JPS5776050A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS5776050A
JPS5776050A JP15226780A JP15226780A JPS5776050A JP S5776050 A JPS5776050 A JP S5776050A JP 15226780 A JP15226780 A JP 15226780A JP 15226780 A JP15226780 A JP 15226780A JP S5776050 A JPS5776050 A JP S5776050A
Authority
JP
Japan
Prior art keywords
monomaleimide
alkyl
heat resistance
phenolic resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15226780A
Other languages
Japanese (ja)
Inventor
Masayuki Oba
Motoo Kawamata
Hikotada Tsuboi
Nobushi Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP15226780A priority Critical patent/JPS5776050A/en
Publication of JPS5776050A publication Critical patent/JPS5776050A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A composition that is made by adding a spacific monomaleimide to a phenolic resin, thus making it unnecessary to use organic solvents, preventing the formation of voids on the products and showing high adhesion with high heat resistance and good thermosetting properties.
CONSTITUTION: A monomaleimide of formulaI(R1 is H, acetyl; R2, R3 are H, halogen, alkyl, alkenyl, hydroxyl, cyano, carboxyl, alkoxy; X, Y are H, halgoen, alkyl, phenyl) is combined with a phenolic resin. The further addition of a polymaleimide of formula II (Z is n-valent polyfunctional organic group, n is 2 or more integer) increases the heat resistance markedly. These components are used not only as a mixture but also as prepolymers after reaction or as a solution in a solvent.
COPYRIGHT: (C)1982,JPO&Japio
JP15226780A 1980-10-31 1980-10-31 Curable resin composition Pending JPS5776050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15226780A JPS5776050A (en) 1980-10-31 1980-10-31 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15226780A JPS5776050A (en) 1980-10-31 1980-10-31 Curable resin composition

Publications (1)

Publication Number Publication Date
JPS5776050A true JPS5776050A (en) 1982-05-12

Family

ID=15536749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15226780A Pending JPS5776050A (en) 1980-10-31 1980-10-31 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS5776050A (en)

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