JPS57177050A - Preparation of heat-resistant thermosetting resin - Google Patents

Preparation of heat-resistant thermosetting resin

Info

Publication number
JPS57177050A
JPS57177050A JP56061381A JP6138181A JPS57177050A JP S57177050 A JPS57177050 A JP S57177050A JP 56061381 A JP56061381 A JP 56061381A JP 6138181 A JP6138181 A JP 6138181A JP S57177050 A JPS57177050 A JP S57177050A
Authority
JP
Japan
Prior art keywords
acid
heat
polyisocyanate
polyamine
anhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56061381A
Other languages
Japanese (ja)
Inventor
Toshio Inoue
Motoyasu Kunugiza
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP56061381A priority Critical patent/JPS57177050A/en
Publication of JPS57177050A publication Critical patent/JPS57177050A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polyurethanes Or Polyureas (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE: To prepare the titled resin having excellent moldability, solubility in organic solvent, and heat-resistance, and suitable for electrical communication equipment parts, etc., by using a polyamine or a polyisocyanate, and a specific polybasic acid, dibasic acid anhydride and/or monobasic acid as the raw materials.
CONSTITUTION: The titled resin is obtained by reacting (A) a polybasic acid component containing 5-( 2,5-dioxotetrahydrofuryl )-3methyl-3-cyclohexene-1,2-dicarboxylic anhydride of formulaI, (B) a polyamine or a polyisocyanate (preferably an aromatic compound), and (C) a dibasic acid anydride of formula II (R1 is ≥2C bivalent organic group having polymerizable double bond) (e.g. maleic anhydride) and/or a monobasic acid component of formula R2-COX (R2 is ≥2C univalent organic group having polymerizable double bond; X is OH or halogen) (especially acrylic acid, etc.). The amount of the component (B) is 1 equivalent per 1 equivalent of the sum of the components (A) and (C).
COPYRIGHT: (C)1982,JPO&Japio
JP56061381A 1981-04-24 1981-04-24 Preparation of heat-resistant thermosetting resin Pending JPS57177050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56061381A JPS57177050A (en) 1981-04-24 1981-04-24 Preparation of heat-resistant thermosetting resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56061381A JPS57177050A (en) 1981-04-24 1981-04-24 Preparation of heat-resistant thermosetting resin

Publications (1)

Publication Number Publication Date
JPS57177050A true JPS57177050A (en) 1982-10-30

Family

ID=13169533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56061381A Pending JPS57177050A (en) 1981-04-24 1981-04-24 Preparation of heat-resistant thermosetting resin

Country Status (1)

Country Link
JP (1) JPS57177050A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60223825A (en) * 1984-04-23 1985-11-08 Agency Of Ind Science & Technol Prepolymer for fiber-reinforced composite material
JPS60260624A (en) * 1984-06-08 1985-12-23 Agency Of Ind Science & Technol Polyimide prepolymer of excellent moldability
JP2005036025A (en) * 2003-07-15 2005-02-10 Hitachi Chem Co Ltd Polyimide resin composition, film-forming material and electronic part using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60223825A (en) * 1984-04-23 1985-11-08 Agency Of Ind Science & Technol Prepolymer for fiber-reinforced composite material
JPS60260624A (en) * 1984-06-08 1985-12-23 Agency Of Ind Science & Technol Polyimide prepolymer of excellent moldability
JPH0521928B2 (en) * 1984-06-08 1993-03-26 Kogyo Gijutsuin
JP2005036025A (en) * 2003-07-15 2005-02-10 Hitachi Chem Co Ltd Polyimide resin composition, film-forming material and electronic part using the same
JP4534117B2 (en) * 2003-07-15 2010-09-01 日立化成工業株式会社 Polyimide resin, polyimide resin composition, film-forming material using the same, and electronic component

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