JPS54116097A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS54116097A
JPS54116097A JP2376878A JP2376878A JPS54116097A JP S54116097 A JPS54116097 A JP S54116097A JP 2376878 A JP2376878 A JP 2376878A JP 2376878 A JP2376878 A JP 2376878A JP S54116097 A JPS54116097 A JP S54116097A
Authority
JP
Japan
Prior art keywords
type
resin composition
epoxy
thermosetting resin
epoxy compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2376878A
Other languages
Japanese (ja)
Other versions
JPH0124809B2 (en
Inventor
Akira Fukami
Shohei Eto
Yasushi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2376878A priority Critical patent/JPS54116097A/en
Publication of JPS54116097A publication Critical patent/JPS54116097A/en
Publication of JPH0124809B2 publication Critical patent/JPH0124809B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: A thermosetting resin composition suitabe for a laminate, a molded article, etc., having improved heat resistance, mechanical strength, and hardness, obtained by blending a novolak-type condensate with an epoxy compound having two or more epoxy groups and a curing catalyst.
CONSTITUTION: 45W65 wt.% of a novolak-type condensate obtained by reacting p, p'-dimethoxymethyldiphenyl ether with p-phenylphenol in the presence of an acid catalyst is blended with 55W35 wt.% of an epoxy compound having two or more epoxy groups and a curing agent. A bisphenol A-type, and an alicyclic-type epoxy resins, tricrecylisocyanurate, etc. may be cited as the epoxy compound. Benzyldimethylamine, 2-ethyl-4-methylimidazole, monoethylamine may be cited as the curing catalyst.
COPYRIGHT: (C)1979,JPO&Japio
JP2376878A 1978-03-01 1978-03-01 Thermosetting resin composition Granted JPS54116097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2376878A JPS54116097A (en) 1978-03-01 1978-03-01 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2376878A JPS54116097A (en) 1978-03-01 1978-03-01 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS54116097A true JPS54116097A (en) 1979-09-10
JPH0124809B2 JPH0124809B2 (en) 1989-05-15

Family

ID=12119515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2376878A Granted JPS54116097A (en) 1978-03-01 1978-03-01 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS54116097A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150332931A1 (en) * 2014-05-16 2015-11-19 Samsung Sdi Co., Ltd. Hardmask composition and method of forming patterns using the hardmask composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150332931A1 (en) * 2014-05-16 2015-11-19 Samsung Sdi Co., Ltd. Hardmask composition and method of forming patterns using the hardmask composition
US10018914B2 (en) * 2014-05-16 2018-07-10 Samsung Sdi Co., Ltd. Hardmask composition and method of forming patterns using the hardmask composition

Also Published As

Publication number Publication date
JPH0124809B2 (en) 1989-05-15

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