JPS5575469A - Adhesive - Google Patents
AdhesiveInfo
- Publication number
- JPS5575469A JPS5575469A JP14777278A JP14777278A JPS5575469A JP S5575469 A JPS5575469 A JP S5575469A JP 14777278 A JP14777278 A JP 14777278A JP 14777278 A JP14777278 A JP 14777278A JP S5575469 A JPS5575469 A JP S5575469A
- Authority
- JP
- Japan
- Prior art keywords
- cpd
- schiff
- epoxy resin
- base
- ketone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To provide a structural adhesive having a good shelf life by mixing a polyamide (and/or polyester) with a molten mixture of an epoxy resin solid at room temperature and an aminosilane cpd. which has been transformed into a Schiff's base by a ketone cpd.
CONSTITUTION: A silane cpd. having amino gp. such as γ-aminopropyltrimethoxysilane and a ketone cpd. such as methyl ethyl ketone are subjected to dehydrating condensation to from a Schiff's base. About 1W40pts.wt. of the above Schiff's base is compounded with 100pts.wt. of an epoxy resin solid room temperature (25°C) (such as bisphenol A type epoxy resin) and then melted. About 5W100pts. wt. of the above molten mixt. is mixed with 100pts.wt. of a polyamide such as nylon 11, nylon 12, etc. and/or linear plastic polyester to form an adhesive.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14777278A JPS5575469A (en) | 1978-12-01 | 1978-12-01 | Adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14777278A JPS5575469A (en) | 1978-12-01 | 1978-12-01 | Adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5575469A true JPS5575469A (en) | 1980-06-06 |
JPS5711582B2 JPS5711582B2 (en) | 1982-03-05 |
Family
ID=15437823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14777278A Granted JPS5575469A (en) | 1978-12-01 | 1978-12-01 | Adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5575469A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05247065A (en) * | 1992-03-05 | 1993-09-24 | Shin Etsu Chem Co Ltd | Organic silicon compound and its production |
US6197882B1 (en) | 1998-07-30 | 2001-03-06 | Shin-Etsu Chemical Co., Ltd. | Curable resin composition and adhesive |
US6525159B1 (en) | 1997-01-21 | 2003-02-25 | The Yokohama Rubber Co., Ltd. | One-pack cold moisture curable resin compositions |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0275696U (en) * | 1988-11-28 | 1990-06-11 |
-
1978
- 1978-12-01 JP JP14777278A patent/JPS5575469A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05247065A (en) * | 1992-03-05 | 1993-09-24 | Shin Etsu Chem Co Ltd | Organic silicon compound and its production |
US6525159B1 (en) | 1997-01-21 | 2003-02-25 | The Yokohama Rubber Co., Ltd. | One-pack cold moisture curable resin compositions |
US6756466B2 (en) | 1997-01-21 | 2004-06-29 | The Yokohama Rubber Co., Ltd. | One-part, room temperature moisture curable resin composition |
US6936676B2 (en) | 1997-01-21 | 2005-08-30 | Yokohama Rubber Co., Ltd. | One-part, room temperature moisture curable resin composition |
US6197882B1 (en) | 1998-07-30 | 2001-03-06 | Shin-Etsu Chemical Co., Ltd. | Curable resin composition and adhesive |
Also Published As
Publication number | Publication date |
---|---|
JPS5711582B2 (en) | 1982-03-05 |
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