JPS5682814A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5682814A JPS5682814A JP15914379A JP15914379A JPS5682814A JP S5682814 A JPS5682814 A JP S5682814A JP 15914379 A JP15914379 A JP 15914379A JP 15914379 A JP15914379 A JP 15914379A JP S5682814 A JPS5682814 A JP S5682814A
- Authority
- JP
- Japan
- Prior art keywords
- reaction product
- epoxy resin
- dicarboxylic acid
- inorganic filler
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: A composition capable of forming a cured material having low elasticity, low coefficient of thermal expansion, and high glass-transition temperature, obtained by blending a polyfunctional epoxy compound with a reaction product of an ethylenic unsaturated dicarboxylic acid anhydride, etc. with polyamide, phenoxy resin, and inorganic filler.
CONSTITUTION: The desired composition consisting of (A) a polyfunctional epoxy compound (preferably a blend of 20W90pts.wt. novolak type epoxy resin and 5W40pts.wt. bisphenol A type epoxy resin), (B) a phenoxy resin shown by the formula (n is about 100) having a molecular weight not less than 10,000 (preferably 1W3pts.wt.), (C) a reaction product (preferably a reaction product obtained by reacting 1mol aromatic diamine with 0.05W0.5mol maleic anhydride in molten state) of an ethylenic unsaturated dicarboxylic acid anhydride (functional derivative) with a polyamine, and (D) an inorganic filler, e.g., zircon, etc. preferably in an amount satisfying the formula 100D/(A+ B+C+D)=40W75vol%.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15914379A JPS5682814A (en) | 1979-12-10 | 1979-12-10 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15914379A JPS5682814A (en) | 1979-12-10 | 1979-12-10 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5682814A true JPS5682814A (en) | 1981-07-06 |
Family
ID=15687184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15914379A Pending JPS5682814A (en) | 1979-12-10 | 1979-12-10 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5682814A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017195304A1 (en) * | 2016-05-11 | 2017-11-16 | 日立化成株式会社 | Liquid resin composition for encapsulation and electronic component/device |
| WO2018105057A1 (en) * | 2016-12-07 | 2018-06-14 | 日立化成株式会社 | Resin composition for sealing, cured product, electronic component device, and method for producing electronic component device |
| JP2020122161A (en) * | 2020-05-07 | 2020-08-13 | 日立化成株式会社 | Liquid resin composition for sealing and electronic component device |
-
1979
- 1979-12-10 JP JP15914379A patent/JPS5682814A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017195304A1 (en) * | 2016-05-11 | 2017-11-16 | 日立化成株式会社 | Liquid resin composition for encapsulation and electronic component/device |
| KR20190008263A (en) * | 2016-05-11 | 2019-01-23 | 히타치가세이가부시끼가이샤 | Sealing liquid resin composition and electronic component device |
| JPWO2017195304A1 (en) * | 2016-05-11 | 2019-03-07 | 日立化成株式会社 | Liquid resin composition for sealing and electronic component device |
| WO2018105057A1 (en) * | 2016-12-07 | 2018-06-14 | 日立化成株式会社 | Resin composition for sealing, cured product, electronic component device, and method for producing electronic component device |
| CN110036070A (en) * | 2016-12-07 | 2019-07-19 | 日立化成株式会社 | The manufacturing method of resin composition for encapsulating, solidfied material, electronic part apparatus and electronic part apparatus |
| JPWO2018105057A1 (en) * | 2016-12-07 | 2019-10-24 | 日立化成株式会社 | Resin composition for sealing, cured product, electronic component device, and method for manufacturing electronic component device |
| JP2020122161A (en) * | 2020-05-07 | 2020-08-13 | 日立化成株式会社 | Liquid resin composition for sealing and electronic component device |
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