JPS52132099A - Thermosetting resin compositions - Google Patents

Thermosetting resin compositions

Info

Publication number
JPS52132099A
JPS52132099A JP4840776A JP4840776A JPS52132099A JP S52132099 A JPS52132099 A JP S52132099A JP 4840776 A JP4840776 A JP 4840776A JP 4840776 A JP4840776 A JP 4840776A JP S52132099 A JPS52132099 A JP S52132099A
Authority
JP
Japan
Prior art keywords
thermosetting resin
resin compositions
epoxy resins
resins
2butadiene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4840776A
Other languages
Japanese (ja)
Other versions
JPS5936651B2 (en
Inventor
Shigeru Murakami
Kazuya Kuriyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP4840776A priority Critical patent/JPS5936651B2/en
Publication of JPS52132099A publication Critical patent/JPS52132099A/en
Publication of JPS5936651B2 publication Critical patent/JPS5936651B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: Thermosetting resin compositions with excellent crack resistance and electrical arc resistance, etc., consisting of epoxy resins, specific epoxidized poly-1,2butadiene resins, radically polymerizable monomers and acid anhydride hardeners for epoxy resins.
COPYRIGHT: (C)1977,JPO&Japio
JP4840776A 1976-04-30 1976-04-30 thermosetting resin composition Expired JPS5936651B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4840776A JPS5936651B2 (en) 1976-04-30 1976-04-30 thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4840776A JPS5936651B2 (en) 1976-04-30 1976-04-30 thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS52132099A true JPS52132099A (en) 1977-11-05
JPS5936651B2 JPS5936651B2 (en) 1984-09-05

Family

ID=12802440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4840776A Expired JPS5936651B2 (en) 1976-04-30 1976-04-30 thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5936651B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930818A (en) * 1982-06-14 1984-02-18 シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ Thermosettable epoxy composition and use for manufacturing products
JPS59202255A (en) * 1983-04-30 1984-11-16 Unitika Ltd Resin composition
JPS61148230A (en) * 1984-12-21 1986-07-05 Hitachi Chem Co Ltd Thermosetting resin composition
JPS61235425A (en) * 1985-04-11 1986-10-20 Hitachi Chem Co Ltd Thermosetting resin composition
JPS62101626A (en) * 1985-10-30 1987-05-12 Hitachi Chem Co Ltd Curing agent for epoxy resin and epoxy resin composition
JP2001122945A (en) * 1999-10-27 2001-05-08 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic part device
JP2011137092A (en) * 2009-12-28 2011-07-14 Nippon Soda Co Ltd Curable composition
JP2014055233A (en) * 2012-09-12 2014-03-27 Panasonic Corp Liquid epoxy resin composition and semiconductor electronic component

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930818A (en) * 1982-06-14 1984-02-18 シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ Thermosettable epoxy composition and use for manufacturing products
JPS59202255A (en) * 1983-04-30 1984-11-16 Unitika Ltd Resin composition
JPS61148230A (en) * 1984-12-21 1986-07-05 Hitachi Chem Co Ltd Thermosetting resin composition
JPH0464531B2 (en) * 1984-12-21 1992-10-15 Hitachi Chemical Co Ltd
JPS61235425A (en) * 1985-04-11 1986-10-20 Hitachi Chem Co Ltd Thermosetting resin composition
JPH0464614B2 (en) * 1985-04-11 1992-10-15 Hitachi Chemical Co Ltd
JPS62101626A (en) * 1985-10-30 1987-05-12 Hitachi Chem Co Ltd Curing agent for epoxy resin and epoxy resin composition
JPH0464615B2 (en) * 1985-10-30 1992-10-15 Hitachi Chemical Co Ltd
JP2001122945A (en) * 1999-10-27 2001-05-08 Hitachi Chem Co Ltd Epoxy resin molding material for sealing and electronic part device
JP4534280B2 (en) * 1999-10-27 2010-09-01 日立化成工業株式会社 Epoxy resin molding material for sealing and electronic component device
JP2011137092A (en) * 2009-12-28 2011-07-14 Nippon Soda Co Ltd Curable composition
JP2014055233A (en) * 2012-09-12 2014-03-27 Panasonic Corp Liquid epoxy resin composition and semiconductor electronic component

Also Published As

Publication number Publication date
JPS5936651B2 (en) 1984-09-05

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