JPS5723626A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5723626A
JPS5723626A JP9691480A JP9691480A JPS5723626A JP S5723626 A JPS5723626 A JP S5723626A JP 9691480 A JP9691480 A JP 9691480A JP 9691480 A JP9691480 A JP 9691480A JP S5723626 A JPS5723626 A JP S5723626A
Authority
JP
Japan
Prior art keywords
pref
epoxy
compound
composition
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9691480A
Other languages
Japanese (ja)
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9691480A priority Critical patent/JPS5723626A/en
Publication of JPS5723626A publication Critical patent/JPS5723626A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prepare the titled composition giving a cured product having excellent moisture resistance and high-temperature electrical properties, and suitable as a sealing mold of electrical parts, etc., by using a betaine compound derived from a compound having a π-bond and an organic phosphine as a curing catalyst.
CONSTITUTION: The objective composition is prepared by compounding (A) 100pts.wt. of an epoxy resin (pref. an epoxy-novolak resin having an epoxy equivalent of 170W300) with pref. 0.01-5pts.wt. of a catalyst comprising a betaine-type adduct (e.g. adduct of trichlohexylphosphine and carbon disulfide) which is an addition reaction product (a) a compound having a π-bond (e.g. carbon disulfide) and (b) an organic tert-phosphine. The composition is pref. incorporated with e.g. a phonolic novolak resin (the ratio of the phenolic OH group to the epoxy group is pref. about 0.8W1.2).
COPYRIGHT: (C)1982,JPO&Japio
JP9691480A 1980-07-17 1980-07-17 Epoxy resin composition Pending JPS5723626A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9691480A JPS5723626A (en) 1980-07-17 1980-07-17 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9691480A JPS5723626A (en) 1980-07-17 1980-07-17 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5723626A true JPS5723626A (en) 1982-02-06

Family

ID=14177622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9691480A Pending JPS5723626A (en) 1980-07-17 1980-07-17 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5723626A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63152615A (en) * 1986-08-13 1988-06-25 New Japan Chem Co Ltd Liquid epoxy resin composition
JPH06172497A (en) * 1992-12-10 1994-06-21 Shin Etsu Chem Co Ltd Production of curing agent for epoxy resin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63152615A (en) * 1986-08-13 1988-06-25 New Japan Chem Co Ltd Liquid epoxy resin composition
JPH06172497A (en) * 1992-12-10 1994-06-21 Shin Etsu Chem Co Ltd Production of curing agent for epoxy resin

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