JPS57177050A - Preparation of heat-resistant thermosetting resin - Google Patents
Preparation of heat-resistant thermosetting resinInfo
- Publication number
- JPS57177050A JPS57177050A JP56061381A JP6138181A JPS57177050A JP S57177050 A JPS57177050 A JP S57177050A JP 56061381 A JP56061381 A JP 56061381A JP 6138181 A JP6138181 A JP 6138181A JP S57177050 A JPS57177050 A JP S57177050A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- heat
- polyisocyanate
- polyamine
- anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
PURPOSE: To prepare the titled resin having excellent moldability, solubility in organic solvent, and heat-resistance, and suitable for electrical communication equipment parts, etc., by using a polyamine or a polyisocyanate, and a specific polybasic acid, dibasic acid anhydride and/or monobasic acid as the raw materials.
CONSTITUTION: The titled resin is obtained by reacting (A) a polybasic acid component containing 5-( 2,5-dioxotetrahydrofuryl )-3methyl-3-cyclohexene-1,2-dicarboxylic anhydride of formulaI, (B) a polyamine or a polyisocyanate (preferably an aromatic compound), and (C) a dibasic acid anydride of formula II (R1 is ≥2C bivalent organic group having polymerizable double bond) (e.g. maleic anhydride) and/or a monobasic acid component of formula R2-COX (R2 is ≥2C univalent organic group having polymerizable double bond; X is OH or halogen) (especially acrylic acid, etc.). The amount of the component (B) is 1 equivalent per 1 equivalent of the sum of the components (A) and (C).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56061381A JPS57177050A (en) | 1981-04-24 | 1981-04-24 | Preparation of heat-resistant thermosetting resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56061381A JPS57177050A (en) | 1981-04-24 | 1981-04-24 | Preparation of heat-resistant thermosetting resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57177050A true JPS57177050A (en) | 1982-10-30 |
Family
ID=13169533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56061381A Pending JPS57177050A (en) | 1981-04-24 | 1981-04-24 | Preparation of heat-resistant thermosetting resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57177050A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60223825A (en) * | 1984-04-23 | 1985-11-08 | Agency Of Ind Science & Technol | Prepolymer for fiber-reinforced composite material |
JPS60260624A (en) * | 1984-06-08 | 1985-12-23 | Agency Of Ind Science & Technol | Polyimide prepolymer of excellent moldability |
JP2005036025A (en) * | 2003-07-15 | 2005-02-10 | Hitachi Chem Co Ltd | Polyimide resin composition, film-forming material and electronic part using the same |
-
1981
- 1981-04-24 JP JP56061381A patent/JPS57177050A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60223825A (en) * | 1984-04-23 | 1985-11-08 | Agency Of Ind Science & Technol | Prepolymer for fiber-reinforced composite material |
JPS60260624A (en) * | 1984-06-08 | 1985-12-23 | Agency Of Ind Science & Technol | Polyimide prepolymer of excellent moldability |
JPH0521928B2 (en) * | 1984-06-08 | 1993-03-26 | Kogyo Gijutsuin | |
JP2005036025A (en) * | 2003-07-15 | 2005-02-10 | Hitachi Chem Co Ltd | Polyimide resin composition, film-forming material and electronic part using the same |
JP4534117B2 (en) * | 2003-07-15 | 2010-09-01 | 日立化成工業株式会社 | Polyimide resin, polyimide resin composition, film-forming material using the same, and electronic component |
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