JPS54148897A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS54148897A
JPS54148897A JP5661878A JP5661878A JPS54148897A JP S54148897 A JPS54148897 A JP S54148897A JP 5661878 A JP5661878 A JP 5661878A JP 5661878 A JP5661878 A JP 5661878A JP S54148897 A JPS54148897 A JP S54148897A
Authority
JP
Japan
Prior art keywords
epoxy resin
curing agent
hexamethylenediamine
reaction product
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5661878A
Other languages
Japanese (ja)
Inventor
Isao Shinozuka
Hiroshi Kawamoto
Sumitoshi Fujikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP5661878A priority Critical patent/JPS54148897A/en
Publication of JPS54148897A publication Critical patent/JPS54148897A/en
Pending legal-status Critical Current

Links

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: A composition capable of forming a cured material of an epoxy resin having improved workability and physical properties, obtained by using an reaction product of hexamethylenediamine and a specific organic compound as a curing agent.
CONSTITUTION: 100 parts by wt. of an epoxy resin having two or more epoxy groups in a molecule is blended with 1W150 parts by wt. of a curing agent consisting of a reaction product of A) 1 mole of hexamethylenediamine with B) 0.1W3 moles of a nonaromatic vinyl compound having one or more functional groups, thiourea, and a compound having an iso(thio)cyanate group (except aromatic diisocyanate) to give the desired composition.
EFFECT: The curing agent has low toxicity and high curing rate and capable of forming a cured material having improved bond strength and chemical resistance.
COPYRIGHT: (C)1979,JPO&Japio
JP5661878A 1978-05-15 1978-05-15 Epoxy resin composition Pending JPS54148897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5661878A JPS54148897A (en) 1978-05-15 1978-05-15 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5661878A JPS54148897A (en) 1978-05-15 1978-05-15 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS54148897A true JPS54148897A (en) 1979-11-21

Family

ID=13032249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5661878A Pending JPS54148897A (en) 1978-05-15 1978-05-15 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS54148897A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60181121A (en) * 1984-02-09 1985-09-14 アメリカン・サイアナミド・カンパニー Epoxy resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60181121A (en) * 1984-02-09 1985-09-14 アメリカン・サイアナミド・カンパニー Epoxy resin composition

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