JPS54139998A - Epoxy resin molding material - Google Patents

Epoxy resin molding material

Info

Publication number
JPS54139998A
JPS54139998A JP4888178A JP4888178A JPS54139998A JP S54139998 A JPS54139998 A JP S54139998A JP 4888178 A JP4888178 A JP 4888178A JP 4888178 A JP4888178 A JP 4888178A JP S54139998 A JPS54139998 A JP S54139998A
Authority
JP
Japan
Prior art keywords
epoxy resin
molding material
resin molding
epoxy
hardener
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4888178A
Other languages
Japanese (ja)
Inventor
Yoshio Nakatani
Akihiro Okuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4888178A priority Critical patent/JPS54139998A/en
Publication of JPS54139998A publication Critical patent/JPS54139998A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin molding material having improved storage stability, releability of cured articles, and slight deterioration of insulation resistance, curable rapidly, comprising a specific epoxy resin, a hardener, and a hardening accelerator.
CONSTITUTION: An epoxy resin, e.g. phenol novolak or bisphenol A epoxy resin, having two or more epoxy groups in one molecule is incorporated with (A) 0.6W 1.4 equivalents per equivalent of epoxy group of a phenolic resin as a hardener and (B) 0.1W5 parts by wt. per 100 parts by wt. of the epoxy resin of a triazole as a hardening accelerator.
COPYRIGHT: (C)1979,JPO&Japio
JP4888178A 1978-04-24 1978-04-24 Epoxy resin molding material Pending JPS54139998A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4888178A JPS54139998A (en) 1978-04-24 1978-04-24 Epoxy resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4888178A JPS54139998A (en) 1978-04-24 1978-04-24 Epoxy resin molding material

Publications (1)

Publication Number Publication Date
JPS54139998A true JPS54139998A (en) 1979-10-30

Family

ID=12815617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4888178A Pending JPS54139998A (en) 1978-04-24 1978-04-24 Epoxy resin molding material

Country Status (1)

Country Link
JP (1) JPS54139998A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005037888A1 (en) * 2003-10-20 2005-04-28 Sumitomo Bakelite Co., Ltd. Epoxy resin composition and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193999A (en) * 1975-02-14 1976-08-18 EHOKISHIJUSHIKOKAZAI
JPS5285300A (en) * 1976-01-01 1977-07-15 Bayer Ag Novel compound

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193999A (en) * 1975-02-14 1976-08-18 EHOKISHIJUSHIKOKAZAI
JPS5285300A (en) * 1976-01-01 1977-07-15 Bayer Ag Novel compound

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005037888A1 (en) * 2003-10-20 2005-04-28 Sumitomo Bakelite Co., Ltd. Epoxy resin composition and semiconductor device
JPWO2005037888A1 (en) * 2003-10-20 2007-11-22 住友ベークライト株式会社 Epoxy resin composition and semiconductor device
US7354978B2 (en) 2003-10-20 2008-04-08 Sumitomo Bakelite Co. Semiconductor encapsulant of epoxy resin, phenolic resin and triazole compound
CN100402575C (en) * 2003-10-20 2008-07-16 住友电木株式会社 Epoxy resin composition and semiconductor device

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