JPS57167324A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS57167324A
JPS57167324A JP5300681A JP5300681A JPS57167324A JP S57167324 A JPS57167324 A JP S57167324A JP 5300681 A JP5300681 A JP 5300681A JP 5300681 A JP5300681 A JP 5300681A JP S57167324 A JPS57167324 A JP S57167324A
Authority
JP
Japan
Prior art keywords
aliphatic
maleimide
resin composition
curable resin
hydrocarbon group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5300681A
Other languages
Japanese (ja)
Inventor
Masayuki Oba
Hikotada Tsuboi
Nobushi Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP5300681A priority Critical patent/JPS57167324A/en
Publication of JPS57167324A publication Critical patent/JPS57167324A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: A curable resin composition capable of providing cured products having excellent heat resistance and flexibility, prepared by mixing an aliphatic maleimide with an aliphatic amino compound.
CONSTITUTION: A resin composition comprising an aliphatic maleimide represented by formulaI, wherein R1 is H, a 1W20C hydrocarbon group, a halogen atom, (R2)OC-, (R2)OCNH-, OH, cyano or nitro, (R2 is a 1W20C hydrocarbon group or its halogen-substituted group), Q is an l-valent aliphatic ether group and l>1, and an aliphatic amino compound represented by formula II. When a maleimide compound represented by formula III is added to the above composition, the mechanical strength, thermal degradation resistance, bonding strength and electrical properties are further improved because of a synergistic effect resulting from the interaction among the maleimide compound, the aliphatic amine and the aliphatic maleimide.
COPYRIGHT: (C)1982,JPO&Japio
JP5300681A 1981-04-10 1981-04-10 Curable resin composition Pending JPS57167324A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5300681A JPS57167324A (en) 1981-04-10 1981-04-10 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5300681A JPS57167324A (en) 1981-04-10 1981-04-10 Curable resin composition

Publications (1)

Publication Number Publication Date
JPS57167324A true JPS57167324A (en) 1982-10-15

Family

ID=12930820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5300681A Pending JPS57167324A (en) 1981-04-10 1981-04-10 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS57167324A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016204639A (en) * 2015-04-17 2016-12-08 日立化成株式会社 Resin composition, laminate and multilayer printed board
JP2021109941A (en) * 2020-01-15 2021-08-02 信越化学工業株式会社 Low dielectric resin composition
US11286346B2 (en) 2015-01-13 2022-03-29 Showa Denko Materials Co., Ltd. Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11286346B2 (en) 2015-01-13 2022-03-29 Showa Denko Materials Co., Ltd. Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
JP2016204639A (en) * 2015-04-17 2016-12-08 日立化成株式会社 Resin composition, laminate and multilayer printed board
JP2021109941A (en) * 2020-01-15 2021-08-02 信越化学工業株式会社 Low dielectric resin composition

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