JPS5716023A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5716023A
JPS5716023A JP9061980A JP9061980A JPS5716023A JP S5716023 A JPS5716023 A JP S5716023A JP 9061980 A JP9061980 A JP 9061980A JP 9061980 A JP9061980 A JP 9061980A JP S5716023 A JPS5716023 A JP S5716023A
Authority
JP
Japan
Prior art keywords
resin composition
polyhydroxystyrene
reaction product
dicarboxylic acid
ethylenically unsaturated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9061980A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9061980A priority Critical patent/JPS5716023A/en
Publication of JPS5716023A publication Critical patent/JPS5716023A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: Titled composition having a low modulus of elasticity, a low coefficient of linear expansion and a high glass transition point, consisting of a polyfunctional epoxy compound, a melt reaction product between an ethylenically unsaturated dicarboxylic acid anhydride and an aromatic diamine, a polyhydroxystyrene and an inorganic filler.
CONSTITUTION: The following components (A), (B), (C) and (D) are mixed together so that D/(A+B+C+D) corresponds to 50W80vol%: (A) a polyfunctional epoxy compound, e.g., diglycidyl ether of bisphenol A, (B) a melt reaction product of 1mol of ethylenically unsaturated dicarboxylic acid anhydride, e.g., maleic anhydride, and 2W20mol of aromatic diamine, e.g., m-phenylenediamine, (C) a polyhydroxystyrene, e.g., o-vinylphenol polymer, and (D) an inorganic filler, e.g., fused quartz glass powder.
EFFECT: It is possible to obtain a resin composition having excellent heat resistance, a glass transition point ≥150°C and a coefficient of linear expansion of 1.1W2.5× 10-5(°C-1).
COPYRIGHT: (C)1982,JPO&Japio
JP9061980A 1980-07-04 1980-07-04 Thermosetting resin composition Pending JPS5716023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9061980A JPS5716023A (en) 1980-07-04 1980-07-04 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9061980A JPS5716023A (en) 1980-07-04 1980-07-04 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS5716023A true JPS5716023A (en) 1982-01-27

Family

ID=14003497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9061980A Pending JPS5716023A (en) 1980-07-04 1980-07-04 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5716023A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275625A (en) * 1987-05-08 1988-11-14 Ube Ind Ltd Epoxy resin composition for semiconductor sealing
US4937366A (en) * 1989-02-13 1990-06-26 Mobay Corporation Process and compositions for production of moldings
US4963640A (en) * 1989-02-13 1990-10-16 Mobay Corporation Process and compositions for production of moldings

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275625A (en) * 1987-05-08 1988-11-14 Ube Ind Ltd Epoxy resin composition for semiconductor sealing
US4937366A (en) * 1989-02-13 1990-06-26 Mobay Corporation Process and compositions for production of moldings
US4963640A (en) * 1989-02-13 1990-10-16 Mobay Corporation Process and compositions for production of moldings

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