JPS5571719A - Epoxy resin composition having improved crack resistance - Google Patents

Epoxy resin composition having improved crack resistance

Info

Publication number
JPS5571719A
JPS5571719A JP14536878A JP14536878A JPS5571719A JP S5571719 A JPS5571719 A JP S5571719A JP 14536878 A JP14536878 A JP 14536878A JP 14536878 A JP14536878 A JP 14536878A JP S5571719 A JPS5571719 A JP S5571719A
Authority
JP
Japan
Prior art keywords
parts
epoxy resin
compound
liquid
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14536878A
Other languages
Japanese (ja)
Other versions
JPS5545570B2 (en
Inventor
Tetsuo Tajima
Yasuo Hiyoshi
Ataru Yokono
Etsuo Tsurumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP14536878A priority Critical patent/JPS5571719A/en
Publication of JPS5571719A publication Critical patent/JPS5571719A/en
Publication of JPS5545570B2 publication Critical patent/JPS5545570B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: The title composition for use as an electrical insulating material free from a fall of glass transition temperature, obtained by blending an epoxy compound with an acid anhydride curing agent liquid at normal temperatures, a specific group- containing aliphatic polyester, an imidazole compound, and scaly mica powder.
CONSTITUTION: An epoxy resin composition consisting of (A) 100 parts by wt. of an epoxy compound, (B) 50W90 parts by wt. of an acid anhydride curing agent being liquid at 25°C, (C) 5W100 parts by wt. of a carboxyl group-containing aliphatic polyester with an acid value of 20W200, being liquid at 25°C, (D) 0.05W 10 parts by wt. of an imidazole compound, and (E) 5W50 parts by wt. of scaly mica powder with particle diameters of 5W1000μm and thickness of not more than one-tenth of its diameter. A mixture of bisphenol A type epoxy resin and butylglycidyl ether, etc. may be cited as A; methyltetrahydrophthalic anhydride, as B. A compound shown by the formula (R1 and R2 are abkylene; n is 2W30) may be cited as C; benzylmethylamine, as D.
COPYRIGHT: (C)1980,JPO&Japio
JP14536878A 1978-11-27 1978-11-27 Epoxy resin composition having improved crack resistance Granted JPS5571719A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14536878A JPS5571719A (en) 1978-11-27 1978-11-27 Epoxy resin composition having improved crack resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14536878A JPS5571719A (en) 1978-11-27 1978-11-27 Epoxy resin composition having improved crack resistance

Publications (2)

Publication Number Publication Date
JPS5571719A true JPS5571719A (en) 1980-05-30
JPS5545570B2 JPS5545570B2 (en) 1980-11-18

Family

ID=15383591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14536878A Granted JPS5571719A (en) 1978-11-27 1978-11-27 Epoxy resin composition having improved crack resistance

Country Status (1)

Country Link
JP (1) JPS5571719A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03170545A (en) * 1989-11-30 1991-07-24 Somar Corp Liquid epoxy resin composition
JP2019178209A (en) * 2018-03-30 2019-10-17 味の素株式会社 Resin composition and cured body thereof
TWI813651B (en) * 2018-03-23 2023-09-01 日商味之素股份有限公司 Adhesive for sealing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03170545A (en) * 1989-11-30 1991-07-24 Somar Corp Liquid epoxy resin composition
TWI813651B (en) * 2018-03-23 2023-09-01 日商味之素股份有限公司 Adhesive for sealing
JP2019178209A (en) * 2018-03-30 2019-10-17 味の素株式会社 Resin composition and cured body thereof

Also Published As

Publication number Publication date
JPS5545570B2 (en) 1980-11-18

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