JPS572328A - Composition for adhesive - Google Patents

Composition for adhesive

Info

Publication number
JPS572328A
JPS572328A JP7591180A JP7591180A JPS572328A JP S572328 A JPS572328 A JP S572328A JP 7591180 A JP7591180 A JP 7591180A JP 7591180 A JP7591180 A JP 7591180A JP S572328 A JPS572328 A JP S572328A
Authority
JP
Japan
Prior art keywords
alkyl
thermosetting resin
formula
blending
halogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7591180A
Other languages
Japanese (ja)
Other versions
JPS648037B2 (en
Inventor
Tsutomu Okawa
Kazuyuki Tomonaga
Kiyoji Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP7591180A priority Critical patent/JPS572328A/en
Publication of JPS572328A publication Critical patent/JPS572328A/en
Publication of JPS648037B2 publication Critical patent/JPS648037B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: A composition for adhesive especially useful for a structural member of lightweight composite, having improved heat resistance and adhesiveness, obtained by blending a thermosetting resin prepared from four kinds of specific compounds as starting components with a butyral resin in specified ratio.
CONSTITUTION: (A) 95W30wt% Thermosetting resin is blended with (B) 5W 70wt% butyral resin. (A) The thermosetting resin is obtained by blending (i) a dimaleimide compound, e.g., 4,4'-diphenylmethanedimaleimide, etc. shown by the formula I (R1 is H or alkyl; R2 is -O-, -CH2-, -SO2-, -S-S-; R3 is H or halogen) with (ii) aminophenol, e.g., aminocresol, etc. shown by the formula II (R4 is H, halogen, or monofunctional alkyl), (iii) epoxy compound and (iv) imidazole compound, e.g., 2,2-methylimidazole, etc. shown by the formula III (R5WR8 are H or alkyl).
COPYRIGHT: (C)1982,JPO&Japio
JP7591180A 1980-06-05 1980-06-05 Composition for adhesive Granted JPS572328A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7591180A JPS572328A (en) 1980-06-05 1980-06-05 Composition for adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7591180A JPS572328A (en) 1980-06-05 1980-06-05 Composition for adhesive

Publications (2)

Publication Number Publication Date
JPS572328A true JPS572328A (en) 1982-01-07
JPS648037B2 JPS648037B2 (en) 1989-02-10

Family

ID=13589982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7591180A Granted JPS572328A (en) 1980-06-05 1980-06-05 Composition for adhesive

Country Status (1)

Country Link
JP (1) JPS572328A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941358A (en) * 1982-08-31 1984-03-07 Toshiba Chem Corp Composition for heat-resistant adhesive
JPS60155224A (en) * 1984-01-24 1985-08-15 Toshiba Chem Corp Sealing resin composition
JPS60161423A (en) * 1984-02-01 1985-08-23 Toshiba Chem Corp Resin composition for sealing
WO2007142140A1 (en) * 2006-06-06 2007-12-13 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
JP2010229356A (en) * 2009-03-27 2010-10-14 Hitachi Chem Co Ltd Thermosetting insulating resin composition and insulating film with substrate, prepreg, laminated board, and multilayer printed wiring board using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941358A (en) * 1982-08-31 1984-03-07 Toshiba Chem Corp Composition for heat-resistant adhesive
JPS60155224A (en) * 1984-01-24 1985-08-15 Toshiba Chem Corp Sealing resin composition
JPS60161423A (en) * 1984-02-01 1985-08-23 Toshiba Chem Corp Resin composition for sealing
WO2007142140A1 (en) * 2006-06-06 2007-12-13 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
US8461332B2 (en) 2006-06-06 2013-06-11 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
US8796473B2 (en) 2006-06-06 2014-08-05 Hitachi Chemical Company, Ltd. Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate
JP2010229356A (en) * 2009-03-27 2010-10-14 Hitachi Chem Co Ltd Thermosetting insulating resin composition and insulating film with substrate, prepreg, laminated board, and multilayer printed wiring board using the same

Also Published As

Publication number Publication date
JPS648037B2 (en) 1989-02-10

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