JPS6475556A - Epoxy resin composition for sealing semiconductor - Google Patents

Epoxy resin composition for sealing semiconductor

Info

Publication number
JPS6475556A
JPS6475556A JP23246687A JP23246687A JPS6475556A JP S6475556 A JPS6475556 A JP S6475556A JP 23246687 A JP23246687 A JP 23246687A JP 23246687 A JP23246687 A JP 23246687A JP S6475556 A JPS6475556 A JP S6475556A
Authority
JP
Japan
Prior art keywords
polymer
butadiene
pts
inorganic filler
positive integer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23246687A
Other languages
Japanese (ja)
Inventor
Kota Nishii
Azuma Matsuura
Yukio Takigawa
Yoshihiro Nakada
Kazumi Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23246687A priority Critical patent/JPS6475556A/en
Publication of JPS6475556A publication Critical patent/JPS6475556A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the titled composition suppressing stress low without damaging water vapor resistance and heat resistance, by blending a composition consisting of an epoxy polymer, a specific butadiene-based polymer and a phenolic curing agent with a specific amount of an inorganic filler. CONSTITUTION:100pts.wt. novolak type epoxy polymer is blended with (A) 5-30pts.wt. butadiene-based polymer which is shown by the formula (R and R2 are H or hydrocarbon; x and z are positive integer; y is 0 or positive integer and 0<=y/x<=1), has >=5,000mol.wt. and 5-25(KOHmg/g) acid value, (B) 25-75 pts.wt. phenolic curing agent, (C) 0.5-5pts.wt. curing promoter and (D) 0.1-15 pts.wt. coupling agent and further (E) 50-85% based on the total composition of an inorganic filler. Extracted water obtained by extracting the butadiene polymer has <=25muS/cm electric conductivity.
JP23246687A 1987-09-18 1987-09-18 Epoxy resin composition for sealing semiconductor Pending JPS6475556A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23246687A JPS6475556A (en) 1987-09-18 1987-09-18 Epoxy resin composition for sealing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23246687A JPS6475556A (en) 1987-09-18 1987-09-18 Epoxy resin composition for sealing semiconductor

Publications (1)

Publication Number Publication Date
JPS6475556A true JPS6475556A (en) 1989-03-22

Family

ID=16939734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23246687A Pending JPS6475556A (en) 1987-09-18 1987-09-18 Epoxy resin composition for sealing semiconductor

Country Status (1)

Country Link
JP (1) JPS6475556A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03101154A (en) * 1989-09-13 1991-04-25 Toshiba Corp Multiple-molded semiconductor device and its manufacture
JP2006137839A (en) * 2004-11-11 2006-06-01 Fujikura Ltd Production method of carboxylated acrylonitrile-butadiene rubber with low content of sulfonic acid compound
US7629398B2 (en) * 2005-03-16 2009-12-08 Sumitomo Bakelite Company Limited Composition of epoxy resin, phenol resin and (epoxy resin-) CTBN
JP2010202687A (en) * 2009-02-27 2010-09-16 Sumitomo Bakelite Co Ltd Resin composition, and semiconductor device produced by using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03101154A (en) * 1989-09-13 1991-04-25 Toshiba Corp Multiple-molded semiconductor device and its manufacture
JP2006137839A (en) * 2004-11-11 2006-06-01 Fujikura Ltd Production method of carboxylated acrylonitrile-butadiene rubber with low content of sulfonic acid compound
US7629398B2 (en) * 2005-03-16 2009-12-08 Sumitomo Bakelite Company Limited Composition of epoxy resin, phenol resin and (epoxy resin-) CTBN
US7977412B2 (en) 2005-03-16 2011-07-12 Sumitomo Bakelite Company, Ltd. Epoxy resin composition and semiconductor device
JP2010202687A (en) * 2009-02-27 2010-09-16 Sumitomo Bakelite Co Ltd Resin composition, and semiconductor device produced by using the same

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