JPS5723626A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5723626A JPS5723626A JP9691480A JP9691480A JPS5723626A JP S5723626 A JPS5723626 A JP S5723626A JP 9691480 A JP9691480 A JP 9691480A JP 9691480 A JP9691480 A JP 9691480A JP S5723626 A JPS5723626 A JP S5723626A
- Authority
- JP
- Japan
- Prior art keywords
- pref
- epoxy
- compound
- composition
- bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To prepare the titled composition giving a cured product having excellent moisture resistance and high-temperature electrical properties, and suitable as a sealing mold of electrical parts, etc., by using a betaine compound derived from a compound having a π-bond and an organic phosphine as a curing catalyst.
CONSTITUTION: The objective composition is prepared by compounding (A) 100pts.wt. of an epoxy resin (pref. an epoxy-novolak resin having an epoxy equivalent of 170W300) with pref. 0.01-5pts.wt. of a catalyst comprising a betaine-type adduct (e.g. adduct of trichlohexylphosphine and carbon disulfide) which is an addition reaction product (a) a compound having a π-bond (e.g. carbon disulfide) and (b) an organic tert-phosphine. The composition is pref. incorporated with e.g. a phonolic novolak resin (the ratio of the phenolic OH group to the epoxy group is pref. about 0.8W1.2).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9691480A JPS5723626A (en) | 1980-07-17 | 1980-07-17 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9691480A JPS5723626A (en) | 1980-07-17 | 1980-07-17 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5723626A true JPS5723626A (en) | 1982-02-06 |
Family
ID=14177622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9691480A Pending JPS5723626A (en) | 1980-07-17 | 1980-07-17 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5723626A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63152615A (en) * | 1986-08-13 | 1988-06-25 | New Japan Chem Co Ltd | Liquid epoxy resin composition |
JPH06172497A (en) * | 1992-12-10 | 1994-06-21 | Shin Etsu Chem Co Ltd | Production of curing agent for epoxy resin |
-
1980
- 1980-07-17 JP JP9691480A patent/JPS5723626A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63152615A (en) * | 1986-08-13 | 1988-06-25 | New Japan Chem Co Ltd | Liquid epoxy resin composition |
JPH06172497A (en) * | 1992-12-10 | 1994-06-21 | Shin Etsu Chem Co Ltd | Production of curing agent for epoxy resin |
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