JPS54160455A - Heat-curing epoxy resin composition partly curable with radiation - Google Patents
Heat-curing epoxy resin composition partly curable with radiationInfo
- Publication number
- JPS54160455A JPS54160455A JP6835878A JP6835878A JPS54160455A JP S54160455 A JPS54160455 A JP S54160455A JP 6835878 A JP6835878 A JP 6835878A JP 6835878 A JP6835878 A JP 6835878A JP S54160455 A JPS54160455 A JP S54160455A
- Authority
- JP
- Japan
- Prior art keywords
- radiation
- curing
- heat
- resin composition
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Sealing Material Composition (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The title resin composition easily handleable till heat curing by forming cured films with radiation before the curing, comprising a radiation curing compound having unsaturated double bonds in the molecule and an epoxy compound.
CONSTITUTION: A composition comprising (A) 100 parts by wt. of an epoxy compound having one or more epoxy groups in the molecule on the average, (B) 20W100 parts by wt. of a radiation curing compound, e.g. an unsaturated polyester, (meth)acrylate, or acrylic oligomer, having unsaturated double bonds in the molecule, and (C) a curing agent for heat-curing epoxy resins in an amount of 50W150 % of the stoichiometric one based on the epoxy group. γ-, X-, Electron, β-, α- or ultraviolet rays may be used as the radiation. For ultraviolet rays, a photosensitizer may be preferably used with ingredient (B).
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6835878A JPS54160455A (en) | 1978-06-08 | 1978-06-08 | Heat-curing epoxy resin composition partly curable with radiation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6835878A JPS54160455A (en) | 1978-06-08 | 1978-06-08 | Heat-curing epoxy resin composition partly curable with radiation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54160455A true JPS54160455A (en) | 1979-12-19 |
Family
ID=13371493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6835878A Pending JPS54160455A (en) | 1978-06-08 | 1978-06-08 | Heat-curing epoxy resin composition partly curable with radiation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54160455A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61162574A (en) * | 1985-01-08 | 1986-07-23 | Takeda Chem Ind Ltd | Bonding and two-step reaction-type adhesive therefor |
JPS627779A (en) * | 1985-07-04 | 1987-01-14 | Matsushita Electric Ind Co Ltd | Corrosion-resistant photosetting adhesive composition |
JPH03188102A (en) * | 1989-12-15 | 1991-08-16 | Nippon Kasei Kk | Polymerizable curable composition |
WO2004055100A1 (en) * | 2002-12-13 | 2004-07-01 | Ppg Industries Ohio, Inc. | Sealant and sound dampening composition |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52100574A (en) * | 1976-02-19 | 1977-08-23 | Ciba Geigy Ag | Manufacture of preepreg |
JPS52100575A (en) * | 1976-02-19 | 1977-08-23 | Ciba Geigy Ag | Reinfoeced composite material and its manufacture |
JPS52107067A (en) * | 1976-02-19 | 1977-09-08 | Ciba Geigy Ag | Manufacture of preepreg |
-
1978
- 1978-06-08 JP JP6835878A patent/JPS54160455A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52100574A (en) * | 1976-02-19 | 1977-08-23 | Ciba Geigy Ag | Manufacture of preepreg |
JPS52100575A (en) * | 1976-02-19 | 1977-08-23 | Ciba Geigy Ag | Reinfoeced composite material and its manufacture |
JPS52107067A (en) * | 1976-02-19 | 1977-09-08 | Ciba Geigy Ag | Manufacture of preepreg |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61162574A (en) * | 1985-01-08 | 1986-07-23 | Takeda Chem Ind Ltd | Bonding and two-step reaction-type adhesive therefor |
JPS627779A (en) * | 1985-07-04 | 1987-01-14 | Matsushita Electric Ind Co Ltd | Corrosion-resistant photosetting adhesive composition |
JPH03188102A (en) * | 1989-12-15 | 1991-08-16 | Nippon Kasei Kk | Polymerizable curable composition |
WO2004055100A1 (en) * | 2002-12-13 | 2004-07-01 | Ppg Industries Ohio, Inc. | Sealant and sound dampening composition |
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