JPS54148899A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS54148899A
JPS54148899A JP5662078A JP5662078A JPS54148899A JP S54148899 A JPS54148899 A JP S54148899A JP 5662078 A JP5662078 A JP 5662078A JP 5662078 A JP5662078 A JP 5662078A JP S54148899 A JPS54148899 A JP S54148899A
Authority
JP
Japan
Prior art keywords
aromatic
curing agent
hexamethylenediamine
nuclei
carboxylic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5662078A
Other languages
Japanese (ja)
Inventor
Shuichi Ishimura
Hideo Yamamura
Hiroshi Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP5662078A priority Critical patent/JPS54148899A/en
Publication of JPS54148899A publication Critical patent/JPS54148899A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: A composition capable of forming a cured material of an epoxy resin having improved workability and physical properties, obtained by using a reaction product of hexamethylenediamine and a specific aromatic compound as a curing agent.
CONSTITUTION: 100 parts by wt. of an epoxy resin having two or more epoxy groups is blended with 1W120 parts by wt. of a curing agent consisting of A) 1 mole of hexamethylenediamine and B) 0.1W3 moles of one or more compounds selected from the group consisting of an aromatic carboxylic acid (or its ester) having one or more functional groups in the side chains or in the nuclei, an aromatic vinyl compound having one or more functional groups in the side chains or in the nuclei, an aromatic diisocynanate, an aromatic carboxylic acid anhydride, e.g., trimellitic acid anhydride, an aromatic diepoxide, e.g, para-bis(epoxyethyl) benzene, and a vinyl compound having a sulfone group, e.g., sulfolene, to give the desired composition.
EFFECT: The curing agent has low toxicity, high curing rate and heat distortion temperature.
COPYRIGHT: (C)1979,JPO&Japio
JP5662078A 1978-05-15 1978-05-15 Resin composition Pending JPS54148899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5662078A JPS54148899A (en) 1978-05-15 1978-05-15 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5662078A JPS54148899A (en) 1978-05-15 1978-05-15 Resin composition

Publications (1)

Publication Number Publication Date
JPS54148899A true JPS54148899A (en) 1979-11-21

Family

ID=13032314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5662078A Pending JPS54148899A (en) 1978-05-15 1978-05-15 Resin composition

Country Status (1)

Country Link
JP (1) JPS54148899A (en)

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