JPS5740523A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5740523A
JPS5740523A JP11593880A JP11593880A JPS5740523A JP S5740523 A JPS5740523 A JP S5740523A JP 11593880 A JP11593880 A JP 11593880A JP 11593880 A JP11593880 A JP 11593880A JP S5740523 A JPS5740523 A JP S5740523A
Authority
JP
Japan
Prior art keywords
epoxy resin
compounds
phenolic hydroxy
component
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11593880A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11593880A priority Critical patent/JPS5740523A/en
Publication of JPS5740523A publication Critical patent/JPS5740523A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare the titled composition having excellent high-temperature electrical properties and humidity resistance, and high reliability as electrical insulation material, by compounding an epoxy resin with a curing agent having phenolic hydroxy group and a specific cure accelerator.
CONSTITUTION: The objective composition is prepared by compounding (A) an epoxy resin with (B) a curing agent having two or more phenolic hydroxy groups (e.g. phenol novolak resin) and (C) a cure accelerator selected from organic arsine compounds, organic stibine compounds, and bithmuthine compounds (e.g. tricyclohexyl arsine), and if necessary, (D) an inorganic filler. The ratio of the phenolic hydroxy group in the component (B) to epoxy group is pref. 0.8W1.2, and the amount of the component (C) is pref. 0.1W10wt% of the resin component composed of the components (A) and (B).
COPYRIGHT: (C)1982,JPO&Japio
JP11593880A 1980-08-25 1980-08-25 Epoxy resin composition Pending JPS5740523A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11593880A JPS5740523A (en) 1980-08-25 1980-08-25 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11593880A JPS5740523A (en) 1980-08-25 1980-08-25 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5740523A true JPS5740523A (en) 1982-03-06

Family

ID=14674892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11593880A Pending JPS5740523A (en) 1980-08-25 1980-08-25 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5740523A (en)

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