JPS57143350A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS57143350A JPS57143350A JP2897381A JP2897381A JPS57143350A JP S57143350 A JPS57143350 A JP S57143350A JP 2897381 A JP2897381 A JP 2897381A JP 2897381 A JP2897381 A JP 2897381A JP S57143350 A JPS57143350 A JP S57143350A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- polybutadiene
- acid anhydride
- type resin
- addition product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: The titled composition capable of providing a cured material useful a coating compound and a molding material, having improved flexing characteristics, adhesiveness at high temperature, adhesivity, etc., obtained by adding a cyanic acid type resin composition to an addition product of 1,2-polybutadiene with an unsaturated acid anhydride.
CONSTITUTION: (A) An addition product of 1,2-polybutadiene with an unsaturated acid anhydride obtained by adding 0.1W1.5mol unsaturated acid anhydride (preferably one shown by the formulaI, etc.) to 100g 1,2-polybutadiene at its unsaturated bond part is blended or preliminarily reacted with (B) a cyanic ester type resin composition consisting of a cyanic ester preferably shown by the formula R(O-C≡N)m (m is 2W5; R is aromatic group) and a maleimide shown by the formula II (R is aromatic group, etc.; X1 and X2 are H, halogen, etc.; 2<m<5) at 100W300°C. For example, 850pts.wt. cyanic ester type resin composition is blended with 150pts.wt. addition product of 1,2-polybutadiene with acid anhydride in a molten state, cured at 175°C under pressure for 120min, and further at 260°C for 60min.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2897381A JPS57143350A (en) | 1981-02-28 | 1981-02-28 | Curable resin composition |
| DE3117903A DE3117903C2 (en) | 1980-05-06 | 1981-05-06 | Curable resin composition |
| US06/260,982 US4403073A (en) | 1980-05-06 | 1981-05-06 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2897381A JPS57143350A (en) | 1981-02-28 | 1981-02-28 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57143350A true JPS57143350A (en) | 1982-09-04 |
| JPH0211629B2 JPH0211629B2 (en) | 1990-03-15 |
Family
ID=12263356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2897381A Granted JPS57143350A (en) | 1980-05-06 | 1981-02-28 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57143350A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018139368A1 (en) * | 2017-01-26 | 2018-08-02 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminated sheet, resin sheet, and printed wiring board |
-
1981
- 1981-02-28 JP JP2897381A patent/JPS57143350A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018139368A1 (en) * | 2017-01-26 | 2018-08-02 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminated sheet, resin sheet, and printed wiring board |
| JPWO2018139368A1 (en) * | 2017-01-26 | 2019-02-07 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| US11166370B2 (en) | 2017-01-26 | 2021-11-02 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0211629B2 (en) | 1990-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS55129266A (en) | Isopropenylphenyl maleimide derivative, its dimer, and their preparation | |
| DE3367247D1 (en) | Coating powder | |
| JPS52139199A (en) | Novel epoxy resin compositions | |
| JPS57143350A (en) | Curable resin composition | |
| JPS5657820A (en) | Curable epoxy resin composition | |
| JPS54142298A (en) | Heat-resistant curable resin composition | |
| JPS56141310A (en) | Curable resin composition | |
| JPS5464597A (en) | Heat resistant epoxy resin composition | |
| JPS5414499A (en) | Heat resistant resin composition | |
| JPS5626849A (en) | P-isopropenylaniline dimer and its preparation | |
| JPS5422498A (en) | Preparation of unsaturated polyester modified with epoxy resin | |
| JPS54148898A (en) | Novel resin composition | |
| JPS54142244A (en) | Adhesive | |
| JPS5414498A (en) | Heat resistant epoxy resin composition | |
| JPS5390397A (en) | Preparation of amidated and esterified alternate copolymer of maleic acid | |
| JPS54162793A (en) | Thermosetting resin composition | |
| JPS56145949A (en) | Novel curable resin composition | |
| JPS562317A (en) | Curing agent for heat-resistant epoxy resin | |
| JPS56163120A (en) | Epoxy resin composition | |
| JPS5468899A (en) | Heat-resistant resin composition | |
| JPS57167324A (en) | Curable resin composition | |
| JPS5486599A (en) | Thermosetting epoxy resin composition | |
| JPS5638318A (en) | Heat-resistant resin composition | |
| JPS557853A (en) | Heat-resistant resin composition | |
| JPS5556118A (en) | Curing of epoxy resin |