JPS5738851A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5738851A
JPS5738851A JP11253880A JP11253880A JPS5738851A JP S5738851 A JPS5738851 A JP S5738851A JP 11253880 A JP11253880 A JP 11253880A JP 11253880 A JP11253880 A JP 11253880A JP S5738851 A JPS5738851 A JP S5738851A
Authority
JP
Japan
Prior art keywords
adduct
compsn
30w70wt
inorg
bismaleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11253880A
Other languages
Japanese (ja)
Other versions
JPS6334899B2 (en
Inventor
Kiyoji Makino
Kazuyuki Tomonaga
Tsutomu Okawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP11253880A priority Critical patent/JPS5738851A/en
Publication of JPS5738851A publication Critical patent/JPS5738851A/en
Publication of JPS6334899B2 publication Critical patent/JPS6334899B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide the titled compsn. which has excellent heat resistance and processability and is suitable as a molding material, consisting of an aminophenol adduct of bismaleimide, an epoxy compd., a novolak type phenolic resin, and an inorg. filler.
CONSTITUTION: A bismaleimide of formula I (wherein R1 is H, alkyl; R2 is bivalent org. group selected from -O-, -CH2-, -SO2- and -S-S-; R3 is H, halogen) and an aminophenol of formula II (wherein R4 is H, halogen, alkyl) are heated at 130W 140°C with stirring to obtain an adduct having a softening temp. of 100W120°C. 30W70wt% prepolymer obtd. by mixing 90W60wt% above adduct with 10W40wt% epoxy compd., is mixed with 70W30wt% novolak type phenolic resin to obtain a resin compsn. Then 30W70wt% inorg. filler such as silica is blended with 70W 30wt% above compsn.
COPYRIGHT: (C)1982,JPO&Japio
JP11253880A 1980-08-15 1980-08-15 Thermosetting resin composition Granted JPS5738851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11253880A JPS5738851A (en) 1980-08-15 1980-08-15 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11253880A JPS5738851A (en) 1980-08-15 1980-08-15 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS5738851A true JPS5738851A (en) 1982-03-03
JPS6334899B2 JPS6334899B2 (en) 1988-07-12

Family

ID=14589144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11253880A Granted JPS5738851A (en) 1980-08-15 1980-08-15 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5738851A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011078339A1 (en) * 2009-12-25 2011-06-30 日立化成工業株式会社 Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
JP2011137054A (en) * 2009-12-25 2011-07-14 Hitachi Chem Co Ltd Thermosetting resin composition, prepreg using the same, and laminated board
CN102558505A (en) * 2006-09-29 2012-07-11 日立化成工业株式会社 Thermosetting resin composition and prepreg and laminate obtained with the same
US8461332B2 (en) 2006-06-06 2013-06-11 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
US20170022353A1 (en) * 2007-12-25 2017-01-26 Hitachi Chemical Company, Ltd. Thermosetting resin composition and prepreg and laminate both made with the same

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8461332B2 (en) 2006-06-06 2013-06-11 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
US8796473B2 (en) 2006-06-06 2014-08-05 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
CN102558505A (en) * 2006-09-29 2012-07-11 日立化成工业株式会社 Thermosetting resin composition and prepreg and laminate obtained with the same
KR101398731B1 (en) * 2006-09-29 2014-05-27 히타치가세이가부시끼가이샤 Thermosetting resin composition and prepreg and laminate obtained with the same
US9603244B2 (en) 2006-09-29 2017-03-21 Hitachi Chemical Company, Ltd Thermosetting resin composition and prepreg and laminate obtained with the same
US20170022353A1 (en) * 2007-12-25 2017-01-26 Hitachi Chemical Company, Ltd. Thermosetting resin composition and prepreg and laminate both made with the same
US10604641B2 (en) 2007-12-25 2020-03-31 Hitachi Chemical Company, Ltd. Thermosetting resin composition and prepreg and laminate both made with the same
WO2011078339A1 (en) * 2009-12-25 2011-06-30 日立化成工業株式会社 Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
JP2011137054A (en) * 2009-12-25 2011-07-14 Hitachi Chem Co Ltd Thermosetting resin composition, prepreg using the same, and laminated board
CN102656234A (en) * 2009-12-25 2012-09-05 日立化成工业株式会社 Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
US10414943B2 (en) 2009-12-25 2019-09-17 Hitachi Chemical Company, Ltd. Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Also Published As

Publication number Publication date
JPS6334899B2 (en) 1988-07-12

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