JPS56163120A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS56163120A JPS56163120A JP6652480A JP6652480A JPS56163120A JP S56163120 A JPS56163120 A JP S56163120A JP 6652480 A JP6652480 A JP 6652480A JP 6652480 A JP6652480 A JP 6652480A JP S56163120 A JPS56163120 A JP S56163120A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- prepared
- ethylenically unsaturated
- epoxy compound
- reaction product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: A composition having a low elasticity, a low coefficient of expansion, a high Tg and excellent moisture resistance, and being suitable, for example, as a sealing material for semiconductor device, prepared by mixing a polyfunctional epoxy compound, a fluoracarbon resin and a reaction producr between an ethylenically unsaturated dicarboxylic acid anhydride and a plyamine.
CONSTITUTION: Titled composition is prepared by mixisg (A) 100pts.wt. polyfunctional epoxy compound, (B) 5W100pts.wt. reaction product between (i) an ethylenically unsaturated dicarboxylic acid anhydride or its functional derivative, e.g., maleic acid, and (ii) a polyamine, e.g., aromatic diamine, (C) 1W100pts.wt. fluorocarbon resin and , if necessary, (D) an inorganic filler or the like. Reaction product (B) can be obtained by melting and reacting components (i) and (ii) at 90W200°C and a mol ratio of 0.05W0.5:1. The composition is cured by heating to 130W200°C.
USE: Adhesives, paints.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6652480A JPS56163120A (en) | 1980-05-21 | 1980-05-21 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6652480A JPS56163120A (en) | 1980-05-21 | 1980-05-21 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56163120A true JPS56163120A (en) | 1981-12-15 |
Family
ID=13318340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6652480A Pending JPS56163120A (en) | 1980-05-21 | 1980-05-21 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56163120A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4876298A (en) * | 1987-06-03 | 1989-10-24 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
JPH06317905A (en) * | 1993-11-15 | 1994-11-15 | Ibiden Co Ltd | Photosensitive resin composition and printed circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5431500A (en) * | 1977-08-13 | 1979-03-08 | Allied Chem | Packing composition based on anhydride curable epoxy resin |
JPS5512124A (en) * | 1978-07-12 | 1980-01-28 | Hitachi Ltd | Thermosetting resin composition |
-
1980
- 1980-05-21 JP JP6652480A patent/JPS56163120A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5431500A (en) * | 1977-08-13 | 1979-03-08 | Allied Chem | Packing composition based on anhydride curable epoxy resin |
JPS5512124A (en) * | 1978-07-12 | 1980-01-28 | Hitachi Ltd | Thermosetting resin composition |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4876298A (en) * | 1987-06-03 | 1989-10-24 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
JPH06317905A (en) * | 1993-11-15 | 1994-11-15 | Ibiden Co Ltd | Photosensitive resin composition and printed circuit board |
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