JPS55110117A - Epoxy resin hardener - Google Patents

Epoxy resin hardener

Info

Publication number
JPS55110117A
JPS55110117A JP1877979A JP1877979A JPS55110117A JP S55110117 A JPS55110117 A JP S55110117A JP 1877979 A JP1877979 A JP 1877979A JP 1877979 A JP1877979 A JP 1877979A JP S55110117 A JPS55110117 A JP S55110117A
Authority
JP
Japan
Prior art keywords
acids
epoxy resin
types
flexibilizing
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1877979A
Other languages
Japanese (ja)
Other versions
JPS6159327B2 (en
Inventor
Shoji Tani
Yoshihiro Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHIN NIPPON RIKA KK
New Japan Chemical Co Ltd
Original Assignee
SHIN NIPPON RIKA KK
New Japan Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHIN NIPPON RIKA KK, New Japan Chemical Co Ltd filed Critical SHIN NIPPON RIKA KK
Priority to JP1877979A priority Critical patent/JPS55110117A/en
Publication of JPS55110117A publication Critical patent/JPS55110117A/en
Publication of JPS6159327B2 publication Critical patent/JPS6159327B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin hardener capable of giving hardened resins having improved thermal shock resistance, with flexibilizing effect and a low melting point, comprising a polycarboxylic acid anhydride obtained by copolymerizing plural types of aliphatic dibasis acids.
CONSTITUTION: A flexibilizing hardener for epoxy resin comprising a polycarboxylic acid anhydride obtained by copolymerizing two or more types of aliphatic dibasic acids, e.g. malonic, glutaric, and adipic acids. The acids may be combined with other alicyclic or aromatic acid anhydrides to provide the synergistic effect of low melting with performance in use.
USE: All types of epoxy resins to be used for coating materials, adhesives, and casting and impregnation of electric parts.
COPYRIGHT: (C)1980,JPO&Japio
JP1877979A 1979-02-19 1979-02-19 Epoxy resin hardener Granted JPS55110117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1877979A JPS55110117A (en) 1979-02-19 1979-02-19 Epoxy resin hardener

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1877979A JPS55110117A (en) 1979-02-19 1979-02-19 Epoxy resin hardener

Publications (2)

Publication Number Publication Date
JPS55110117A true JPS55110117A (en) 1980-08-25
JPS6159327B2 JPS6159327B2 (en) 1986-12-16

Family

ID=11981111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1877979A Granted JPS55110117A (en) 1979-02-19 1979-02-19 Epoxy resin hardener

Country Status (1)

Country Link
JP (1) JPS55110117A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009088059A1 (en) * 2008-01-09 2009-07-16 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
JP2010100798A (en) * 2008-01-09 2010-05-06 Hitachi Chem Co Ltd Thermosetting resin composition, epoxy resin molding material, substrate for mounting photosemiconductor element, method for manufacturing the same and photosemiconductor device
JP2010106226A (en) * 2008-01-11 2010-05-13 Hitachi Chem Co Ltd Polycarboxylic acid condensate and epoxy resin curing agent using the same, epoxy resin composition, polyamide resin, and polyester resin
JP2011213948A (en) * 2010-04-01 2011-10-27 Hitachi Chem Co Ltd Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting optical semiconductor element and method for manufacturing the substrate, and optical semiconductor device
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009088059A1 (en) * 2008-01-09 2009-07-16 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
JP2010100798A (en) * 2008-01-09 2010-05-06 Hitachi Chem Co Ltd Thermosetting resin composition, epoxy resin molding material, substrate for mounting photosemiconductor element, method for manufacturing the same and photosemiconductor device
JP4586925B2 (en) * 2008-01-09 2010-11-24 日立化成工業株式会社 Thermosetting resin composition, epoxy resin molding material, substrate for mounting optical semiconductor element, manufacturing method thereof, and optical semiconductor device
US8585272B2 (en) 2008-01-09 2013-11-19 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
US8637593B2 (en) 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
TWI452056B (en) * 2008-01-09 2014-09-11 Hitachi Chemical Co Ltd Thermosetting resin composition, epoxy resin molding material and condensation body of polyvalent carboxylic acid
US9067906B2 (en) 2008-01-09 2015-06-30 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
JP2010106226A (en) * 2008-01-11 2010-05-13 Hitachi Chem Co Ltd Polycarboxylic acid condensate and epoxy resin curing agent using the same, epoxy resin composition, polyamide resin, and polyester resin
JP2011213948A (en) * 2010-04-01 2011-10-27 Hitachi Chem Co Ltd Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting optical semiconductor element and method for manufacturing the substrate, and optical semiconductor device

Also Published As

Publication number Publication date
JPS6159327B2 (en) 1986-12-16

Similar Documents

Publication Publication Date Title
JPS55110117A (en) Epoxy resin hardener
JPS5657820A (en) Curable epoxy resin composition
JPS52132099A (en) Thermosetting resin compositions
JPS51129498A (en) Thermosetting resin composition
JPS55147565A (en) Powdered painting material
JPS56120726A (en) Epoxy resin composition having improved adhesiveness and cracking resistance
JPS5653119A (en) Curable resin composition
JPS53101051A (en) Epoxy resin composition
JPS53125475A (en) Prepreg
JPS5398400A (en) Epoxy resin composition
JPS51148800A (en) Thermosetting resin composition
JPS51135999A (en) Epoxy res in composition
JPS536400A (en) Curable epoxy resin compositions
JPS54112939A (en) Adhesive for copper-clad laminate
JPS5250343A (en) Thermosetting resin comositions with improved thermal stability
JPS53144958A (en) Epoxy resin composition
JPS5653129A (en) Curable resin composition
JPS57172930A (en) Prepreg sheet
JPS52146498A (en) Epoxy resin composition
JPS544927A (en) Powder coating composition of termosetting epoxy resin
JPS56127630A (en) Curable resin composition
JPS5716023A (en) Thermosetting resin composition
JPS57195773A (en) Powdered resin composition for electrical insulating coating
JPS54139998A (en) Epoxy resin molding material
JPS53127599A (en) Epoxy resin composition