound having three of more phenolic hydroxyl groups, e.g. novolak resin, etc., is prepared by addition condensation of a phenol with formaldehyde. Melt mixing of 100 parts by weight of the phenolic compound with preferably 5W10 parts by weight of triethylammoniumtetraphenyl borate at 100W180°C gives a curing agent. An epoxy resin, e.g. glycidyl ether type, etc., is compounded with the curing agent, wherein the amount of the phenolic hydroxyl group is 0.7W1.2 equivalent on the basis of the epoxy group, to given the desired composition.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1649978A JPS6056172B2 (en) | 1978-02-17 | 1978-02-17 | Epoxy resin composition for encapsulating semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1649978A JPS6056172B2 (en) | 1978-02-17 | 1978-02-17 | Epoxy resin composition for encapsulating semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54110297A true JPS54110297A (en) | 1979-08-29 |
JPS6056172B2 JPS6056172B2 (en) | 1985-12-09 |
Family
ID=11917963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1649978A Expired JPS6056172B2 (en) | 1978-02-17 | 1978-02-17 | Epoxy resin composition for encapsulating semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6056172B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
JPH0841176A (en) * | 1995-06-26 | 1996-02-13 | Toshiba Corp | Sealing epoxy resin composition and semiconductor device sealed therewith |
-
1978
- 1978-02-17 JP JP1649978A patent/JPS6056172B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5967660A (en) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | Resin sealed type semiconductor device |
JPH0379370B2 (en) * | 1982-10-12 | 1991-12-18 | Tokyo Shibaura Electric Co | |
JPH0841176A (en) * | 1995-06-26 | 1996-02-13 | Toshiba Corp | Sealing epoxy resin composition and semiconductor device sealed therewith |
Also Published As
Publication number | Publication date |
---|---|
JPS6056172B2 (en) | 1985-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5679170A (en) | Adhesive composition | |
JPS54110297A (en) | Epoxy resin composition for encapsulating semiconductor device | |
JPS5426000A (en) | Epoxy resin composition | |
JPS5723625A (en) | Epoxy resin composition and resin-sealed semiconductor device | |
JPS555929A (en) | Semiconductor sealing epoxy resin composition | |
JPS51135999A (en) | Epoxy res in composition | |
JPS5454199A (en) | Epoxy resin composition | |
JPS55156341A (en) | Resin composition for realing electronic parts | |
JPS5599981A (en) | Adhesive composition | |
JPS5659841A (en) | Epoxy resin composition | |
JPS56145919A (en) | Thermosetting resin composition | |
JPS57100128A (en) | Epoxy resin composition | |
JPS5278293A (en) | Phenolic pesin compositions for injection molding | |
JPS5578013A (en) | Epoxy resin composition | |
JPS54133592A (en) | Preparation of novolak-type phenolic resin | |
JPS55155020A (en) | Epoxy resin composition | |
JPS5659840A (en) | Epoxy resin composition | |
JPS5437200A (en) | Epoxy resin composition | |
JPS5573725A (en) | Epoxy resin composition for carbon fiber reinforced plastics | |
JPS55147524A (en) | Epoxy resin composition for prepreg | |
JPS55155019A (en) | Epoxy resin conposition | |
JPS57195773A (en) | Powdered resin composition for electrical insulating coating | |
JPS56126950A (en) | Method of sealing semiconductor element with resin | |
JPS5725322A (en) | Epoxy resin composition | |
JPS5566914A (en) | Preparation of resol resin |