JPS52132099A - Thermosetting resin compositions - Google Patents
Thermosetting resin compositionsInfo
- Publication number
- JPS52132099A JPS52132099A JP4840776A JP4840776A JPS52132099A JP S52132099 A JPS52132099 A JP S52132099A JP 4840776 A JP4840776 A JP 4840776A JP 4840776 A JP4840776 A JP 4840776A JP S52132099 A JPS52132099 A JP S52132099A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- resin compositions
- epoxy resins
- resins
- 2butadiene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: Thermosetting resin compositions with excellent crack resistance and electrical arc resistance, etc., consisting of epoxy resins, specific epoxidized poly-1,2butadiene resins, radically polymerizable monomers and acid anhydride hardeners for epoxy resins.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4840776A JPS5936651B2 (en) | 1976-04-30 | 1976-04-30 | thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4840776A JPS5936651B2 (en) | 1976-04-30 | 1976-04-30 | thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52132099A true JPS52132099A (en) | 1977-11-05 |
JPS5936651B2 JPS5936651B2 (en) | 1984-09-05 |
Family
ID=12802440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4840776A Expired JPS5936651B2 (en) | 1976-04-30 | 1976-04-30 | thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5936651B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930818A (en) * | 1982-06-14 | 1984-02-18 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | Thermosettable epoxy composition and use for manufacturing products |
JPS59202255A (en) * | 1983-04-30 | 1984-11-16 | Unitika Ltd | Resin composition |
JPS61148230A (en) * | 1984-12-21 | 1986-07-05 | Hitachi Chem Co Ltd | Thermosetting resin composition |
JPS61235425A (en) * | 1985-04-11 | 1986-10-20 | Hitachi Chem Co Ltd | Thermosetting resin composition |
JPS62101626A (en) * | 1985-10-30 | 1987-05-12 | Hitachi Chem Co Ltd | Curing agent for epoxy resin and epoxy resin composition |
JP2001122945A (en) * | 1999-10-27 | 2001-05-08 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
JP2011137092A (en) * | 2009-12-28 | 2011-07-14 | Nippon Soda Co Ltd | Curable composition |
JP2014055233A (en) * | 2012-09-12 | 2014-03-27 | Panasonic Corp | Liquid epoxy resin composition and semiconductor electronic component |
-
1976
- 1976-04-30 JP JP4840776A patent/JPS5936651B2/en not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5930818A (en) * | 1982-06-14 | 1984-02-18 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | Thermosettable epoxy composition and use for manufacturing products |
JPS59202255A (en) * | 1983-04-30 | 1984-11-16 | Unitika Ltd | Resin composition |
JPS61148230A (en) * | 1984-12-21 | 1986-07-05 | Hitachi Chem Co Ltd | Thermosetting resin composition |
JPH0464531B2 (en) * | 1984-12-21 | 1992-10-15 | Hitachi Chemical Co Ltd | |
JPS61235425A (en) * | 1985-04-11 | 1986-10-20 | Hitachi Chem Co Ltd | Thermosetting resin composition |
JPH0464614B2 (en) * | 1985-04-11 | 1992-10-15 | Hitachi Chemical Co Ltd | |
JPS62101626A (en) * | 1985-10-30 | 1987-05-12 | Hitachi Chem Co Ltd | Curing agent for epoxy resin and epoxy resin composition |
JPH0464615B2 (en) * | 1985-10-30 | 1992-10-15 | Hitachi Chemical Co Ltd | |
JP2001122945A (en) * | 1999-10-27 | 2001-05-08 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing and electronic part device |
JP4534280B2 (en) * | 1999-10-27 | 2010-09-01 | 日立化成工業株式会社 | Epoxy resin molding material for sealing and electronic component device |
JP2011137092A (en) * | 2009-12-28 | 2011-07-14 | Nippon Soda Co Ltd | Curable composition |
JP2014055233A (en) * | 2012-09-12 | 2014-03-27 | Panasonic Corp | Liquid epoxy resin composition and semiconductor electronic component |
Also Published As
Publication number | Publication date |
---|---|
JPS5936651B2 (en) | 1984-09-05 |
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