JPS56109219A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS56109219A
JPS56109219A JP1008380A JP1008380A JPS56109219A JP S56109219 A JPS56109219 A JP S56109219A JP 1008380 A JP1008380 A JP 1008380A JP 1008380 A JP1008380 A JP 1008380A JP S56109219 A JPS56109219 A JP S56109219A
Authority
JP
Japan
Prior art keywords
compound
formula
ether
polyfunctional epoxy
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1008380A
Other languages
Japanese (ja)
Other versions
JPS629250B2 (en
Inventor
Akio Nishikawa
Hiroshi Suzuki
Goro Tanaka
Hisashi Takagame
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1008380A priority Critical patent/JPS56109219A/en
Publication of JPS56109219A publication Critical patent/JPS56109219A/en
Publication of JPS629250B2 publication Critical patent/JPS629250B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: The titled composition with excellent storage stability, convertible into a cured product with excellent high-temperature strength by being heated at a relatively low temperature for a short time, which comprises a specified ether imide compound and a polyfunctional epoxy compound.
CONSTITUTION: 100pts.wt. ether imide compound of formula III, obtained by the reaction of a diamine compound of formula I (wherein R1W4 are H, lower alkyl, lower alkoxy, Cl or Br; R5 and R6 are H, methyl, ethyl, trifluoromethyl or trichloromethyl) having an ether linkage, with an ethylenically unsaturated dicarboxylic acid anhydride of formula II (wherein D is a bivalent 2W24C organic group), are compounded with 10W1,000pts.wt. polyfunctional epoxy compound (e.g., glycidyl ether of bisphenol A).
USE: A molding compound, an impregnating varnish, a paint, an adhesive, etc.
COPYRIGHT: (C)1981,JPO&Japio
JP1008380A 1980-02-01 1980-02-01 Epoxy resin composition Granted JPS56109219A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1008380A JPS56109219A (en) 1980-02-01 1980-02-01 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1008380A JPS56109219A (en) 1980-02-01 1980-02-01 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS56109219A true JPS56109219A (en) 1981-08-29
JPS629250B2 JPS629250B2 (en) 1987-02-27

Family

ID=11740447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1008380A Granted JPS56109219A (en) 1980-02-01 1980-02-01 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS56109219A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03259914A (en) * 1990-03-09 1991-11-20 Hitachi Ltd Resin composition for sealing semiconductor and semiconductor device sealed therewith
JPH1045876A (en) * 1996-05-31 1998-02-17 Mitsui Petrochem Ind Ltd Thermosetting resin composition and prepreg and laminate using the same
JPH10158363A (en) * 1996-11-29 1998-06-16 Mitsui Chem Inc Thermosetting resin composition and prepreg and laminated board produced by using the composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03259914A (en) * 1990-03-09 1991-11-20 Hitachi Ltd Resin composition for sealing semiconductor and semiconductor device sealed therewith
JPH1045876A (en) * 1996-05-31 1998-02-17 Mitsui Petrochem Ind Ltd Thermosetting resin composition and prepreg and laminate using the same
JPH10158363A (en) * 1996-11-29 1998-06-16 Mitsui Chem Inc Thermosetting resin composition and prepreg and laminated board produced by using the composition

Also Published As

Publication number Publication date
JPS629250B2 (en) 1987-02-27

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