JPS6475556A - Epoxy resin composition for sealing semiconductor - Google Patents
Epoxy resin composition for sealing semiconductorInfo
- Publication number
- JPS6475556A JPS6475556A JP23246687A JP23246687A JPS6475556A JP S6475556 A JPS6475556 A JP S6475556A JP 23246687 A JP23246687 A JP 23246687A JP 23246687 A JP23246687 A JP 23246687A JP S6475556 A JPS6475556 A JP S6475556A
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- butadiene
- pts
- inorganic filler
- positive integer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain the titled composition suppressing stress low without damaging water vapor resistance and heat resistance, by blending a composition consisting of an epoxy polymer, a specific butadiene-based polymer and a phenolic curing agent with a specific amount of an inorganic filler. CONSTITUTION:100pts.wt. novolak type epoxy polymer is blended with (A) 5-30pts.wt. butadiene-based polymer which is shown by the formula (R and R2 are H or hydrocarbon; x and z are positive integer; y is 0 or positive integer and 0<=y/x<=1), has >=5,000mol.wt. and 5-25(KOHmg/g) acid value, (B) 25-75 pts.wt. phenolic curing agent, (C) 0.5-5pts.wt. curing promoter and (D) 0.1-15 pts.wt. coupling agent and further (E) 50-85% based on the total composition of an inorganic filler. Extracted water obtained by extracting the butadiene polymer has <=25muS/cm electric conductivity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23246687A JPS6475556A (en) | 1987-09-18 | 1987-09-18 | Epoxy resin composition for sealing semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23246687A JPS6475556A (en) | 1987-09-18 | 1987-09-18 | Epoxy resin composition for sealing semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6475556A true JPS6475556A (en) | 1989-03-22 |
Family
ID=16939734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23246687A Pending JPS6475556A (en) | 1987-09-18 | 1987-09-18 | Epoxy resin composition for sealing semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6475556A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03101154A (en) * | 1989-09-13 | 1991-04-25 | Toshiba Corp | Multiple-molded semiconductor device and its manufacture |
JP2006137839A (en) * | 2004-11-11 | 2006-06-01 | Fujikura Ltd | Production method of carboxylated acrylonitrile-butadiene rubber with low content of sulfonic acid compound |
US7629398B2 (en) * | 2005-03-16 | 2009-12-08 | Sumitomo Bakelite Company Limited | Composition of epoxy resin, phenol resin and (epoxy resin-) CTBN |
JP2010202687A (en) * | 2009-02-27 | 2010-09-16 | Sumitomo Bakelite Co Ltd | Resin composition, and semiconductor device produced by using the same |
-
1987
- 1987-09-18 JP JP23246687A patent/JPS6475556A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03101154A (en) * | 1989-09-13 | 1991-04-25 | Toshiba Corp | Multiple-molded semiconductor device and its manufacture |
JP2006137839A (en) * | 2004-11-11 | 2006-06-01 | Fujikura Ltd | Production method of carboxylated acrylonitrile-butadiene rubber with low content of sulfonic acid compound |
US7629398B2 (en) * | 2005-03-16 | 2009-12-08 | Sumitomo Bakelite Company Limited | Composition of epoxy resin, phenol resin and (epoxy resin-) CTBN |
US7977412B2 (en) | 2005-03-16 | 2011-07-12 | Sumitomo Bakelite Company, Ltd. | Epoxy resin composition and semiconductor device |
JP2010202687A (en) * | 2009-02-27 | 2010-09-16 | Sumitomo Bakelite Co Ltd | Resin composition, and semiconductor device produced by using the same |
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