JPS5521461A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS5521461A
JPS5521461A JP9466078A JP9466078A JPS5521461A JP S5521461 A JPS5521461 A JP S5521461A JP 9466078 A JP9466078 A JP 9466078A JP 9466078 A JP9466078 A JP 9466078A JP S5521461 A JPS5521461 A JP S5521461A
Authority
JP
Japan
Prior art keywords
polyamide
resin composition
resin
parts
pref
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9466078A
Other languages
Japanese (ja)
Other versions
JPS579754B2 (en
Inventor
Toshihiko Aya
Yasushi Kubo
Akio Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP9466078A priority Critical patent/JPS5521461A/en
Priority to DE792953006T priority patent/DE2953006T1/en
Priority to GB8010154A priority patent/GB2039931B/en
Priority to US06/189,841 priority patent/US4340697A/en
Priority to PCT/JP1979/000204 priority patent/WO1980000349A1/en
Priority to NLAANVRAGE7920013,A priority patent/NL186454C/en
Publication of JPS5521461A publication Critical patent/JPS5521461A/en
Publication of JPS579754B2 publication Critical patent/JPS579754B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To prepare a resin composition of good balance of melt processing characteristics with mechanical strength, by melt blending of a polyphenylenesulfide resin with a polyamide-imide resin consisting mainly of a specific recurring structural unit in a specific proportion.
CONSTITUTION: The objective resin composition can be prepared by melt blending of (A) 50W99.9 parts by wt. of a polyamide-imide resin consisting of (a) pref. 70W 100 mole% of a recurring unit of formula I (Ar is a trivalent aromatic group containing one or more six-membered rings, R is a divalent aromatic or aliphatic residue; R' is H, methyl, or phenyl), and (b) pref. less than 30 mole% of a polyamide and/or polyimide unit of formula II or III, with (B) 0.1W50 parts by wt. of a polyphenylenesulfide resin.
EFFECT: Capable of providing molded products having good electrical properties and sliding characteristics, high heat and solvent resistance, etc.
USE: Various parts for automobiles, electrical and electronics application, etc.
COPYRIGHT: (C)1980,JPO&Japio
JP9466078A 1978-08-04 1978-08-04 Resin composition Granted JPS5521461A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP9466078A JPS5521461A (en) 1978-08-04 1978-08-04 Resin composition
DE792953006T DE2953006T1 (en) 1978-08-04 1979-08-02 HEAT-RESISTANT MOLDING RESIN COMPOSITION
GB8010154A GB2039931B (en) 1978-08-04 1979-08-02 Heat resistant molding resin composition
US06/189,841 US4340697A (en) 1978-08-04 1979-08-02 Heat resistant molding resin composition
PCT/JP1979/000204 WO1980000349A1 (en) 1978-08-04 1979-08-02 Heat-resistant molding resin composition
NLAANVRAGE7920013,A NL186454C (en) 1978-08-04 1979-08-02 POLYAMIDE-IMIDE-CONTAINING HEAT-RESISTANT MOLD RESIN COMPOSITION.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9466078A JPS5521461A (en) 1978-08-04 1978-08-04 Resin composition

Publications (2)

Publication Number Publication Date
JPS5521461A true JPS5521461A (en) 1980-02-15
JPS579754B2 JPS579754B2 (en) 1982-02-23

Family

ID=14116399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9466078A Granted JPS5521461A (en) 1978-08-04 1978-08-04 Resin composition

Country Status (1)

Country Link
JP (1) JPS5521461A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195766A (en) * 1981-05-29 1982-12-01 Toray Ind Inc Production of wear-resistant resin composition
JPS59135253A (en) * 1983-01-24 1984-08-03 Toray Ind Inc Polyamide-imide sheet material
JPS60501411A (en) * 1983-05-23 1985-08-29 ゼネラル　エレクトリツク　カンパニイ Polyetherimide-sulfide blend

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136008U (en) * 1983-03-01 1984-09-11 興和特殊工業株式会社 Simple binding tool

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310651A (en) * 1976-06-21 1978-01-31 Fluorocarbon Co Polyalloy of polyphenylene sulfide and polyimide
JPS5369255A (en) * 1976-12-03 1978-06-20 Hodogaya Chem Co Ltd Polyphenylene sulfide resin composition
JPS5373228A (en) * 1976-12-10 1978-06-29 Daikin Ind Ltd Composition for forming heat-resistant coating film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310651A (en) * 1976-06-21 1978-01-31 Fluorocarbon Co Polyalloy of polyphenylene sulfide and polyimide
JPS5369255A (en) * 1976-12-03 1978-06-20 Hodogaya Chem Co Ltd Polyphenylene sulfide resin composition
JPS5373228A (en) * 1976-12-10 1978-06-29 Daikin Ind Ltd Composition for forming heat-resistant coating film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195766A (en) * 1981-05-29 1982-12-01 Toray Ind Inc Production of wear-resistant resin composition
JPS59135253A (en) * 1983-01-24 1984-08-03 Toray Ind Inc Polyamide-imide sheet material
JPS60501411A (en) * 1983-05-23 1985-08-29 ゼネラル　エレクトリツク　カンパニイ Polyetherimide-sulfide blend

Also Published As

Publication number Publication date
JPS579754B2 (en) 1982-02-23

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