JPS5340099A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5340099A
JPS5340099A JP11563376A JP11563376A JPS5340099A JP S5340099 A JPS5340099 A JP S5340099A JP 11563376 A JP11563376 A JP 11563376A JP 11563376 A JP11563376 A JP 11563376A JP S5340099 A JPS5340099 A JP S5340099A
Authority
JP
Japan
Prior art keywords
resin composition
thermosetting resin
compound
formulating
prepare
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11563376A
Other languages
Japanese (ja)
Other versions
JPS6021170B2 (en
Inventor
Takeo Ito
Moriyasu Wada
Shiyuichi Suzuki
Yukikimi Mikogami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11563376A priority Critical patent/JPS6021170B2/en
Publication of JPS5340099A publication Critical patent/JPS5340099A/en
Publication of JPS6021170B2 publication Critical patent/JPS6021170B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare a liquid or low-melting thermosetting resin composition with good heat resistance, electrical insulating properties, storage stability and having a long pot life by formulating a polyhydric phenolic compound, polyvalent maleimide compound and epoxy compound.
COPYRIGHT: (C)1978,JPO&Japio
JP11563376A 1976-09-27 1976-09-27 thermosetting resin composition Expired JPS6021170B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11563376A JPS6021170B2 (en) 1976-09-27 1976-09-27 thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11563376A JPS6021170B2 (en) 1976-09-27 1976-09-27 thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS5340099A true JPS5340099A (en) 1978-04-12
JPS6021170B2 JPS6021170B2 (en) 1985-05-25

Family

ID=14667467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11563376A Expired JPS6021170B2 (en) 1976-09-27 1976-09-27 thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS6021170B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341398A (en) * 1976-09-28 1978-04-14 Toshiba Corp Heat resistant resin composition
JPS54129097A (en) * 1978-03-31 1979-10-06 Hitachi Ltd Resin composition
JPS557853A (en) * 1978-07-04 1980-01-21 Toshiba Corp Heat-resistant resin composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5602552B2 (en) 2010-09-17 2014-10-08 Ｎｔｎ株式会社 Processing equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5341398A (en) * 1976-09-28 1978-04-14 Toshiba Corp Heat resistant resin composition
JPS5737603B2 (en) * 1976-09-28 1982-08-11
JPS54129097A (en) * 1978-03-31 1979-10-06 Hitachi Ltd Resin composition
JPS557853A (en) * 1978-07-04 1980-01-21 Toshiba Corp Heat-resistant resin composition
JPS5650899B2 (en) * 1978-07-04 1981-12-02

Also Published As

Publication number Publication date
JPS6021170B2 (en) 1985-05-25

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