JPS572317A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS572317A
JPS572317A JP7689180A JP7689180A JPS572317A JP S572317 A JPS572317 A JP S572317A JP 7689180 A JP7689180 A JP 7689180A JP 7689180 A JP7689180 A JP 7689180A JP S572317 A JPS572317 A JP S572317A
Authority
JP
Japan
Prior art keywords
organic group
integer
expressed
formula
functional organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7689180A
Other languages
Japanese (ja)
Other versions
JPH029051B2 (en
Inventor
Kazuyuki Tomonaga
Kiyoji Makino
Tsutomu Okawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP7689180A priority Critical patent/JPS572317A/en
Publication of JPS572317A publication Critical patent/JPS572317A/en
Publication of JPH029051B2 publication Critical patent/JPH029051B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: The titled composition, containing unsaturated polyamide-imide resin obtained by reacting three specific compounds and a polymaleimide, and having improved mechanical characteristics, processability and good heat resistance.
CONSTITUTION: A composition prepared by incorporating (A) 100pts.wt. polymaleimide expressed by formula I (R1 is n-functional organic group; x1 and x2 are H, halogen or monofunctional organic group; n is an integer ≥2), e.g. ethylenedimaleimide, with (B) preferably 25W300pts.wt. unsaturated polyamide-imide resin obtained by reacting (i) a polyisocyanate expressed by formula II (R2 is m-functional organic group; m is an integer ≥2), e.g. 1,5-naphthalene diisocyanate, with (ii) a polycarboxylic acid expressed by formula III (R3 is p-functional organic group containing -C=C-; p is an integer ≥2), e.g. maleic acid, and (iii) trimellitic anhydride.
COPYRIGHT: (C)1982,JPO&Japio
JP7689180A 1980-06-07 1980-06-07 Thermosetting resin composition Granted JPS572317A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7689180A JPS572317A (en) 1980-06-07 1980-06-07 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7689180A JPS572317A (en) 1980-06-07 1980-06-07 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS572317A true JPS572317A (en) 1982-01-07
JPH029051B2 JPH029051B2 (en) 1990-02-28

Family

ID=13618258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7689180A Granted JPS572317A (en) 1980-06-07 1980-06-07 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS572317A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5439986A (en) * 1992-08-03 1995-08-08 Showa Highpolymer Co., Ltd. Thermo-curable resin composition, and a method for producing a copper-clad laminate using same
JP2016098378A (en) * 2014-11-21 2016-05-30 財團法人工業技術研究院Ｉｎｄｕｓｔｒｉａｌ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Resin compound, resin polymer and composite material containing the resin polymer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837246A (en) * 1971-09-16 1973-06-01
JPS52994A (en) * 1975-06-19 1977-01-06 Ciba Geigy Ag Imide grouppcontaining crosslinked polymer and preparation thereof
JPS5489623A (en) * 1977-12-27 1979-07-16 Asahi Chemical Ind Heat resistant photoresist composition and production thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837246A (en) * 1971-09-16 1973-06-01
JPS52994A (en) * 1975-06-19 1977-01-06 Ciba Geigy Ag Imide grouppcontaining crosslinked polymer and preparation thereof
JPS5489623A (en) * 1977-12-27 1979-07-16 Asahi Chemical Ind Heat resistant photoresist composition and production thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5439986A (en) * 1992-08-03 1995-08-08 Showa Highpolymer Co., Ltd. Thermo-curable resin composition, and a method for producing a copper-clad laminate using same
JP2016098378A (en) * 2014-11-21 2016-05-30 財團法人工業技術研究院Ｉｎｄｕｓｔｒｉａｌ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Resin compound, resin polymer and composite material containing the resin polymer
US9708437B2 (en) 2014-11-21 2017-07-18 Industrial Technology Research Institute Resin formulations, resin polymers and composite materials comprising the resin polymers

Also Published As

Publication number Publication date
JPH029051B2 (en) 1990-02-28

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