JPS5738851A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5738851A JPS5738851A JP11253880A JP11253880A JPS5738851A JP S5738851 A JPS5738851 A JP S5738851A JP 11253880 A JP11253880 A JP 11253880A JP 11253880 A JP11253880 A JP 11253880A JP S5738851 A JPS5738851 A JP S5738851A
- Authority
- JP
- Japan
- Prior art keywords
- adduct
- compsn
- 30w70wt
- inorg
- bismaleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To provide the titled compsn. which has excellent heat resistance and processability and is suitable as a molding material, consisting of an aminophenol adduct of bismaleimide, an epoxy compd., a novolak type phenolic resin, and an inorg. filler.
CONSTITUTION: A bismaleimide of formula I (wherein R1 is H, alkyl; R2 is bivalent org. group selected from -O-, -CH2-, -SO2- and -S-S-; R3 is H, halogen) and an aminophenol of formula II (wherein R4 is H, halogen, alkyl) are heated at 130W 140°C with stirring to obtain an adduct having a softening temp. of 100W120°C. 30W70wt% prepolymer obtd. by mixing 90W60wt% above adduct with 10W40wt% epoxy compd., is mixed with 70W30wt% novolak type phenolic resin to obtain a resin compsn. Then 30W70wt% inorg. filler such as silica is blended with 70W 30wt% above compsn.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11253880A JPS5738851A (en) | 1980-08-15 | 1980-08-15 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11253880A JPS5738851A (en) | 1980-08-15 | 1980-08-15 | Thermosetting resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5738851A true JPS5738851A (en) | 1982-03-03 |
JPS6334899B2 JPS6334899B2 (en) | 1988-07-12 |
Family
ID=14589144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11253880A Granted JPS5738851A (en) | 1980-08-15 | 1980-08-15 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5738851A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011078339A1 (en) * | 2009-12-25 | 2011-06-30 | 日立化成工業株式会社 | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate |
JP2011137054A (en) * | 2009-12-25 | 2011-07-14 | Hitachi Chem Co Ltd | Thermosetting resin composition, prepreg using the same, and laminated board |
CN102558505A (en) * | 2006-09-29 | 2012-07-11 | 日立化成工业株式会社 | Thermosetting resin composition and prepreg and laminate obtained with the same |
US8461332B2 (en) | 2006-06-06 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
US20170022353A1 (en) * | 2007-12-25 | 2017-01-26 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition and prepreg and laminate both made with the same |
-
1980
- 1980-08-15 JP JP11253880A patent/JPS5738851A/en active Granted
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8461332B2 (en) | 2006-06-06 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
US8796473B2 (en) | 2006-06-06 | 2014-08-05 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
CN102558505A (en) * | 2006-09-29 | 2012-07-11 | 日立化成工业株式会社 | Thermosetting resin composition and prepreg and laminate obtained with the same |
KR101398731B1 (en) * | 2006-09-29 | 2014-05-27 | 히타치가세이가부시끼가이샤 | Thermosetting resin composition and prepreg and laminate obtained with the same |
US9603244B2 (en) | 2006-09-29 | 2017-03-21 | Hitachi Chemical Company, Ltd | Thermosetting resin composition and prepreg and laminate obtained with the same |
US20170022353A1 (en) * | 2007-12-25 | 2017-01-26 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition and prepreg and laminate both made with the same |
US10604641B2 (en) | 2007-12-25 | 2020-03-31 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition and prepreg and laminate both made with the same |
WO2011078339A1 (en) * | 2009-12-25 | 2011-06-30 | 日立化成工業株式会社 | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate |
JP2011137054A (en) * | 2009-12-25 | 2011-07-14 | Hitachi Chem Co Ltd | Thermosetting resin composition, prepreg using the same, and laminated board |
CN102656234A (en) * | 2009-12-25 | 2012-09-05 | 日立化成工业株式会社 | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate |
US10414943B2 (en) | 2009-12-25 | 2019-09-17 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate |
Also Published As
Publication number | Publication date |
---|---|
JPS6334899B2 (en) | 1988-07-12 |
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