JPS5496541A - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- JPS5496541A JPS5496541A JP331678A JP331678A JPS5496541A JP S5496541 A JPS5496541 A JP S5496541A JP 331678 A JP331678 A JP 331678A JP 331678 A JP331678 A JP 331678A JP S5496541 A JPS5496541 A JP S5496541A
- Authority
- JP
- Japan
- Prior art keywords
- acrylate
- glass
- meth
- resin composition
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polymerisation Methods In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE: A photosensitive resin composition having improved adhesion to glass, comprising polyvinyl butyral resin, a hydroxyl group-containing (meth)acrylate, an epoxy group-containing acrylate crosslinking agent, and a photosensitizer.
CONSTITUTION: A photosensitive adhesive for bonding glass together, glass to plastic, and glass to metal, comprising (A) 5 wt.% or more of polyvinyl butyral resin, preferably having a butyralization degree of 60W70% and a polymerization degree of 200W1,000, (B) a hydroxyl group-containing (meth)acrylate, e.g. 2- hydroxyethyl methacrylate, (C) a crosslinking agent, e.g. glycidyl methacrylate, having at least one epoxy group and one (meth)acrylate unsaturated bond in the same molecule, and (D) 0.5W5 wt.% of a photosensitizer, e.g. benzoin ethyl ether.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP331678A JPS5496541A (en) | 1978-01-18 | 1978-01-18 | Photosensitive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP331678A JPS5496541A (en) | 1978-01-18 | 1978-01-18 | Photosensitive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5496541A true JPS5496541A (en) | 1979-07-31 |
Family
ID=11553942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP331678A Pending JPS5496541A (en) | 1978-01-18 | 1978-01-18 | Photosensitive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5496541A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62241983A (en) * | 1986-04-14 | 1987-10-22 | Toshiba Chem Corp | Adhesive for copper foil |
| EP0392947A2 (en) * | 1989-04-13 | 1990-10-17 | Rhone-Poulenc Chimie | Blockcopolymer polydiorganosiloxane-thiuramdisulfide; process for its preparation and its use in the polymerisation of vinyl monomers |
| JPH09176606A (en) * | 1995-12-22 | 1997-07-08 | Sumitomo Bakelite Co Ltd | Adhesive for fixing optical part |
| JP2001115115A (en) * | 1999-10-21 | 2001-04-24 | Lintec Corp | Pressure-sensitive adhesive sheet |
| JP2009073970A (en) * | 2007-09-21 | 2009-04-09 | Asahi Glass Co Ltd | Curable resin composition, transparent layered body using the same, and method for manufacturing the layered body |
| JP2010270293A (en) * | 2009-04-23 | 2010-12-02 | Hitachi Chem Co Ltd | Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device each using the same |
| WO2017061545A1 (en) * | 2015-10-07 | 2017-04-13 | 積水化学工業株式会社 | Poly(vinyl acetal) resin composition, adhesive sheet, interlaminar filling material for touch panel, and laminate |
| EP3296846A4 (en) * | 2015-05-15 | 2019-02-06 | Sekisui Chemical Co., Ltd. | Interlayer filling material for touch panels, and touch panel laminate |
| EP3360925A4 (en) * | 2015-10-07 | 2019-04-03 | Sekisui Chemical Co., Ltd. | Polyvinyl acetal resin composition, adhesive sheet, and method for producing adhesive sheet |
-
1978
- 1978-01-18 JP JP331678A patent/JPS5496541A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62241983A (en) * | 1986-04-14 | 1987-10-22 | Toshiba Chem Corp | Adhesive for copper foil |
| EP0392947A2 (en) * | 1989-04-13 | 1990-10-17 | Rhone-Poulenc Chimie | Blockcopolymer polydiorganosiloxane-thiuramdisulfide; process for its preparation and its use in the polymerisation of vinyl monomers |
| JPH09176606A (en) * | 1995-12-22 | 1997-07-08 | Sumitomo Bakelite Co Ltd | Adhesive for fixing optical part |
| JP2001115115A (en) * | 1999-10-21 | 2001-04-24 | Lintec Corp | Pressure-sensitive adhesive sheet |
| JP2009073970A (en) * | 2007-09-21 | 2009-04-09 | Asahi Glass Co Ltd | Curable resin composition, transparent layered body using the same, and method for manufacturing the layered body |
| JP2010270293A (en) * | 2009-04-23 | 2010-12-02 | Hitachi Chem Co Ltd | Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device each using the same |
| EP3296846A4 (en) * | 2015-05-15 | 2019-02-06 | Sekisui Chemical Co., Ltd. | Interlayer filling material for touch panels, and touch panel laminate |
| WO2017061545A1 (en) * | 2015-10-07 | 2017-04-13 | 積水化学工業株式会社 | Poly(vinyl acetal) resin composition, adhesive sheet, interlaminar filling material for touch panel, and laminate |
| JPWO2017061545A1 (en) * | 2015-10-07 | 2018-07-26 | 積水化学工業株式会社 | Polyvinyl acetal resin composition, adhesive sheet, interlayer filling material for touch panel, and laminate |
| EP3360925A4 (en) * | 2015-10-07 | 2019-04-03 | Sekisui Chemical Co., Ltd. | Polyvinyl acetal resin composition, adhesive sheet, and method for producing adhesive sheet |
| TWI710592B (en) * | 2015-10-07 | 2020-11-21 | 日商積水化學工業股份有限公司 | Polyvinyl acetal resin composition, adhesive sheet and manufacturing method of adhesive sheet |
| US11248149B2 (en) | 2015-10-07 | 2022-02-15 | Sekisui Chemical Co., Ltd. | Polyvinyl acetal resin composition, adhesive sheet, and method for producing adhesive sheet |
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