WO1996012752A3 - Curable epoxy resin accelerated by boric acid and its analogs - Google Patents

Curable epoxy resin accelerated by boric acid and its analogs Download PDF

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Publication number
WO1996012752A3
WO1996012752A3 PCT/US1995/013360 US9513360W WO9612752A3 WO 1996012752 A3 WO1996012752 A3 WO 1996012752A3 US 9513360 W US9513360 W US 9513360W WO 9612752 A3 WO9612752 A3 WO 9612752A3
Authority
WO
WIPO (PCT)
Prior art keywords
boric acid
epoxy resin
analogs
curable epoxy
acid compound
Prior art date
Application number
PCT/US1995/013360
Other languages
French (fr)
Other versions
WO1996012752A2 (en
Inventor
James L Bertram
Louis L Walker
Gary R Gantt
Joseph Gan
Original Assignee
Dow Chemical Co
James L Bertram
Louis L Walker
Gary R Gantt
Joseph Gan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co, James L Bertram, Louis L Walker, Gary R Gantt, Joseph Gan filed Critical Dow Chemical Co
Priority to KR1019970702607A priority Critical patent/KR970707199A/en
Priority to BR9509395A priority patent/BR9509395A/en
Priority to EP95937501A priority patent/EP0787162A2/en
Priority to JP8513519A priority patent/JPH10507481A/en
Priority claimed from CN95196349A external-priority patent/CN1164245A/en
Publication of WO1996012752A2 publication Critical patent/WO1996012752A2/en
Publication of WO1996012752A3 publication Critical patent/WO1996012752A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Abstract

Compositions that contain epoxy resin, curing agent and catalyst cure more rapidly if they contain a stoichiometric excess of boric acid compound over the catalyst. Epoxy resins are cured in the presence of at least 1 phr boric acid compound and in the presence of 0 to less than 0.6 moles of catalyst per mole of boric acid compound.
PCT/US1995/013360 1994-10-21 1995-10-13 Curable epoxy resin accelerated by boric acid and its analogs WO1996012752A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019970702607A KR970707199A (en) 1994-10-21 1995-10-13 Curable epoxy resin accelerated by boric acid and its analogues (boric acid and its analogs)
BR9509395A BR9509395A (en) 1994-10-21 1995-10-13 Process for curing a curable composition
EP95937501A EP0787162A2 (en) 1994-10-21 1995-10-13 Curable epoxy resin accelerated by boric acid and its analogs
JP8513519A JPH10507481A (en) 1994-10-21 1995-10-13 Curable epoxy resins promoted by boric acid and its homologues

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9421407A GB9421407D0 (en) 1994-10-21 1994-10-21 Curable epoxy resin accelerated by boric acid and its analogs
GB9421407.9 1994-10-21
CN95196349A CN1164245A (en) 1994-10-21 1995-10-13 Curable epoxy resin accelerated by boric acid and its analogs

Publications (2)

Publication Number Publication Date
WO1996012752A2 WO1996012752A2 (en) 1996-05-02
WO1996012752A3 true WO1996012752A3 (en) 1996-07-18

Family

ID=10763298

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1995/013360 WO1996012752A2 (en) 1994-10-21 1995-10-13 Curable epoxy resin accelerated by boric acid and its analogs

Country Status (7)

Country Link
EP (1) EP0787162A2 (en)
JP (1) JPH10507481A (en)
KR (1) KR970707199A (en)
BR (1) BR9509395A (en)
GB (1) GB9421407D0 (en)
TW (1) TW294700B (en)
WO (1) WO1996012752A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9421405D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
KR100431440B1 (en) * 2001-05-04 2004-05-14 주식회사 엘지화학 Composition of epoxy resin
KR100431439B1 (en) * 2001-05-08 2004-05-14 주식회사 엘지화학 Composition of epoxy resin
US20080039595A1 (en) * 2006-06-07 2008-02-14 Joseph Gan Oligomeric halogenated chain extenders for preparing epoxy resins
US7919567B2 (en) 2006-06-07 2011-04-05 Dow Global Technologies Llc Oligomeric halogenated chain extenders for preparing epoxy resins
SG172872A1 (en) * 2009-01-06 2011-08-29 Dow Global Technologies Llc Metal stabilizers for epoxy resins and advancement process
DE102009027826A1 (en) 2009-04-29 2010-11-04 Evonik Degussa Gmbh Catalysis of Epoxy Formulations
US20140045973A1 (en) * 2011-05-02 2014-02-13 Dow Global Technologies Llc Trimethyl borate in epoxy resins

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876421A (en) * 1981-10-30 1983-05-09 Toshiba Corp Epoxy resin composition
JPH02103224A (en) * 1988-10-12 1990-04-16 Three Bond Co Ltd Latent curing agent for epoxy resin
JPH0340459A (en) * 1989-07-07 1991-02-21 Nitto Denko Corp Semiconductor device
EP0458502A2 (en) * 1990-05-21 1991-11-27 The Dow Chemical Company Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
JPH04284652A (en) * 1991-03-13 1992-10-09 Nitto Denko Corp Semiconductor device and applicable semiconductor sealing epoxy resin composition and manufacture thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876421A (en) * 1981-10-30 1983-05-09 Toshiba Corp Epoxy resin composition
JPH02103224A (en) * 1988-10-12 1990-04-16 Three Bond Co Ltd Latent curing agent for epoxy resin
JPH0340459A (en) * 1989-07-07 1991-02-21 Nitto Denko Corp Semiconductor device
EP0458502A2 (en) * 1990-05-21 1991-11-27 The Dow Chemical Company Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
JPH04284652A (en) * 1991-03-13 1992-10-09 Nitto Denko Corp Semiconductor device and applicable semiconductor sealing epoxy resin composition and manufacture thereof

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Derwent World Patents Index; AN 83-57617k(24) *
DATABASE WPI Derwent World Patents Index; AN 90-160746(219 *
DATABASE WPI Derwent World Patents Index; AN 91-097270 *
DATABASE WPI Derwent World Patents Index; AN 92-385912(47) *

Also Published As

Publication number Publication date
GB9421407D0 (en) 1994-12-07
KR970707199A (en) 1997-12-01
BR9509395A (en) 1997-09-30
JPH10507481A (en) 1998-07-21
EP0787162A2 (en) 1997-08-06
TW294700B (en) 1997-01-01
WO1996012752A2 (en) 1996-05-02

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