JPS5716023A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5716023A JPS5716023A JP9061980A JP9061980A JPS5716023A JP S5716023 A JPS5716023 A JP S5716023A JP 9061980 A JP9061980 A JP 9061980A JP 9061980 A JP9061980 A JP 9061980A JP S5716023 A JPS5716023 A JP S5716023A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- polyhydroxystyrene
- reaction product
- dicarboxylic acid
- ethylenically unsaturated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: Titled composition having a low modulus of elasticity, a low coefficient of linear expansion and a high glass transition point, consisting of a polyfunctional epoxy compound, a melt reaction product between an ethylenically unsaturated dicarboxylic acid anhydride and an aromatic diamine, a polyhydroxystyrene and an inorganic filler.
CONSTITUTION: The following components (A), (B), (C) and (D) are mixed together so that D/(A+B+C+D) corresponds to 50W80vol%: (A) a polyfunctional epoxy compound, e.g., diglycidyl ether of bisphenol A, (B) a melt reaction product of 1mol of ethylenically unsaturated dicarboxylic acid anhydride, e.g., maleic anhydride, and 2W20mol of aromatic diamine, e.g., m-phenylenediamine, (C) a polyhydroxystyrene, e.g., o-vinylphenol polymer, and (D) an inorganic filler, e.g., fused quartz glass powder.
EFFECT: It is possible to obtain a resin composition having excellent heat resistance, a glass transition point ≥150°C and a coefficient of linear expansion of 1.1W2.5× 10-5(°C-1).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9061980A JPS5716023A (en) | 1980-07-04 | 1980-07-04 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9061980A JPS5716023A (en) | 1980-07-04 | 1980-07-04 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5716023A true JPS5716023A (en) | 1982-01-27 |
Family
ID=14003497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9061980A Pending JPS5716023A (en) | 1980-07-04 | 1980-07-04 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5716023A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63275625A (en) * | 1987-05-08 | 1988-11-14 | Ube Ind Ltd | Epoxy resin composition for semiconductor sealing |
US4937366A (en) * | 1989-02-13 | 1990-06-26 | Mobay Corporation | Process and compositions for production of moldings |
US4963640A (en) * | 1989-02-13 | 1990-10-16 | Mobay Corporation | Process and compositions for production of moldings |
-
1980
- 1980-07-04 JP JP9061980A patent/JPS5716023A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63275625A (en) * | 1987-05-08 | 1988-11-14 | Ube Ind Ltd | Epoxy resin composition for semiconductor sealing |
US4937366A (en) * | 1989-02-13 | 1990-06-26 | Mobay Corporation | Process and compositions for production of moldings |
US4963640A (en) * | 1989-02-13 | 1990-10-16 | Mobay Corporation | Process and compositions for production of moldings |
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