JPS5571719A - Epoxy resin composition having improved crack resistance - Google Patents
Epoxy resin composition having improved crack resistanceInfo
- Publication number
- JPS5571719A JPS5571719A JP14536878A JP14536878A JPS5571719A JP S5571719 A JPS5571719 A JP S5571719A JP 14536878 A JP14536878 A JP 14536878A JP 14536878 A JP14536878 A JP 14536878A JP S5571719 A JPS5571719 A JP S5571719A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- epoxy resin
- compound
- liquid
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: The title composition for use as an electrical insulating material free from a fall of glass transition temperature, obtained by blending an epoxy compound with an acid anhydride curing agent liquid at normal temperatures, a specific group- containing aliphatic polyester, an imidazole compound, and scaly mica powder.
CONSTITUTION: An epoxy resin composition consisting of (A) 100 parts by wt. of an epoxy compound, (B) 50W90 parts by wt. of an acid anhydride curing agent being liquid at 25°C, (C) 5W100 parts by wt. of a carboxyl group-containing aliphatic polyester with an acid value of 20W200, being liquid at 25°C, (D) 0.05W 10 parts by wt. of an imidazole compound, and (E) 5W50 parts by wt. of scaly mica powder with particle diameters of 5W1000μm and thickness of not more than one-tenth of its diameter. A mixture of bisphenol A type epoxy resin and butylglycidyl ether, etc. may be cited as A; methyltetrahydrophthalic anhydride, as B. A compound shown by the formula (R1 and R2 are abkylene; n is 2W30) may be cited as C; benzylmethylamine, as D.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14536878A JPS5571719A (en) | 1978-11-27 | 1978-11-27 | Epoxy resin composition having improved crack resistance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14536878A JPS5571719A (en) | 1978-11-27 | 1978-11-27 | Epoxy resin composition having improved crack resistance |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5571719A true JPS5571719A (en) | 1980-05-30 |
JPS5545570B2 JPS5545570B2 (en) | 1980-11-18 |
Family
ID=15383591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14536878A Granted JPS5571719A (en) | 1978-11-27 | 1978-11-27 | Epoxy resin composition having improved crack resistance |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5571719A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03170545A (en) * | 1989-11-30 | 1991-07-24 | Somar Corp | Liquid epoxy resin composition |
JP2019178209A (en) * | 2018-03-30 | 2019-10-17 | 味の素株式会社 | Resin composition and cured body thereof |
TWI813651B (en) * | 2018-03-23 | 2023-09-01 | 日商味之素股份有限公司 | Adhesive for sealing |
-
1978
- 1978-11-27 JP JP14536878A patent/JPS5571719A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03170545A (en) * | 1989-11-30 | 1991-07-24 | Somar Corp | Liquid epoxy resin composition |
TWI813651B (en) * | 2018-03-23 | 2023-09-01 | 日商味之素股份有限公司 | Adhesive for sealing |
JP2019178209A (en) * | 2018-03-30 | 2019-10-17 | 味の素株式会社 | Resin composition and cured body thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS5545570B2 (en) | 1980-11-18 |
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