JPS57167324A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS57167324A JPS57167324A JP5300681A JP5300681A JPS57167324A JP S57167324 A JPS57167324 A JP S57167324A JP 5300681 A JP5300681 A JP 5300681A JP 5300681 A JP5300681 A JP 5300681A JP S57167324 A JPS57167324 A JP S57167324A
- Authority
- JP
- Japan
- Prior art keywords
- aliphatic
- maleimide
- resin composition
- curable resin
- hydrocarbon group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE: A curable resin composition capable of providing cured products having excellent heat resistance and flexibility, prepared by mixing an aliphatic maleimide with an aliphatic amino compound.
CONSTITUTION: A resin composition comprising an aliphatic maleimide represented by formulaI, wherein R1 is H, a 1W20C hydrocarbon group, a halogen atom, (R2)OC-, (R2)OCNH-, OH, cyano or nitro, (R2 is a 1W20C hydrocarbon group or its halogen-substituted group), Q is an l-valent aliphatic ether group and l>1, and an aliphatic amino compound represented by formula II. When a maleimide compound represented by formula III is added to the above composition, the mechanical strength, thermal degradation resistance, bonding strength and electrical properties are further improved because of a synergistic effect resulting from the interaction among the maleimide compound, the aliphatic amine and the aliphatic maleimide.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5300681A JPS57167324A (en) | 1981-04-10 | 1981-04-10 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5300681A JPS57167324A (en) | 1981-04-10 | 1981-04-10 | Curable resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57167324A true JPS57167324A (en) | 1982-10-15 |
Family
ID=12930820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5300681A Pending JPS57167324A (en) | 1981-04-10 | 1981-04-10 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57167324A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016204639A (en) * | 2015-04-17 | 2016-12-08 | 日立化成株式会社 | Resin composition, laminate and multilayer printed board |
JP2021109941A (en) * | 2020-01-15 | 2021-08-02 | 信越化学工業株式会社 | Low dielectric resin composition |
US11286346B2 (en) | 2015-01-13 | 2022-03-29 | Showa Denko Materials Co., Ltd. | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
-
1981
- 1981-04-10 JP JP5300681A patent/JPS57167324A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11286346B2 (en) | 2015-01-13 | 2022-03-29 | Showa Denko Materials Co., Ltd. | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
JP2016204639A (en) * | 2015-04-17 | 2016-12-08 | 日立化成株式会社 | Resin composition, laminate and multilayer printed board |
JP2021109941A (en) * | 2020-01-15 | 2021-08-02 | 信越化学工業株式会社 | Low dielectric resin composition |
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