JPS54160455A - Heat-curing epoxy resin composition partly curable with radiation - Google Patents

Heat-curing epoxy resin composition partly curable with radiation

Info

Publication number
JPS54160455A
JPS54160455A JP6835878A JP6835878A JPS54160455A JP S54160455 A JPS54160455 A JP S54160455A JP 6835878 A JP6835878 A JP 6835878A JP 6835878 A JP6835878 A JP 6835878A JP S54160455 A JPS54160455 A JP S54160455A
Authority
JP
Japan
Prior art keywords
radiation
curing
heat
resin composition
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6835878A
Other languages
Japanese (ja)
Inventor
Yasuo Takagi
Fujio Goto
Hidekazu Okuno
Haruyoshi Takagishi
Makoto Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEMEDAIN KK
Cemedine Co Ltd
Nissan Motor Co Ltd
Original Assignee
SEMEDAIN KK
Cemedine Co Ltd
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEMEDAIN KK, Cemedine Co Ltd, Nissan Motor Co Ltd filed Critical SEMEDAIN KK
Priority to JP6835878A priority Critical patent/JPS54160455A/en
Publication of JPS54160455A publication Critical patent/JPS54160455A/en
Pending legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The title resin composition easily handleable till heat curing by forming cured films with radiation before the curing, comprising a radiation curing compound having unsaturated double bonds in the molecule and an epoxy compound.
CONSTITUTION: A composition comprising (A) 100 parts by wt. of an epoxy compound having one or more epoxy groups in the molecule on the average, (B) 20W100 parts by wt. of a radiation curing compound, e.g. an unsaturated polyester, (meth)acrylate, or acrylic oligomer, having unsaturated double bonds in the molecule, and (C) a curing agent for heat-curing epoxy resins in an amount of 50W150 % of the stoichiometric one based on the epoxy group. γ-, X-, Electron, β-, α- or ultraviolet rays may be used as the radiation. For ultraviolet rays, a photosensitizer may be preferably used with ingredient (B).
COPYRIGHT: (C)1979,JPO&Japio
JP6835878A 1978-06-08 1978-06-08 Heat-curing epoxy resin composition partly curable with radiation Pending JPS54160455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6835878A JPS54160455A (en) 1978-06-08 1978-06-08 Heat-curing epoxy resin composition partly curable with radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6835878A JPS54160455A (en) 1978-06-08 1978-06-08 Heat-curing epoxy resin composition partly curable with radiation

Publications (1)

Publication Number Publication Date
JPS54160455A true JPS54160455A (en) 1979-12-19

Family

ID=13371493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6835878A Pending JPS54160455A (en) 1978-06-08 1978-06-08 Heat-curing epoxy resin composition partly curable with radiation

Country Status (1)

Country Link
JP (1) JPS54160455A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61162574A (en) * 1985-01-08 1986-07-23 Takeda Chem Ind Ltd Bonding and two-step reaction-type adhesive therefor
JPS627779A (en) * 1985-07-04 1987-01-14 Matsushita Electric Ind Co Ltd Corrosion-resistant photosetting adhesive composition
JPH03188102A (en) * 1989-12-15 1991-08-16 Nippon Kasei Kk Polymerizable curable composition
WO2004055100A1 (en) * 2002-12-13 2004-07-01 Ppg Industries Ohio, Inc. Sealant and sound dampening composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52100574A (en) * 1976-02-19 1977-08-23 Ciba Geigy Ag Manufacture of preepreg
JPS52100575A (en) * 1976-02-19 1977-08-23 Ciba Geigy Ag Reinfoeced composite material and its manufacture
JPS52107067A (en) * 1976-02-19 1977-09-08 Ciba Geigy Ag Manufacture of preepreg

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52100574A (en) * 1976-02-19 1977-08-23 Ciba Geigy Ag Manufacture of preepreg
JPS52100575A (en) * 1976-02-19 1977-08-23 Ciba Geigy Ag Reinfoeced composite material and its manufacture
JPS52107067A (en) * 1976-02-19 1977-09-08 Ciba Geigy Ag Manufacture of preepreg

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61162574A (en) * 1985-01-08 1986-07-23 Takeda Chem Ind Ltd Bonding and two-step reaction-type adhesive therefor
JPS627779A (en) * 1985-07-04 1987-01-14 Matsushita Electric Ind Co Ltd Corrosion-resistant photosetting adhesive composition
JPH03188102A (en) * 1989-12-15 1991-08-16 Nippon Kasei Kk Polymerizable curable composition
WO2004055100A1 (en) * 2002-12-13 2004-07-01 Ppg Industries Ohio, Inc. Sealant and sound dampening composition

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