JPS55118920A - Curable epoxy resin composition - Google Patents
Curable epoxy resin compositionInfo
- Publication number
- JPS55118920A JPS55118920A JP2561079A JP2561079A JPS55118920A JP S55118920 A JPS55118920 A JP S55118920A JP 2561079 A JP2561079 A JP 2561079A JP 2561079 A JP2561079 A JP 2561079A JP S55118920 A JPS55118920 A JP S55118920A
- Authority
- JP
- Japan
- Prior art keywords
- component
- resin composition
- epoxy resin
- give
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: A curable epoxy resin composition having improved low-temperature stability, workability, and heat resistance, comprising a specific a bicyclic carboxylic acid anhydride as a curing agent.
CONSTITUTION: A) A polyfunctional epoxy compound is blended with B) 1- isopropyl-4-methyl-bicyclo-(2.2.2)octa-5-ene-2,3-dicarboxyic acid anhydride in an amount to give a theoretical blending quantity of carboxylic acid based on the epoxy group of 50W130wt% as a curing agent to give the desired compound. The component B is obtained by submitting 1,3-p-menthadiene and an equimolar quantity of maleic anhydride to addition reaction. A curing accelerator, preferably an imidazole-based compound (e.g., 1-benzyl-2-methylimidazole) in an amount of 0.1W5.0pts.wt. based on 100pts.wt. of the component A, is added to the component B.
USE: Cast materials, putty, impregnating materials, coating compounds, etc.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2561079A JPS55118920A (en) | 1979-03-07 | 1979-03-07 | Curable epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2561079A JPS55118920A (en) | 1979-03-07 | 1979-03-07 | Curable epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55118920A true JPS55118920A (en) | 1980-09-12 |
JPS6139967B2 JPS6139967B2 (en) | 1986-09-06 |
Family
ID=12170653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2561079A Granted JPS55118920A (en) | 1979-03-07 | 1979-03-07 | Curable epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55118920A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006022195A (en) * | 2004-07-07 | 2006-01-26 | Sekisui Chem Co Ltd | Curable resin composition, adhesive epoxy resin sheet an circuit board joint product |
-
1979
- 1979-03-07 JP JP2561079A patent/JPS55118920A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006022195A (en) * | 2004-07-07 | 2006-01-26 | Sekisui Chem Co Ltd | Curable resin composition, adhesive epoxy resin sheet an circuit board joint product |
Also Published As
Publication number | Publication date |
---|---|
JPS6139967B2 (en) | 1986-09-06 |
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