JPS55118920A - Curable epoxy resin composition - Google Patents

Curable epoxy resin composition

Info

Publication number
JPS55118920A
JPS55118920A JP2561079A JP2561079A JPS55118920A JP S55118920 A JPS55118920 A JP S55118920A JP 2561079 A JP2561079 A JP 2561079A JP 2561079 A JP2561079 A JP 2561079A JP S55118920 A JPS55118920 A JP S55118920A
Authority
JP
Japan
Prior art keywords
component
resin composition
epoxy resin
give
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2561079A
Other languages
Japanese (ja)
Other versions
JPS6139967B2 (en
Inventor
Marenori Miura
Yoshinobu Onuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP2561079A priority Critical patent/JPS55118920A/en
Publication of JPS55118920A publication Critical patent/JPS55118920A/en
Publication of JPS6139967B2 publication Critical patent/JPS6139967B2/ja
Granted legal-status Critical Current

Links

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: A curable epoxy resin composition having improved low-temperature stability, workability, and heat resistance, comprising a specific a bicyclic carboxylic acid anhydride as a curing agent.
CONSTITUTION: A) A polyfunctional epoxy compound is blended with B) 1- isopropyl-4-methyl-bicyclo-(2.2.2)octa-5-ene-2,3-dicarboxyic acid anhydride in an amount to give a theoretical blending quantity of carboxylic acid based on the epoxy group of 50W130wt% as a curing agent to give the desired compound. The component B is obtained by submitting 1,3-p-menthadiene and an equimolar quantity of maleic anhydride to addition reaction. A curing accelerator, preferably an imidazole-based compound (e.g., 1-benzyl-2-methylimidazole) in an amount of 0.1W5.0pts.wt. based on 100pts.wt. of the component A, is added to the component B.
USE: Cast materials, putty, impregnating materials, coating compounds, etc.
COPYRIGHT: (C)1980,JPO&Japio
JP2561079A 1979-03-07 1979-03-07 Curable epoxy resin composition Granted JPS55118920A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2561079A JPS55118920A (en) 1979-03-07 1979-03-07 Curable epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2561079A JPS55118920A (en) 1979-03-07 1979-03-07 Curable epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS55118920A true JPS55118920A (en) 1980-09-12
JPS6139967B2 JPS6139967B2 (en) 1986-09-06

Family

ID=12170653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2561079A Granted JPS55118920A (en) 1979-03-07 1979-03-07 Curable epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS55118920A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006022195A (en) * 2004-07-07 2006-01-26 Sekisui Chem Co Ltd Curable resin composition, adhesive epoxy resin sheet an circuit board joint product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006022195A (en) * 2004-07-07 2006-01-26 Sekisui Chem Co Ltd Curable resin composition, adhesive epoxy resin sheet an circuit board joint product

Also Published As

Publication number Publication date
JPS6139967B2 (en) 1986-09-06

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