JPS5653129A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS5653129A JPS5653129A JP12906879A JP12906879A JPS5653129A JP S5653129 A JPS5653129 A JP S5653129A JP 12906879 A JP12906879 A JP 12906879A JP 12906879 A JP12906879 A JP 12906879A JP S5653129 A JPS5653129 A JP S5653129A
- Authority
- JP
- Japan
- Prior art keywords
- lewis acid
- emits
- radiation
- compound
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prepare the titled composition which can be cured completely with exposure to light or radiation and with successive heating, by adding a compound which emits a Lewis acid with exposure to light or radiation or heating, to an epoxy resin/acid anhydride composition.
CONSTITUTION: A mixture of (A) an epoxy resin having two or more epoxy groups in a molecule and (B) a polyfunctional carboxylic acid anhydride copolymerizable with the (A) component, is mixed with (C) a compound which emits a Lewis acid with light or radiation (e.g. diazonium salt of a Lewis acid, a diaryl iodonium salt, etc.) and (D) a compound which emits a Lewis acid with heat (e.g. a BF3-amine complex). The molar ratio of the epoxy group of the component (A) to the carboxy group of the component (B) is pref. 1W0.8, and the amounts of the components (C) and (D) are 0.05W5pts.wt. each based on 100pts.wt. of the mixture of (A) and (B).
EFFECT: The composition has excellent mechanical, electrical and thermal properties, and is suitable for impregnating and casting use.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12906879A JPS5653129A (en) | 1979-10-05 | 1979-10-05 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12906879A JPS5653129A (en) | 1979-10-05 | 1979-10-05 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5653129A true JPS5653129A (en) | 1981-05-12 |
| JPS624052B2 JPS624052B2 (en) | 1987-01-28 |
Family
ID=15000283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12906879A Granted JPS5653129A (en) | 1979-10-05 | 1979-10-05 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5653129A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887120A (en) * | 1981-11-18 | 1983-05-24 | Yamatoya Shokai:Kk | Photopolymer composition |
| JPS58204847A (en) * | 1982-05-25 | 1983-11-29 | Hitachi Chem Co Ltd | Preparation of optical fiber covered with resin |
| SG112904A1 (en) * | 2001-01-24 | 2005-07-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49131000A (en) * | 1973-04-20 | 1974-12-16 | ||
| JPS5414444A (en) * | 1977-07-05 | 1979-02-02 | Ciba Geigy Ag | Bonding method using adhesive film |
-
1979
- 1979-10-05 JP JP12906879A patent/JPS5653129A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49131000A (en) * | 1973-04-20 | 1974-12-16 | ||
| JPS5414444A (en) * | 1977-07-05 | 1979-02-02 | Ciba Geigy Ag | Bonding method using adhesive film |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887120A (en) * | 1981-11-18 | 1983-05-24 | Yamatoya Shokai:Kk | Photopolymer composition |
| JPS58204847A (en) * | 1982-05-25 | 1983-11-29 | Hitachi Chem Co Ltd | Preparation of optical fiber covered with resin |
| SG112904A1 (en) * | 2001-01-24 | 2005-07-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS624052B2 (en) | 1987-01-28 |
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