JPS57207609A - Unsaturated polyester resin composition - Google Patents

Unsaturated polyester resin composition

Info

Publication number
JPS57207609A
JPS57207609A JP9272281A JP9272281A JPS57207609A JP S57207609 A JPS57207609 A JP S57207609A JP 9272281 A JP9272281 A JP 9272281A JP 9272281 A JP9272281 A JP 9272281A JP S57207609 A JPS57207609 A JP S57207609A
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
unsaturated
unsaturated polyester
polyester resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9272281A
Other languages
Japanese (ja)
Other versions
JPS6321686B2 (en
Inventor
Hirohiko Kagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP9272281A priority Critical patent/JPS57207609A/en
Publication of JPS57207609A publication Critical patent/JPS57207609A/en
Publication of JPS6321686B2 publication Critical patent/JPS6321686B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: The titled composition, prepared by incorporating an unsaturated polyester resin with a copolymerizable monomer, an unsaturated epoxy resin and plural kinds of curing catalysts having different dcomposition temperatures, and having storability, adhesive property to metallic parts and curability.
CONSTITUTION: A composition obtained by incorporating (A) 100pts.wt. unsaturated polyester resin with (B) preferably 3W100pts.wt. copolymerizable monomer, e.g. styrene, (C) preferably 10W300pts.wt. unsaturated epoxy resin and (D) preferably 1W3pts.wt. two or more catalysts having decomposition temperatures preferably 10W30°C different from one another, e.g. use of "Perbutyl Z " with "Percumyl H " which are organic peroxides. The component (C) is a copolymerizable epoxy resin obtained from an unsaturated carboxylic acid and a bisphenol epoxy resin, and the use of the resin expressed by the formula (n is 0W1) with the resin expressed by the formula (n is 2W10) is preferred.
USE: Molded resin articles for sealing electronic and electrical parts.
COPYRIGHT: (C)1982,JPO&Japio
JP9272281A 1981-06-15 1981-06-15 Unsaturated polyester resin composition Granted JPS57207609A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9272281A JPS57207609A (en) 1981-06-15 1981-06-15 Unsaturated polyester resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9272281A JPS57207609A (en) 1981-06-15 1981-06-15 Unsaturated polyester resin composition

Publications (2)

Publication Number Publication Date
JPS57207609A true JPS57207609A (en) 1982-12-20
JPS6321686B2 JPS6321686B2 (en) 1988-05-09

Family

ID=14062334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9272281A Granted JPS57207609A (en) 1981-06-15 1981-06-15 Unsaturated polyester resin composition

Country Status (1)

Country Link
JP (1) JPS57207609A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62143917A (en) * 1985-12-17 1987-06-27 Nippon Retsuku Kk Resin composition for use in electronic parts sealing
JPS63305177A (en) * 1987-06-08 1988-12-13 Showa Highpolymer Co Ltd Curable resin composition
JPH02500674A (en) * 1986-11-13 1990-03-08 ウパト　ゲーエムベーハー　ウント　コー Method for adhesive mooring of fixation elements in reaction sets, multichamber cartridges and fixation foundations
WO1997023524A1 (en) * 1995-12-22 1997-07-03 Alliedsignal Inc. Thermosetting acrylic materials of high glass transition temperature
JP2012224775A (en) * 2011-04-21 2012-11-15 Panasonic Corp Radically curable resin composition for molding, and resin-molded article

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931787A (en) * 1972-05-25 1974-03-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931787A (en) * 1972-05-25 1974-03-22

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62143917A (en) * 1985-12-17 1987-06-27 Nippon Retsuku Kk Resin composition for use in electronic parts sealing
JPH02500674A (en) * 1986-11-13 1990-03-08 ウパト　ゲーエムベーハー　ウント　コー Method for adhesive mooring of fixation elements in reaction sets, multichamber cartridges and fixation foundations
JPS63305177A (en) * 1987-06-08 1988-12-13 Showa Highpolymer Co Ltd Curable resin composition
WO1997023524A1 (en) * 1995-12-22 1997-07-03 Alliedsignal Inc. Thermosetting acrylic materials of high glass transition temperature
JP2012224775A (en) * 2011-04-21 2012-11-15 Panasonic Corp Radically curable resin composition for molding, and resin-molded article

Also Published As

Publication number Publication date
JPS6321686B2 (en) 1988-05-09

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