JPS572328A - Composition for adhesive - Google Patents
Composition for adhesiveInfo
- Publication number
- JPS572328A JPS572328A JP7591180A JP7591180A JPS572328A JP S572328 A JPS572328 A JP S572328A JP 7591180 A JP7591180 A JP 7591180A JP 7591180 A JP7591180 A JP 7591180A JP S572328 A JPS572328 A JP S572328A
- Authority
- JP
- Japan
- Prior art keywords
- alkyl
- thermosetting resin
- formula
- blending
- halogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: A composition for adhesive especially useful for a structural member of lightweight composite, having improved heat resistance and adhesiveness, obtained by blending a thermosetting resin prepared from four kinds of specific compounds as starting components with a butyral resin in specified ratio.
CONSTITUTION: (A) 95W30wt% Thermosetting resin is blended with (B) 5W 70wt% butyral resin. (A) The thermosetting resin is obtained by blending (i) a dimaleimide compound, e.g., 4,4'-diphenylmethanedimaleimide, etc. shown by the formula I (R1 is H or alkyl; R2 is -O-, -CH2-, -SO2-, -S-S-; R3 is H or halogen) with (ii) aminophenol, e.g., aminocresol, etc. shown by the formula II (R4 is H, halogen, or monofunctional alkyl), (iii) epoxy compound and (iv) imidazole compound, e.g., 2,2-methylimidazole, etc. shown by the formula III (R5WR8 are H or alkyl).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7591180A JPS572328A (en) | 1980-06-05 | 1980-06-05 | Composition for adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7591180A JPS572328A (en) | 1980-06-05 | 1980-06-05 | Composition for adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS572328A true JPS572328A (en) | 1982-01-07 |
JPS648037B2 JPS648037B2 (en) | 1989-02-10 |
Family
ID=13589982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7591180A Granted JPS572328A (en) | 1980-06-05 | 1980-06-05 | Composition for adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS572328A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5941358A (en) * | 1982-08-31 | 1984-03-07 | Toshiba Chem Corp | Composition for heat-resistant adhesive |
JPS60155224A (en) * | 1984-01-24 | 1985-08-15 | Toshiba Chem Corp | Sealing resin composition |
JPS60161423A (en) * | 1984-02-01 | 1985-08-23 | Toshiba Chem Corp | Resin composition for sealing |
WO2007142140A1 (en) * | 2006-06-06 | 2007-12-13 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
JP2010229356A (en) * | 2009-03-27 | 2010-10-14 | Hitachi Chem Co Ltd | Thermosetting insulating resin composition and insulating film with substrate, prepreg, laminated board, and multilayer printed wiring board using the same |
-
1980
- 1980-06-05 JP JP7591180A patent/JPS572328A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5941358A (en) * | 1982-08-31 | 1984-03-07 | Toshiba Chem Corp | Composition for heat-resistant adhesive |
JPS60155224A (en) * | 1984-01-24 | 1985-08-15 | Toshiba Chem Corp | Sealing resin composition |
JPS60161423A (en) * | 1984-02-01 | 1985-08-23 | Toshiba Chem Corp | Resin composition for sealing |
WO2007142140A1 (en) * | 2006-06-06 | 2007-12-13 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
US8461332B2 (en) | 2006-06-06 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
US8796473B2 (en) | 2006-06-06 | 2014-08-05 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
JP2010229356A (en) * | 2009-03-27 | 2010-10-14 | Hitachi Chem Co Ltd | Thermosetting insulating resin composition and insulating film with substrate, prepreg, laminated board, and multilayer printed wiring board using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS648037B2 (en) | 1989-02-10 |
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