JPS56112923A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS56112923A
JPS56112923A JP1574680A JP1574680A JPS56112923A JP S56112923 A JPS56112923 A JP S56112923A JP 1574680 A JP1574680 A JP 1574680A JP 1574680 A JP1574680 A JP 1574680A JP S56112923 A JPS56112923 A JP S56112923A
Authority
JP
Japan
Prior art keywords
acid ester
polyfunctional
anhydride
cyanic acid
curing agents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1574680A
Other languages
Japanese (ja)
Other versions
JPS6248683B2 (en
Inventor
Morio Take
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP1574680A priority Critical patent/JPS56112923A/en
Publication of JPS56112923A publication Critical patent/JPS56112923A/en
Publication of JPS6248683B2 publication Critical patent/JPS6248683B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To provide the titled resin compsn. having excellent adhesiveness, heat resistance, impact resistance, etc. and suitable for use in paints, building materials, etc., by blending an acid anhydride and a (modified) polyfunctional cyanic acid ester in combination as curing agents with an epoxy resin.
CONSTITUTION: An acid anhydride (A) (e.g. phthalic anhydride or benzoic anhydride) and a polyfunctional cyanic acid ester (e.g. 1,3-dicyanatobenzene or 1,3,5- tricyanatobenzene), or a prepolymer thereof, or a polyfunctional cyanic acid ester modified by a polyfunctional maleimide [e.g. a compd. of the formula (wherein R7 is bivalent or trivalent arom. or aliph. org. group; X1, X2 are each H, halogen, alkyl; q is 2W3)] or a mixt. thereof (B) as curing agents, are blended with an expoxy resin to obtain the desired compsn.
COPYRIGHT: (C)1981,JPO&Japio
JP1574680A 1980-02-12 1980-02-12 Curable resin composition Granted JPS56112923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1574680A JPS56112923A (en) 1980-02-12 1980-02-12 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1574680A JPS56112923A (en) 1980-02-12 1980-02-12 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS56112923A true JPS56112923A (en) 1981-09-05
JPS6248683B2 JPS6248683B2 (en) 1987-10-15

Family

ID=11897322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1574680A Granted JPS56112923A (en) 1980-02-12 1980-02-12 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS56112923A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336246A (en) * 1999-05-26 2000-12-05 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP2000336245A (en) * 1999-05-26 2000-12-05 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP2002317085A (en) * 2001-01-30 2002-10-31 Hitachi Chem Co Ltd Thermosetting resin composition and use thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01134385U (en) * 1988-03-08 1989-09-13
JPH08106966A (en) * 1994-10-05 1996-04-23 Daiichi Denso Buhin Kk Installing constituent body of connecting tool
SG11201700803VA (en) * 2015-02-03 2017-03-30 Mitsubishi Gas Chemical Co Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336246A (en) * 1999-05-26 2000-12-05 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP2000336245A (en) * 1999-05-26 2000-12-05 Matsushita Electric Works Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP2002317085A (en) * 2001-01-30 2002-10-31 Hitachi Chem Co Ltd Thermosetting resin composition and use thereof

Also Published As

Publication number Publication date
JPS6248683B2 (en) 1987-10-15

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