JPS54110297A - Epoxy resin composition for encapsulating semiconductor device - Google Patents

Epoxy resin composition for encapsulating semiconductor device

Info

Publication number
JPS54110297A
JPS54110297A JP1649978A JP1649978A JPS54110297A JP S54110297 A JPS54110297 A JP S54110297A JP 1649978 A JP1649978 A JP 1649978A JP 1649978 A JP1649978 A JP 1649978A JP S54110297 A JPS54110297 A JP S54110297A
Authority
JP
Japan
Prior art keywords
epoxy resin
curing agent
semiconductor device
phenolic compound
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1649978A
Other languages
Japanese (ja)
Other versions
JPS6056172B2 (en
Inventor
Masahiro Kitamura
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP1649978A priority Critical patent/JPS6056172B2/en
Publication of JPS54110297A publication Critical patent/JPS54110297A/en
Publication of JPS6056172B2 publication Critical patent/JPS6056172B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To prepare a resin composition for encapsulating semiconductor device, having rapid curability and excellent storage stability and leakage current characteristics, and comprising an epoxy resin and a curing agent composition consisting of a specific phenolic compound and triethylammonium-tetraphenyl borate.
CONSTITUTION: A phenolic compound having three of more phenolic hydroxyl groups, e.g. novolak resin, etc., is prepared by addition condensation of a phenol with formaldehyde. Melt mixing of 100 parts by weight of the phenolic compound with preferably 5W10 parts by weight of triethylammoniumtetraphenyl borate at 100W180°C gives a curing agent. An epoxy resin, e.g. glycidyl ether type, etc., is compounded with the curing agent, wherein the amount of the phenolic hydroxyl group is 0.7W1.2 equivalent on the basis of the epoxy group, to given the desired composition.
COPYRIGHT: (C)1979,JPO&Japio
JP1649978A 1978-02-17 1978-02-17 Epoxy resin composition for encapsulating semiconductor devices Expired JPS6056172B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1649978A JPS6056172B2 (en) 1978-02-17 1978-02-17 Epoxy resin composition for encapsulating semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1649978A JPS6056172B2 (en) 1978-02-17 1978-02-17 Epoxy resin composition for encapsulating semiconductor devices

Publications (2)

Publication Number Publication Date
JPS54110297A true JPS54110297A (en) 1979-08-29
JPS6056172B2 JPS6056172B2 (en) 1985-12-09

Family

ID=11917963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1649978A Expired JPS6056172B2 (en) 1978-02-17 1978-02-17 Epoxy resin composition for encapsulating semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6056172B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JPH0841176A (en) * 1995-06-26 1996-02-13 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (en) * 1982-10-12 1984-04-17 Toshiba Corp Resin sealed type semiconductor device
JPH0379370B2 (en) * 1982-10-12 1991-12-18 Tokyo Shibaura Electric Co
JPH0841176A (en) * 1995-06-26 1996-02-13 Toshiba Corp Sealing epoxy resin composition and semiconductor device sealed therewith

Also Published As

Publication number Publication date
JPS6056172B2 (en) 1985-12-09

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