JPS56120727A - Resin composition for electrically insulating base plate - Google Patents
Resin composition for electrically insulating base plateInfo
- Publication number
- JPS56120727A JPS56120727A JP14034479A JP14034479A JPS56120727A JP S56120727 A JPS56120727 A JP S56120727A JP 14034479 A JP14034479 A JP 14034479A JP 14034479 A JP14034479 A JP 14034479A JP S56120727 A JPS56120727 A JP S56120727A
- Authority
- JP
- Japan
- Prior art keywords
- equivalent
- epoxy resin
- diaminodiphenylsulfone
- blending
- ingredient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE: The titled composition having improved heat resistance, humidity resistance, and electrical properties, obtained by blending an epoxy resin with diaminodiphenylsulfone as a curing agent and a novolak phenol type resin as a curing accelerator.
CONSTITUTION: (A) An epoxy resin (preferably bisphenol A type epoxy resin having a molecular weight 340W2,000 and epoxy equivalent 170W1,000, etc.) is blended with (B) preferably 0.6W1.0 equivalent based on 1 equivalent ingredient A of diaminodiphenylsulfone as a curing agent and (C) a novolak phenol type resin as a curing accelerator in a ratio of phenolic hydroxyl group per equivalent amino group of ingredient B of preferably 0.03W0.40 equivalent, to give the desired composition. After blending the ingredients A, B, and C, preferably the blend is melted under heating, or dissolved in a solvent, e.g., acetone, methyl ethyl ketone, etc., to give a uniform composition having a melting point 50W120°C.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14034479A JPS56120727A (en) | 1979-10-29 | 1979-10-29 | Resin composition for electrically insulating base plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14034479A JPS56120727A (en) | 1979-10-29 | 1979-10-29 | Resin composition for electrically insulating base plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56120727A true JPS56120727A (en) | 1981-09-22 |
JPS5730851B2 JPS5730851B2 (en) | 1982-07-01 |
Family
ID=15266640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14034479A Granted JPS56120727A (en) | 1979-10-29 | 1979-10-29 | Resin composition for electrically insulating base plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56120727A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5883022A (en) * | 1981-11-13 | 1983-05-18 | Toho Rayon Co Ltd | Epoxy resin composition |
JPS5974119A (en) * | 1982-10-22 | 1984-04-26 | Toshiba Chem Corp | Epoxy resin composition |
DE3508601A1 (en) * | 1985-03-11 | 1986-09-11 | Dynamit Nobel Ag, 5210 Troisdorf | Metal foil having an adhesive-agent coating for base materials for printed circuits, and a method for producing the base material |
JPS6253342A (en) * | 1985-09-03 | 1987-03-09 | Mitsubishi Gas Chem Co Inc | Production of epoxy resin laminate sheet |
JPS62241916A (en) * | 1986-04-14 | 1987-10-22 | Toshiba Chem Corp | Epoxy resin composition |
US20150166728A1 (en) * | 2013-12-13 | 2015-06-18 | Denso Corporation | Curable resin, sealing member, and electronic device product using sealing member |
-
1979
- 1979-10-29 JP JP14034479A patent/JPS56120727A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5883022A (en) * | 1981-11-13 | 1983-05-18 | Toho Rayon Co Ltd | Epoxy resin composition |
JPS624405B2 (en) * | 1981-11-13 | 1987-01-30 | Toho Rayon Kk | |
JPS5974119A (en) * | 1982-10-22 | 1984-04-26 | Toshiba Chem Corp | Epoxy resin composition |
DE3508601A1 (en) * | 1985-03-11 | 1986-09-11 | Dynamit Nobel Ag, 5210 Troisdorf | Metal foil having an adhesive-agent coating for base materials for printed circuits, and a method for producing the base material |
JPS6253342A (en) * | 1985-09-03 | 1987-03-09 | Mitsubishi Gas Chem Co Inc | Production of epoxy resin laminate sheet |
JPH0528253B2 (en) * | 1985-09-03 | 1993-04-23 | Mitsubishi Gas Chemical Co | |
JPS62241916A (en) * | 1986-04-14 | 1987-10-22 | Toshiba Chem Corp | Epoxy resin composition |
US20150166728A1 (en) * | 2013-12-13 | 2015-06-18 | Denso Corporation | Curable resin, sealing member, and electronic device product using sealing member |
Also Published As
Publication number | Publication date |
---|---|
JPS5730851B2 (en) | 1982-07-01 |
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