JPS555929A - Semiconductor sealing epoxy resin composition - Google Patents
Semiconductor sealing epoxy resin compositionInfo
- Publication number
- JPS555929A JPS555929A JP7770778A JP7770778A JPS555929A JP S555929 A JPS555929 A JP S555929A JP 7770778 A JP7770778 A JP 7770778A JP 7770778 A JP7770778 A JP 7770778A JP S555929 A JPS555929 A JP S555929A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- semiconductor sealing
- sealing epoxy
- diaza
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: An epoxy resin composition capable of improving the life of semiconductors sealed in a resin at a high temperature and humidity, comprising an epoxy resin, a phenol novolak, and 1,8-diaza-bicyclo(5.4.0)undecene.
CONSTITUTION: An epoxy resin composition comprising (A) a phenol novolak as a curing agent, (B) 1,8-diaza-bicyclo(5.4.0)undecene-7 or its derivative as a curing accelerator, and (C) an epoxy resin. The novolak is preferably used in an amount to give about 0.5W2.0, preferably about one, phenolic hydroxyl groups per epoxy group in the epoxy resin. A phenolate, 2-ethylhexanoate, or carbonate may be cited as the derivative.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7770778A JPS555929A (en) | 1978-06-26 | 1978-06-26 | Semiconductor sealing epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7770778A JPS555929A (en) | 1978-06-26 | 1978-06-26 | Semiconductor sealing epoxy resin composition |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57077132A Division JPS57210647A (en) | 1982-05-08 | 1982-05-08 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS555929A true JPS555929A (en) | 1980-01-17 |
Family
ID=13641359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7770778A Pending JPS555929A (en) | 1978-06-26 | 1978-06-26 | Semiconductor sealing epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS555929A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5694761A (en) * | 1979-12-28 | 1981-07-31 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor sealing |
JPS6086175A (en) * | 1983-10-19 | 1985-05-15 | Sumitomo Deyurezu Kk | Epoxy resin powder coating material composition |
JPS6088080A (en) * | 1983-10-20 | 1985-05-17 | Sumitomo Deyurezu Kk | Powdered epoxy resin paint composition |
JPH05256459A (en) * | 1991-12-20 | 1993-10-05 | Matsushita Electric Ind Co Ltd | Heating cooker |
US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010897A (en) * | 1973-06-04 | 1975-02-04 | ||
JPS5010898A (en) * | 1973-06-04 | 1975-02-04 | ||
JPS50108400A (en) * | 1974-02-01 | 1975-08-26 |
-
1978
- 1978-06-26 JP JP7770778A patent/JPS555929A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5010897A (en) * | 1973-06-04 | 1975-02-04 | ||
JPS5010898A (en) * | 1973-06-04 | 1975-02-04 | ||
JPS50108400A (en) * | 1974-02-01 | 1975-08-26 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5694761A (en) * | 1979-12-28 | 1981-07-31 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor sealing |
JPS621612B2 (en) * | 1979-12-28 | 1987-01-14 | Nitto Electric Ind Co | |
JPS6086175A (en) * | 1983-10-19 | 1985-05-15 | Sumitomo Deyurezu Kk | Epoxy resin powder coating material composition |
JPH0223583B2 (en) * | 1983-10-19 | 1990-05-24 | Sumitomo Durez Co | |
JPS6088080A (en) * | 1983-10-20 | 1985-05-17 | Sumitomo Deyurezu Kk | Powdered epoxy resin paint composition |
JPH0223584B2 (en) * | 1983-10-20 | 1990-05-24 | Sumitomo Durez Co | |
JPH05256459A (en) * | 1991-12-20 | 1993-10-05 | Matsushita Electric Ind Co Ltd | Heating cooker |
US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
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