JPS55135155A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS55135155A
JPS55135155A JP4156579A JP4156579A JPS55135155A JP S55135155 A JPS55135155 A JP S55135155A JP 4156579 A JP4156579 A JP 4156579A JP 4156579 A JP4156579 A JP 4156579A JP S55135155 A JPS55135155 A JP S55135155A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
aluminum
formula
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4156579A
Other languages
Japanese (ja)
Inventor
Ichirou Ichikawa
Koki Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP4156579A priority Critical patent/JPS55135155A/en
Publication of JPS55135155A publication Critical patent/JPS55135155A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin composition which provides cured products having excellent mechanical properties, electrical properties, thermal properties and resistance to SF6 decomposition gas, comprising an epoxy resin, a curing agent, an alumina filler and a specific coupling agent.
CONSTITUTION: To (A) 100pts.wt. of an epoxy resin are added (B) a curing agent such as phthalic anhydride or methylnadic anhydride (C) 100W600pts.wt. of an alumina filler having a particle diameter of below 50μ and (D) 0.1W10pts.wt. of at least one aluminum chelate, as a coupling agent, selected from the group consisting of (ethyl acetoacetate) aluminum diisopropylate represented by formula I and aluminum tris(ethyl acetoacetate) represented by formula II.
COPYRIGHT: (C)1980,JPO&Japio
JP4156579A 1979-04-07 1979-04-07 Epoxy resin composition Pending JPS55135155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4156579A JPS55135155A (en) 1979-04-07 1979-04-07 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4156579A JPS55135155A (en) 1979-04-07 1979-04-07 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS55135155A true JPS55135155A (en) 1980-10-21

Family

ID=12611958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4156579A Pending JPS55135155A (en) 1979-04-07 1979-04-07 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS55135155A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074599A (en) * 1983-09-30 1985-04-26 株式会社日立製作所 Printed circuit board and method of producing same
JP2008106181A (en) * 2006-10-26 2008-05-08 Matsushita Electric Works Ltd Epoxy resin composition and semiconductor device
JP2014098055A (en) * 2012-11-13 2014-05-29 Sumitomo Bakelite Co Ltd Composition for forming insulating layer, film for forming insulating layer, and substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53145863A (en) * 1977-05-26 1978-12-19 Mitsubishi Electric Corp Epoxy resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53145863A (en) * 1977-05-26 1978-12-19 Mitsubishi Electric Corp Epoxy resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074599A (en) * 1983-09-30 1985-04-26 株式会社日立製作所 Printed circuit board and method of producing same
JP2008106181A (en) * 2006-10-26 2008-05-08 Matsushita Electric Works Ltd Epoxy resin composition and semiconductor device
JP2014098055A (en) * 2012-11-13 2014-05-29 Sumitomo Bakelite Co Ltd Composition for forming insulating layer, film for forming insulating layer, and substrate

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