JPS557853A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS557853A JPS557853A JP8057078A JP8057078A JPS557853A JP S557853 A JPS557853 A JP S557853A JP 8057078 A JP8057078 A JP 8057078A JP 8057078 A JP8057078 A JP 8057078A JP S557853 A JPS557853 A JP S557853A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- heat
- resin composition
- solvent
- allylphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: The title composition capable of showing improved electrical and mechanical properties even at a high temperature, comprising an α,β-unsaturated compound, an amino group-containing allylphenol compound, an epoxy resin, and a curing agent.
CONSTITUTION: A composition comprising (A) 5W85 wt% of an α,β-unsaturated compound, e.g. (meth)acrylic acid, (B) 5W70 wt% of an amino group-containing allylphenol and/or an allylphenyl ether, (C) 5W80 wt% of an epoxy resin, and (D) 1W1.6 equivalents per epoxy equivalent of a curing agent, e.g. an acid anhydride.
EFFECT: The composition can be used in either of the solvent or solvent-less type with the properties retained even at a high temperature above 150°C.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8057078A JPS557853A (en) | 1978-07-04 | 1978-07-04 | Heat-resistant resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8057078A JPS557853A (en) | 1978-07-04 | 1978-07-04 | Heat-resistant resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS557853A true JPS557853A (en) | 1980-01-21 |
JPS5650899B2 JPS5650899B2 (en) | 1981-12-02 |
Family
ID=13721988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8057078A Granted JPS557853A (en) | 1978-07-04 | 1978-07-04 | Heat-resistant resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS557853A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6243413A (en) * | 1985-08-20 | 1987-02-25 | Hitachi Chem Co Ltd | Thermosetting resin composition |
US5237042A (en) * | 1991-06-12 | 1993-08-17 | Korea Institute Of Science And Technology | Process for the preparation of polybutylene terephthalate based polymer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS531297A (en) * | 1976-06-25 | 1978-01-09 | Toshiba Chem Corp | Heat-resistant resin compositions for molding |
JPS5340099A (en) * | 1976-09-27 | 1978-04-12 | Toshiba Corp | Thermosetting resin composition |
-
1978
- 1978-07-04 JP JP8057078A patent/JPS557853A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS531297A (en) * | 1976-06-25 | 1978-01-09 | Toshiba Chem Corp | Heat-resistant resin compositions for molding |
JPS5340099A (en) * | 1976-09-27 | 1978-04-12 | Toshiba Corp | Thermosetting resin composition |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6243413A (en) * | 1985-08-20 | 1987-02-25 | Hitachi Chem Co Ltd | Thermosetting resin composition |
JPH0430965B2 (en) * | 1985-08-20 | 1992-05-25 | ||
US5237042A (en) * | 1991-06-12 | 1993-08-17 | Korea Institute Of Science And Technology | Process for the preparation of polybutylene terephthalate based polymer |
Also Published As
Publication number | Publication date |
---|---|
JPS5650899B2 (en) | 1981-12-02 |
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