JPS54139998A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS54139998A JPS54139998A JP4888178A JP4888178A JPS54139998A JP S54139998 A JPS54139998 A JP S54139998A JP 4888178 A JP4888178 A JP 4888178A JP 4888178 A JP4888178 A JP 4888178A JP S54139998 A JPS54139998 A JP S54139998A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- resin molding
- epoxy
- hardener
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: An epoxy resin molding material having improved storage stability, releability of cured articles, and slight deterioration of insulation resistance, curable rapidly, comprising a specific epoxy resin, a hardener, and a hardening accelerator.
CONSTITUTION: An epoxy resin, e.g. phenol novolak or bisphenol A epoxy resin, having two or more epoxy groups in one molecule is incorporated with (A) 0.6W 1.4 equivalents per equivalent of epoxy group of a phenolic resin as a hardener and (B) 0.1W5 parts by wt. per 100 parts by wt. of the epoxy resin of a triazole as a hardening accelerator.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4888178A JPS54139998A (en) | 1978-04-24 | 1978-04-24 | Epoxy resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4888178A JPS54139998A (en) | 1978-04-24 | 1978-04-24 | Epoxy resin molding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54139998A true JPS54139998A (en) | 1979-10-30 |
Family
ID=12815617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4888178A Pending JPS54139998A (en) | 1978-04-24 | 1978-04-24 | Epoxy resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54139998A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005037888A1 (en) * | 2003-10-20 | 2005-04-28 | Sumitomo Bakelite Co., Ltd. | Epoxy resin composition and semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5193999A (en) * | 1975-02-14 | 1976-08-18 | EHOKISHIJUSHIKOKAZAI | |
JPS5285300A (en) * | 1976-01-01 | 1977-07-15 | Bayer Ag | Novel compound |
-
1978
- 1978-04-24 JP JP4888178A patent/JPS54139998A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5193999A (en) * | 1975-02-14 | 1976-08-18 | EHOKISHIJUSHIKOKAZAI | |
JPS5285300A (en) * | 1976-01-01 | 1977-07-15 | Bayer Ag | Novel compound |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005037888A1 (en) * | 2003-10-20 | 2005-04-28 | Sumitomo Bakelite Co., Ltd. | Epoxy resin composition and semiconductor device |
JPWO2005037888A1 (en) * | 2003-10-20 | 2007-11-22 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
US7354978B2 (en) | 2003-10-20 | 2008-04-08 | Sumitomo Bakelite Co. | Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound |
CN100402575C (en) * | 2003-10-20 | 2008-07-16 | 住友电木株式会社 | Epoxy resin composition and semiconductor device |
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