JPS56120727A - Resin composition for electrically insulating base plate - Google Patents

Resin composition for electrically insulating base plate

Info

Publication number
JPS56120727A
JPS56120727A JP14034479A JP14034479A JPS56120727A JP S56120727 A JPS56120727 A JP S56120727A JP 14034479 A JP14034479 A JP 14034479A JP 14034479 A JP14034479 A JP 14034479A JP S56120727 A JPS56120727 A JP S56120727A
Authority
JP
Japan
Prior art keywords
equivalent
epoxy resin
diaminodiphenylsulfone
blending
ingredient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14034479A
Other languages
Japanese (ja)
Other versions
JPS5730851B2 (en
Inventor
Norio Kawamoto
Kazuhiro Tajiri
Yasufumi Miyake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP14034479A priority Critical patent/JPS56120727A/en
Publication of JPS56120727A publication Critical patent/JPS56120727A/en
Publication of JPS5730851B2 publication Critical patent/JPS5730851B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: The titled composition having improved heat resistance, humidity resistance, and electrical properties, obtained by blending an epoxy resin with diaminodiphenylsulfone as a curing agent and a novolak phenol type resin as a curing accelerator.
CONSTITUTION: (A) An epoxy resin (preferably bisphenol A type epoxy resin having a molecular weight 340W2,000 and epoxy equivalent 170W1,000, etc.) is blended with (B) preferably 0.6W1.0 equivalent based on 1 equivalent ingredient A of diaminodiphenylsulfone as a curing agent and (C) a novolak phenol type resin as a curing accelerator in a ratio of phenolic hydroxyl group per equivalent amino group of ingredient B of preferably 0.03W0.40 equivalent, to give the desired composition. After blending the ingredients A, B, and C, preferably the blend is melted under heating, or dissolved in a solvent, e.g., acetone, methyl ethyl ketone, etc., to give a uniform composition having a melting point 50W120°C.
COPYRIGHT: (C)1981,JPO&Japio
JP14034479A 1979-10-29 1979-10-29 Resin composition for electrically insulating base plate Granted JPS56120727A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14034479A JPS56120727A (en) 1979-10-29 1979-10-29 Resin composition for electrically insulating base plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14034479A JPS56120727A (en) 1979-10-29 1979-10-29 Resin composition for electrically insulating base plate

Publications (2)

Publication Number Publication Date
JPS56120727A true JPS56120727A (en) 1981-09-22
JPS5730851B2 JPS5730851B2 (en) 1982-07-01

Family

ID=15266640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14034479A Granted JPS56120727A (en) 1979-10-29 1979-10-29 Resin composition for electrically insulating base plate

Country Status (1)

Country Link
JP (1) JPS56120727A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883022A (en) * 1981-11-13 1983-05-18 Toho Rayon Co Ltd Epoxy resin composition
JPS5974119A (en) * 1982-10-22 1984-04-26 Toshiba Chem Corp Epoxy resin composition
DE3508601A1 (en) * 1985-03-11 1986-09-11 Dynamit Nobel Ag, 5210 Troisdorf Metal foil having an adhesive-agent coating for base materials for printed circuits, and a method for producing the base material
JPS6253342A (en) * 1985-09-03 1987-03-09 Mitsubishi Gas Chem Co Inc Production of epoxy resin laminate sheet
JPS62241916A (en) * 1986-04-14 1987-10-22 Toshiba Chem Corp Epoxy resin composition
US20150166728A1 (en) * 2013-12-13 2015-06-18 Denso Corporation Curable resin, sealing member, and electronic device product using sealing member

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883022A (en) * 1981-11-13 1983-05-18 Toho Rayon Co Ltd Epoxy resin composition
JPS624405B2 (en) * 1981-11-13 1987-01-30 Toho Rayon Kk
JPS5974119A (en) * 1982-10-22 1984-04-26 Toshiba Chem Corp Epoxy resin composition
DE3508601A1 (en) * 1985-03-11 1986-09-11 Dynamit Nobel Ag, 5210 Troisdorf Metal foil having an adhesive-agent coating for base materials for printed circuits, and a method for producing the base material
JPS6253342A (en) * 1985-09-03 1987-03-09 Mitsubishi Gas Chem Co Inc Production of epoxy resin laminate sheet
JPH0528253B2 (en) * 1985-09-03 1993-04-23 Mitsubishi Gas Chemical Co
JPS62241916A (en) * 1986-04-14 1987-10-22 Toshiba Chem Corp Epoxy resin composition
US20150166728A1 (en) * 2013-12-13 2015-06-18 Denso Corporation Curable resin, sealing member, and electronic device product using sealing member

Also Published As

Publication number Publication date
JPS5730851B2 (en) 1982-07-01

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