JPS54116097A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS54116097A JPS54116097A JP2376878A JP2376878A JPS54116097A JP S54116097 A JPS54116097 A JP S54116097A JP 2376878 A JP2376878 A JP 2376878A JP 2376878 A JP2376878 A JP 2376878A JP S54116097 A JPS54116097 A JP S54116097A
- Authority
- JP
- Japan
- Prior art keywords
- type
- resin composition
- epoxy
- thermosetting resin
- epoxy compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: A thermosetting resin composition suitabe for a laminate, a molded article, etc., having improved heat resistance, mechanical strength, and hardness, obtained by blending a novolak-type condensate with an epoxy compound having two or more epoxy groups and a curing catalyst.
CONSTITUTION: 45W65 wt.% of a novolak-type condensate obtained by reacting p, p'-dimethoxymethyldiphenyl ether with p-phenylphenol in the presence of an acid catalyst is blended with 55W35 wt.% of an epoxy compound having two or more epoxy groups and a curing agent. A bisphenol A-type, and an alicyclic-type epoxy resins, tricrecylisocyanurate, etc. may be cited as the epoxy compound. Benzyldimethylamine, 2-ethyl-4-methylimidazole, monoethylamine may be cited as the curing catalyst.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2376878A JPS54116097A (en) | 1978-03-01 | 1978-03-01 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2376878A JPS54116097A (en) | 1978-03-01 | 1978-03-01 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54116097A true JPS54116097A (en) | 1979-09-10 |
JPH0124809B2 JPH0124809B2 (en) | 1989-05-15 |
Family
ID=12119515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2376878A Granted JPS54116097A (en) | 1978-03-01 | 1978-03-01 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54116097A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150332931A1 (en) * | 2014-05-16 | 2015-11-19 | Samsung Sdi Co., Ltd. | Hardmask composition and method of forming patterns using the hardmask composition |
-
1978
- 1978-03-01 JP JP2376878A patent/JPS54116097A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150332931A1 (en) * | 2014-05-16 | 2015-11-19 | Samsung Sdi Co., Ltd. | Hardmask composition and method of forming patterns using the hardmask composition |
US10018914B2 (en) * | 2014-05-16 | 2018-07-10 | Samsung Sdi Co., Ltd. | Hardmask composition and method of forming patterns using the hardmask composition |
Also Published As
Publication number | Publication date |
---|---|
JPH0124809B2 (en) | 1989-05-15 |
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